Stephen Brodeur, Program Director, Printer Division, Milara Inc.
Steve Brodeur, Program Director, Printer Division, Milara Inc.
This past year Milara has introduced two new products to the surface mount and semiconductor industries.First was our new award-winning AWPb 300 fully automated wafer bumping system for the semiconductor market followed by our new SemiTouch STAV system for SMT.
Milara and our new products were well received at this year’s Semicon Shanghai and Taipei along with our appearance at the 2007 APEX show in Los Angeles. We have finalized our internal expansion plans and are heavily embedded into the creation of our new 4,000 sq m facility currently under construction in Europe.We also will be focusing on the production release version of our inline stencil printer targeted for yearend that will boast new innovations in SMT printers.
Milara sees high potential in semiconductor wafer bumping for 300 mm fully automated systems to replace existing 150 and 200 mm systems.Due to the advanced handling requirements of SEMI and our fortuitous development of our AWPb 300 system, we will be ready to meet the production needs and requirements of our clients to transition to the next phase of manufacturing.We also see growth in the wafer printing applications area for those clients looking to move away from traditional wafer bumping techniques.
Milara will be heavily involved in wafer printing applications in 2008. We also will be focusing on volumetric printing applications as we are seeking penetration into BGA substrate printing, which we feel is one of the most stringent and challenging applications we have encountered.
Bringing our new European facility online will also be exciting because we will be one of the first to introduce a “green” solar powered fabrication building using state-of-the-art solar cells from Suntech Power Co., our Chinese partners in construction.
Expect new and even more innovative products from Milara in 2008!
Steve Brodeur, Program Director, Printer Division Milara Inc.
March 25, 2008 Phil Vere, Managing Director – Bond Testing, Dage Precision Industries Semiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ...
February 4, 2008 Peter Biocca, Senior Market Development Engineer, Kester Year 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ...
February 1, 2008 Dr. Aleksej M. Rodin, Via Team Leader, XSiL Ltd. Through-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ...
January 31, 2008 Lyman Brown, Executive Vice President and Chief Operating Officer, BPM Microsystems We see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ...
January 30, 2008 John Wood, Systems Engineer, Plasma Etch, Inc. In our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ...
Semiconductor packaging continues to gravitate toward 3D packaging such as package-in-package (PiP), package-on-package (PoP) and system-in-package (SiP) driven in large part by the growing functionality of handheld products. These 3D packages typically contain more bumped devices as semiconductor suppliers’ move away ... 
Year 2007 saw a global increase in lead-free solder use, mostly SAC. Interest in Kester’s K100LD tin/copper-based solder increased. Industries exempt from RoHS — medical, automotive, and telecom — began looking to lead-free. Kester, under ITW, realigned operations for an intimate approach to product ... 
Through-Silicon Vias (TSVs) for 3D Interconnects are one of the hottest topics of 2008. Two technologies can be used today to produce these vias: DRIE and laser drilling. In the past, laser drilling processes suffered from throughput and size limitations. Laser technology was then directed towards applications with low density ... 
We see 2008 as an exciting year for BPM. Global demand for OEM automotive electronics is expected to continue to grow. Quality MCU programming will be the key for the strong demand for safety, entertainment and communication systems. BPM's broad complex MCU programming support can help out ... 
In our quest to provide the best value in plasma treatment equipment we have upgraded our PE-100 bench top system with an accurate mass flow meter & precision needle valve gas train. This newest PE-100 now comes standard with one mass flow meter & may be ordered with more as needed. This ... 
