December 8, 2011
SUSS MicroTec launches XBS300, the next gen Temporary Bonder
SUSS MicroTec launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing temporary bond systems. This Bond ...
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December 6, 2011
Brewer Science & SUSS MicroTec Jointly Commercialize ZoneBOND Technology
Brewer Science, Inc. and SUSS MicroTec are joining forces in commercializing ZoneBOND(TM) technology for thin wafer handling. SUSS MicroTec is now offering ...
SUSS MicroTec
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November 28, 2011
Cooperation of SUSS MicroTec and Swansea University's Centre for NanoHealth
SUSS MicroTec announces the cooperation with Swansea University's Centre for NanoHealth (CNH). This cooperation is linked to CNH's recent purchase of ...
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October 20, 2011
SUSS MicroTec and TMAT Selected for 300mm High-Volume Production
SUSS MicroTec and TMAT have received a purchase order for SUSS MicroTec's latest generation of high volume manufacturing temporary bond clusters ...
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July 15, 2011
SUSS MicroTec introduces MaskTrack Pro InSync
SUSS MicroTec launched its new MaskTrack Pro InSync -- the first holistic in-fab EUVL mask management offering. MTP InSync is a stand-alone or ...
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July 1, 2011
3D Integration Workshop -- Are we there yet?
Industry experts in materials, equipment and processing will be joining SUSS MicroTec in addressing the status of the 3D TSV infrastructure an ...
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January 12, 2011
SUSS MicroTec and Cornell Collaborate in Nano Research
SUSS MicroTec announced a strategic collaboration with the Cornell NanoScale Science & Technology Facility (CNF), a university nanofab ...
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December 28, 2010
New SUSS Report Available
Our bi-annual customer magazine SUSS Report provides you with an insider update on innovations and trends in equipment solutions for the ...
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December 6, 2010
SUSS MicroTec, Rolith in Development of Nanolithography Technology
SUSS MicroTec announced that it has entered into a joint development and exclusive license agreement with Rolith, Inc. to develop and build ...
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December 1, 2010
SUSS MicroTec Extends Technological and Market Leadership
HamaTech APE GmbH & Co. KG announced that it has received a double-digit number of orders for MaskTrack Pro, the mask integrity platform for ...
SUSS MicroTec
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November 12, 2010
SUSS MicroTec and Fraunhofer IST Introduce New Technology
SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST announced the launch of SELECT, a technology for bond aligner and mask ...
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September 2, 2010
SUSS MicroTec Appoints New VP R&D
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as Vice President R&D and CTO. In this function Reiner Knippelmeyer will oversee research ...
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June 10, 2010
SUSS MicroTec Tackles LED Market with Lithography System
SUSS MicroTec introduced the next generation of its MA100e mask aligner, a dedicated lithography solution for manufacturing high-brightness light ...
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March 10, 2010
Amkor Technology Installs Systems from SUSS MicroTec
SUSS MicroTec has received orders for multiple 300mm lithography systems from Amkor Technology Inc., an industry leading supplier of innovative ...
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January 19, 2010
SUSS MicroTec Expands Activities in Wafer-Level Camera Applications
SUSS MicroTec announces that Q-Technology Limited (Q Tech), manufacturer of compact camera modules for the global cell phone, notebook computer ...
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September 29, 2009
SUSS MicroTec Cooperates with Research Institute ITRI on Technology Development in 3D Integration
SUSS MicroTec, a leading supplier of innovative process and test solutions for the semiconductor industry and related markets, announced ...
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September 2, 2009
SUSS MicroTec Launches First 300mm Test Solution for 3D Integration
SUSS MicroTec announces the release of the probe station PA300PS 3D geared for 300mm electrical probing of 3D stacked structures on wafer ...
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August 27, 2009
SUSS MicroTec Expands 3D Integration Activities in Japan
SUSS MicroTec has shipped a LithoPack300 lithography cluster to Japan. The system has been successfully installed at the customer site where ...
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July 28, 2009
IMEC and SUSS MicroTec to Collaborate on Wafer Bonding
SUSS MicroTec and the Belgian nanoelectronics research center IMEC have entered a joint development program. Together, they will develop ...
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July 13, 2009
SUSS MicroTec and Thin Materials Cooperate on Temporary Bonding Solution
SUSS MicroTec and Thin Materials announced today that they are cooperating on a temporary bonding solution to be used for challenging ...
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July 6, 2009
SUSS MicroTec Strengthens Presence in Asia with New Sales
SUSS MicroTec announced a new structure for sales in Asia based in Singapore. With the consolidation of the sales office in Bangkok ...
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June 24, 2009
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
3M and SUSS MicroTec announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin ...
SUSS MicroTec AG
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June 23, 2009
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology
3M and SUSS MicroTec announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin ...
SUSS MicroTec
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June 15, 2009
SUSS MicroTec Introduces New |Z| Probe® Technology
SUSS MicroTec Test Systems has introduced 1MX™ Technology for its line of on-wafer RF probes, the |Z| Probe®. The new technology significantly ...
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June 8, 2009
SUSS MicroTec Introduces Illumination System for Mask Aligners
SUSS MicroTec launches with the MO Exposure Optics a new illumination system designed for all generations of manual and automatic SUSS mask ...
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