On 24 April, SEMI Europe will host a workshop “Beyond
300mm: Packaging Challenges and Opportunities for 450mm Wafers and Panel
Scale Solutions” which will offer both perspectives and answers to the complex
wafer-size transition issue facing the semiconductor industry. The workshop
covers the core topics of packaging of 450mm wafers and panel scale solutions.
Much of the discussion will include a front-end view of a 450mm wafer
introduction which will create new challenges for assembly and packaging. Key
issues include: What new challenges will emerge related to the packaging of
450mm wafers? Are the issues already addressed by today's back-end players? Are
disruptive technologies expected? Are there opportunities for new entrants?
What is the situation in terms of standards? The workshop
will be one of the most complete public discussions to date addressing
these open questions. Executives from Entegris, CNSE Albany and SOITEC will
deliver presentations. A panel discussion with representatives of EVG, SET,
RECIF Technologies and CEA-LETI will allow attendees to interact with experts
on the domain.
The second part of the workshop involves selecting panel scale packages. As a normal
evolution of packaging to help in reducing cost, speakers will give their
thoughts and share latest results on large scale packages. Issues include: What
is the situation today in terms of development and maturity? Can large size be
fabricated with high throughput and good yields? Speakers in this session will
talk about technologies such as fan-out wafer-level packages on rectangular
rebuilt wafers, embedded die in laminate, glass carrier with and without
vertical vias enabling 2.5D integration. Executive people from YOLE, ASE, STATS
ChipPAC and AT&S will present their views.
The workshop is targeting senior-level technologists, managers and executives
from leading companies and organizations around the world. Attendees will get
an excellent summary and overview of the industry situation on
Packaging-related items of 450mm wafer and panel scale solution. Registration
will open in early March. For more information, visit www.semi.org/beyond300mm.
The workshop is organized by SEMI Europe Grenoble Office and hosted by MiNaPAD.
The MiNaPAD Conference is co-located and will immediately follow the Beyond
300mm workshop from April 25-26.
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