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March 9, 2011

iMAPS Device Packaging Conference

iMAPS Device Packaging Conference
Ken Cavallaro, Business Manager, Semiconductor Packaging News
Technical presentations continued at the iMAPS Device Packaging Conference and included a presentation from Oleg Khaykin, CEO of International Rectifier who spoke about the opportunities of 'packaging' to reduce global power consumption.

He estimated the redesign of electric motors, high efficiency lighting and power chips could create "acres of silicon" for the industry and through packaging innovations, save the electric grid much more than creating new sources of energy.

Another presentation by Mike Kelly from Amkor discussed the growth of 3D packaging with TSV silicon interposers. He spoke of the advantages of using silicon interposers such as increased speed, lower power consumption and many times the interconnect I/O up to 10,000 bumps per die.

iMAPS Device Packaging Conference
Over 60 exhibiting companies showed their technology to attendees between the technical sessions. We spoke to many exhibitors who shared their upbeat feelings of the market after last year's industry rebound. Most expect 2011 revenue to remain at high levels and a few equipment companies are still dealing with component shortages for parts such as linear actuators.

Asia and the USA have been strong during Q1 and modest growth expectations for 2011 are forecast. Several companies had been hiring in production, applications and customer support during the past six months. As long as the economy remains stable, they expect a good year ahead.

Ken Cavallaro, Business Manager
Semiconductor Packaging News


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