We search for industry news, so you don't need to.
  White paper on die attach
Going Beyond Bulk Properties:
Full Wafer Die Attach White PaperEver wondered what's really going on with Die Attach thermal performance? Henkel unlocks the mystery…
Henkel Corporation
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map

Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




User-Friendly Automatic Wire Bonders
Turnkey solutions under $80K
User-Friendly Automatic Wire BondersBonders for gold ball bonding, ball bumping and wedge bonding capable of bonding 17-75 micron diameter wire. Rapid changeover design allows package conversions in as little as 3 minutes and accommodates a multitude of device configurations. Learn more…
Questar Products International
  Corporate News Index
November 8, 2007

YESTech to Exhibit Next Generation AOI at IMAPS

San Clemente, CA - YESTech, a leading supplier of automated inspection and yield enhancement systems for the electronics industry, will showcase its new YTV M1m AOI at IMAPS 2007, the 40th International Microelectronics And Packaging Society, Booth 324 in San Jose, California.

Based on YESTech's proprietary machine vision software, the next generation M1 AOI System provides class-leading performance with its extremely fast and easy program creation. Innovative and powerful inspection algorithms easily identify visible component, lead, bond wire and solder anomalies. YESTech's advanced three mega pixel Thin Camera(TM) and new Fusion Lighting(TM) enable the exceptional defect coverage and extremely low false call rate that is necessary to reduce costs, improve quality and increase throughput of today's manufacturing process.

The M1, with a smaller footprint and board handling system, is designed for maximum flexibility and can instantly adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios, focuses on the demanding challenges faced by AOI equipment manufacturers and their new product developments to accurately inspect assemblies with 01005 components.

Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes. Real-time color, normalized gray scale correlation, pattern matching and binary "blob" analysis are just a few of the tools used to automate the process.

"We are very excited to be attending this years IMAPS show and to showcase our latest AOI inspection innovation." said YESTech president Don Miller. "The YTV M1m is unique to the industry, offering the latest technology for demanding microelectronics applications""

Editor's Note

A high-resolution image of the YTV M1m AOI is available by calling (949) 361-2714 or by visiting http://www.kreativesolution.com/yestechm1_IMAPS.htm For pricing or additional information call, YESTech's USA HQ at: 949-361-2714 or visit the YESTech website @ www.yestechinc.com

About IMAPS:

Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 19 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. For more information, visit: www.imaps.org

Contact:
YESTech

Don Miller
http://www.yestechinc.com

This page has been viewed 92 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Semiconductor Packaging News

More from YESTech
December 16, 2009
YESTech Updates Brand Identity to Nordson YESTECH
YESTech announced today that they will begin the process of refreshing its brand identity and be known as Nordson YESTECH. This re-branding ...
YESTech
March 2, 2009
YESTech Moves Operations to Expanded Facility in Carlsbad, CA
YESTech announced the opening of its’ new location in Carlsbad, California. The offices are at 2762 Loker Avenue West, Carlsbad, co-located ...
YESTech
June 19, 2008
YESTech's M1m Automated Optical Inspection System for Advanced Packaging & Microelectronics Applications
YESTech announces the introduction of the latest M1™ AOI system, developed with special design enhancements to address the unique ...
YESTech, Inc
June 18, 2008
YESTech Announces X-Series 3-D X-Ray Inspection System
YESTech announced its new X3, 3-D X-Ray inspection system for populated printed circuit boards. The innovative new X-Series Automated X-Ray ...
YESTech
June 17, 2008
YESTech Announces X-Series 3-D X-Ray Inspection System
YESTech announced its new X3, 3-D X-Ray inspection system for populated printed circuit boards. The innovative new X-Series Automated X-Ray ...
YESTech
March 17, 2008
YESTech Moves to New China Facility, Hosts Advanced Technology Day
YESTech, Inc. announced the opening of its' new location in Shanghai, China. The offices will be co-located in the expansive new Nordson ...
YESTech, Inc.
March 14, 2008
YESTech to Introduce New X3 3-D X-Ray Inspection System at APEX
YESTech will introduce its new YTX X3 3-D X-Ray inspection system for populated printed circuit boards at the 2008 APEX Printed Circuits ...
YESTech
January 9, 2008
Asymtek and YESTech Enable Medical Device Manufacturers to Meet Regulatory Requirements
Asymtek and YESTech, Nordson companies, have developed a process that helps enable medical device manufacturers to meet regulatory ...
Asymtek and YESTech
December 27, 2007
YESTech's M1m Automated Optical Inspection System for Advanced Packaging & Microelectronics Applications
YESTech announces the introduction of the latest M1(TM) AOI system, developed with special design enhancements to address the unique ...
YESTech
November 8, 2007
YESTech to Exhibit Next Generation AOI at IMAPS
YESTech will showcase its new YTV M1m AOI at IMAPS 2007, the 40th International Microelectronics And Packaging Society, Booth 324 in ...
YESTech
October 27, 2006
YESTech Announces New YTX-6000 Automated In-line X-Ray Inspection System
YESTech, Inc. announced today the introduction of its YTX-6000 automated x-ray inspection (AXI) system. This versatile system offers semiconductor ...
YESTech, Inc
To find more corporate news releases from YESTech, use the search form below.


DI-Water vs. Chemistry:
Cleaning Under pH-Neutral Conditions
Soldering Made SampleAre you cleaning with DI-water? If so, you may be facing reliability issues. Recent studies have shown that DI-water has reached its cleaning limitations with low standoff devices. Learn more…
ZESTRON




Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.