We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers December 11, 2007 Online Auction - Final Day Electronics Packaging Machinery Join us for an online auction November 20 for packaging machinery, ultrasonic welders, case sealers and more. Equipment is currently in the Philippines, learn more… Go Industry DoveBid Semiconductor Packaging News Advertising delivers! Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more… Semiconductor Packaging News Letters Submit Asymtek's new DispenseJet® DJ-100 combines high speed accuracy & process control The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more… Asymtek Top Story   IC Insights: Semiconductor Capital Spending Expected to Drop 9% in 2008 As a result of semiconductor manufacturers putting more emphasis on improving profit margins, capital spending will likely experience a ... Semiconductor International Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Industry News   STMicro to buy Genesis Microchip for $336M STMicroelectronics NV, Europe's largest semiconductor maker, said it will buy U.S. video-chip maker Genesis Microchip Inc for $336 million ... Market Watch Texas Instruments raises Q4 target, shares up Microchip maker Texas Instruments Inc said on Monday mobile phone chip demand was a little better than anticipated, relieving investors and ... Guardian Unlimited Taiwanese Inventors Develop Semiconductor Device Package Joseph Sun, Ming-Chieh Chen, Kevin Lee and Jui-Hsiang Pan, all from Hsin-Chu, Taiwan, and Kuang-Chih Cheng of Yun-Lin, Taiwan, have developed ... Semiconductor International SMIC 12-inch Fab 8 begins production Shanghai, China-based semiconductor foundry Semiconductor Manufacturing International Corp. (SMIC) reported today it has begun production in ... EDN IBM's 'fab club' tips high-k at 32-nm IBM Corp. and its joint development partners -- AMD, Chartered, Freescale, Infineon and Samsung -- have extended their high-k/metal ... EETimes What's Shaken Up My Positive Semiconductor Outlook? Recent data points are shaking my confidence in the near-term outlook for semiconductor stocks. After being bearish for more than a year, ... Seeking Alpha SMIC opens new 300-mm fab Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) has celebrated the commencement of production in Shanghai's ... EE Times AMD, Intel at it again, as both take aim at SoC Advanced Micro Devices and Intel are ramping up system- on-chip capabilities, creating new prod- ucts and processes. Although both ... EETimes TI narrows Q4 forecast Amid weakness in wireless, Texas Instruments Inc. narrowed its expected ranges for revenue and earnings per share (EPS) for the fourth ... EETimes Toshiba tips solid-state drives in push for flash Japanese memory chip maker Toshiba Corp said on Monday it would make flash-based solid state drives for notebook PCs, as it seeks to ... EETimes Arrow Electronics and Triad Semiconductor Team to Offer Mixed-Signal Via-Configurable Array Asics The North American Components business of Arrow Electronics, Inc. and Triad Semiconductor, Inc., a leading mixed-signal ASIC provider, ... CNN Money Sony to cut jobs, close plant in France Sony France SA announced its decision to sell its manufacturing site in Pontonx-sur-L'Adour, in the French region of Aquitaine, and to cut ... EETimes Full Wafer Die Attach Deposition in a Single Stroke Learn more about Henkel's Wafer Backside Coating™ process with this free white paper. Click here to download… Henkel Corporation Technology News   Toshiba tips solid-state drives in push for flash Japanese memory chip maker Toshiba Corp said on Monday it would make flash-based solid state drives for notebook PCs, as it seeks to ... EETimes OneSpin unveils checking solution for PFGAs EDA software vendor OneSpin Solutions GmbH (Munich, Germany) has introduced a sequential equivalence checking solution dedicated to ... EETimes IBM, partners claim 32-nm high-k/metal gate SRAM, SOI Following on 45-nm high-k/metal gate work IBM promoted in January, the company and its joint development partners today announced a move to ... EDN Taiwan Gets On The Solar Train The latest developments in Taiwan signal the beginning of a new solar industry boom. The government recently published its vision for the ... Earthtoys IBM, partners in 32nm device surge IBM and its joint-development partners have announced that their "high-k/metal gate" technology in next-generation 32nm devices will be ... EETimes Good, bad and ugly of LEDs An 84-foot-tall Norway spruce has been covered with 30,000 LEDs strung on 5 miles of wire, and we techies are as happy as pigs in a sty. ... EETimes Red-E-Set Universal Boards Supports ROI CALCULATOR Production Solutions announces a new ROI & Lease Calculator to assist justification implementing Red-E-Set Universal Boards Supports factory wide. See improvements in Changeover Time, Defect reduction, Increased Uptime and elimination of Component damage in just a few weeks. learn more… Production Solutions, Inc. Corporate News Submit WOCSDICE 2008 - 32nd Workshop on Compound Semiconductor Devices and Integrated Circuits WOCSDICE is a forum for researchers and industry engineers to discuss the newest trends and developments in the field of compound ... IMEC Global Semiconductor Alliance Announces 2007 Award Winners Global Semiconductor Alliance (GSA) announces the winners of its 2007 awards, presented at its Awards Dinner Celebration on Thursday, ... Global Semiconductor Alliance Today's Sponsor ShinEtsu Resists - Perfect for 3D packaging, WLP, TSV and wafer bonding For stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. ShinEtsu White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc. Having Trouble Inspecting 3D Packages? CT offers virtual micro-sectioning In today's competitive world, quality is everything. Computerized tomography completely examines features that otherwise remain hidden. The Dage XD7600NT provides the fastest CT reconstruction in the industry and can be easily switched from 2D to 3D modes. Learn more… Dage Precision Industries Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.