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Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
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Metallization Lines by ASYS
Metallization LinesOver 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
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Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
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November 8, 2007

YESTech to Exhibit Next Generation AOI at IMAPS

San Clemente, CA - YESTech, a leading supplier of automated inspection and yield enhancement systems for the electronics industry, will showcase its new YTV M1m AOI at IMAPS 2007, the 40th International Microelectronics And Packaging Society, Booth 324 in San Jose, California.

Based on YESTech's proprietary machine vision software, the next generation M1 AOI System provides class-leading performance with its extremely fast and easy program creation. Innovative and powerful inspection algorithms easily identify visible component, lead, bond wire and solder anomalies. YESTech's advanced three mega pixel Thin Camera(TM) and new Fusion Lighting(TM) enable the exceptional defect coverage and extremely low false call rate that is necessary to reduce costs, improve quality and increase throughput of today's manufacturing process.

The M1, with a smaller footprint and board handling system, is designed for maximum flexibility and can instantly adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios, focuses on the demanding challenges faced by AOI equipment manufacturers and their new product developments to accurately inspect assemblies with 01005 components.

Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes. Real-time color, normalized gray scale correlation, pattern matching and binary "blob" analysis are just a few of the tools used to automate the process.

"We are very excited to be attending this years IMAPS show and to showcase our latest AOI inspection innovation." said YESTech president Don Miller. "The YTV M1m is unique to the industry, offering the latest technology for demanding microelectronics applications""

Editor's Note

A high-resolution image of the YTV M1m AOI is available by calling (949) 361-2714 or by visiting http://www.kreativesolution.com/yestechm1_IMAPS.htm For pricing or additional information call, YESTech's USA HQ at: 949-361-2714 or visit the YESTech website @ www.yestechinc.com

About IMAPS:

Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. For more information, visit: www.imaps.org

Contact:
YESTech

Don Miller
http://www.yestechinc.com

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