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  Solar wafer coating - White paper
USI has developed Nozzle-less
Solar wafer coatingUltrasonic spray technology capable of applying a wide range of materials in very thin, uniform films to improve the efficiency and move towards high-volume photovoltaic manufacturing. Learn more…
Ultrasonic Systems, Inc.
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ATEK Systems Group




mBGA Flux deposition
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mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
Viewpoint Index
January 29, 2008

Bruce S. Moloznik, VP Global Marketing, Cookson Electronics, Alpha

image
Bruce S. Moloznik, VP Global Marketing, Cookson Electronics, Alpha
In 2007, we observed a stabilization of lead-free penetration globally, but at different rates, regionally. We envision a more consistent level of lead-free conversion at current rates going through to 2008.

In 2008 and beyond, we see an increasing trend toward further environmental focus by the industry driven by both increased regulatory pressure globally, in Europe with REACH and China's RoHS, and with key Global OEMs internal corporate "greener" initiatives. This is an area of strength for Alpha products, and we have a very strong suite of Halogen and Halide free SMT soldering materials and industry leading VOC-free wave soldering fluxes.

Although already a strength of our offering, it is also going to be a major focus for our technology development team in 2008.

We will continue to invest in the rapidly expanding Asia-Pacific region and reinforce our position there, particularly around research and development, manufacturing and localized applications support. We opened a new 32,000 sq. ft. R&D facility in Bangalore, India, and have added to our existing facilities, a fully operational applications laboratory in Shanghai.

In the Americas and European regions, we are taking steps to compete in their more competitive manufacturing environments. We will continue to grow our market share in these less robust areas. We are taking major steps to enter high growth markets, such as solar, nano metal technology and package on package semiconductor applications.

Additionally, Cookson Electronics has taken an industry leadership position in dealing with the unprecedented volatility of tin and silver raw material prices. Our goal is to assure that we continue to invest in the development of the high value, enabling technology materials that will help our customers achieve their ever-increasing yield and throughput requirements.

Bruce Moloznik , VP Global Marketing
Cookson Electronics, Alpha

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More Viewpoint Comments Index
March 25, 2008
Phil Vere, Managing Director – Bond Testing, Dage Precision Industries
imageSemiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
February 4, 2008
Peter Biocca, Senior Market Development Engineer, Kester
imageYear 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
February 1, 2008
Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd.
imageThrough-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
January 31, 2008
Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems
imageWe see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
January 30, 2008
John Wood, Systems Engineer, Plasma Etch, Inc.
imageIn our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
More Viewpoint Comments Index


High performance photoresist removers
WLP Photoresist removalEnable through hole vias
This white paper outlines advances for WLP resist stripping based on the globally established HDA technology providing a solution that out performs traditional Solvent/TMAH blends. Download this paper now…
DuPont EKC Technology




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