We search for industry news, so you don't need to. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map   Industry and Technology News Index October 28, 2011  -  Click the title to read the full article. Perspectives on Low Temperature Wafer Direct Bonding for Monolithic 3D Integration In this article, Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology shares his perspective on Low Temperature Wafer Direct Bonding, where an important ... I-Micronews We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from I-Micronews February 20, 2012 - Industry News Kyocera America doubles its flip-chip assembly capacity The new clean room offers the latest available technology, including fine-pitch flip-chip, multiple components within one operation, vacuum ... I-Micronews February 14, 2012 - Industry News Elpida president discusses DRAM industry's future Yukio Sakamoto, president and CEO of Elpida Memory Inc, delivered a lecture titled "DRAM Business: A Scenario for Counterattack" at the World Semi ... I-Micronews February 13, 2012 - Industry News SILEX interview: opportunities for CMOS MEMS and 3D integration In this interview, we spoke with Tomas Bauer, VP of Sales and Business Development at Silex Microsystems about his perspective on the latest TSV ... I-Micronews February 9, 2012 - Industry News Rudolph's first metrology system for advanced packaging installed Rudolph Technologies, Inc. announced that it has delivered the first MetaPULSE(R) metrology system for measurements of under bump metallization ... I-Micronews February 8, 2012 - Industry News SUSS launches wafer bonding, debonding & cleaning platform for 3DIC apps SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high ... I-Micronews February 6, 2012 - Industry News Mid end player Novellus sees China, WLP and 3D NAND as drivers In a conference call following release of Novellus Systems' fourth quarter and full-year 2011 results, Archer was asked if he stood by earlier ... I-Micronews February 6, 2012 - Industry News Graphene electronics moves into a third dimension Now scientists from The University of Manchester have given its prospects a new lifeline. In a paper published this week in Science, a Manchester team ... I-Micronews January 30, 2012 - Industry News Sony announces new stacked BSI sensor Sony Corporation announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution ... I-Micronews January 30, 2012 - Industry News Discussion: Wide IO memory and high-performance DRAM stack design For the last 3D blog post of 2011in the EDA360 Insider, I thought I'd take a flight of fancy and try to put as many of this year's major announcements ... I-Micronews January 25, 2012 - Industry News Sony announces new stacked BSI sensor Sony Corporation announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution ... I-Micronews January 24, 2012 - Industry News TSMC sees Samsung as formidable competitor During a Q&A session at TSMC's investors meeting, Morris Chang, TSMC chairman and CEO, said that Samsung will substantially expand what it calls the System ... I-Micronews January 23, 2012 - Industry News Optomec expands aerosol jet lab for 3D packaging The new facility comprises 7600 square feet of office and general laboratory space and will be utilized for both advanced development of Aerosol Jet ... I-Micronews January 20, 2012 - Industry News TSMC sees Samsung as formidable competitor During a Q&A session at TSMC's investors meeting, Morris Chang, TSMC chairman and CEO, said that Samsung will substantially expand what it calls the ... I-Micronews January 20, 2012 - Industry News The fast track to 3D-IC testing Three-dimensional integrated circuit (3D-IC) systems offer the potential to deliver significant improvements in performance, power, functional density ... I-Micronews January 20, 2012 - Industry News First major 3D TSV wide-IO product announcement is made by Renesas This major announcement is the first one concerning a product release using this long awaited technology, the aim of which is to considerably increase ... I-Micronews January 19, 2012 - Industry News Mid end equipment performance to be evaluated through SEMATECH's programs 3D integration is introducing several new process steps primarily on the wafer backside and between chip makers fab processes and packaging. These ... I-Micronews January 19, 2012 - Industry News Sony plans to use TSV for its next gaming station CPU/GPU Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working on a system-on-chip (SoC) to underpin the product for "seven to ten ... I-Micronews January 19, 2012 - Industry News Wioming : A Closer Look TSVs (through-silicon vias) connect these three die together and "in order to minimize the impact of the TSVs on signal integrity, the 3D stack employs an ... I-Micronews January 18, 2012 - Industry News Sony plans to use TSV for its next gaming station CPU/GPU Sony Computer Entertainment is planning on a much longer shelf life for its next generation PlayStation gaming console with a strategy that appears to be ... I-Micronews January 10, 2012 - Industry News STATSChipPAC packaging evolution to 2.5/3D: a closer look At the recent RTI Architectures for Semiconductor Integration and Packaging (RTI ASIP), Raj Pendse, VP and CMO for STATSChipPAC (SCP) gave an in depth presentation ... I-Micronews January 10, 2012 - Top Story News 3D Challenges & Progress: A Closer Look The standard IMEC TSV are currently 5 x 50 µm for 3D stacking (moving in the future to 3 x 50) and 10 x 100 for 2.5D interposers. This is where most of the industry has standardized. Beyne listed 2.5D/3D application drivers as ... I-Micronews January 5, 2012 - Industry News Elpida starts sample shipments of wide IO memory Elpida Memory, Inc. announced that it has begun sample shipments of 4-gigabit Wide IO Mobile RAMTM and 4-gigabit DDR3 Mobile RAM (LPDDR3). Wide IO Mobile ... I-Micronews January 4, 2012 - Industry News Underfilling in the era of high density / 3D interconnect: a closer look Five years later, Tsukada of IBM Japan published reports that bumped chips could be reliably attached directly to PWB laminate, if underfilled. He ... I-Micronews January 3, 2012 - Industry News FCI Fujikura JV moves embedded packages to commercialization stage Ted Tessier, CTO of FCI recently shared details concerning their embedded chip packaging partnership with Fujikura. This venture takes advantage ... I-Micronews December 27, 2011 - Top Story News The Future of ASICS in 3D There are at least two fundamentally different applications for 3D technology that are driven by completely different incentives. The mobile space is driven mostly by the need for reduced power, height and area. The infrastructure and networking space ... I-Micronews To find more articles from I-Micronews, use the search form below. Home  |  About Us  |  Advertising  |  Advertising Rates  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2011 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.