Kuala Lumpur, Malaysia – Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia.

The bumping facility’s floor space will be increased by 100 percent and the increased capacity will be three times that of UAT’s current bumping capacity.

The new floor space’s clean room has been completed and installation of some of the new bumping equipment started in June. UAT expects the equipment that will provide this new additional capacity to be in place and available to customers beginning this September.

"We have seen tremendous demand from our customers for wafer bumping during the current industry upturn", stated C.H. Ang, Group COO of the Unisem Group. "In order to meet the growing needs of our customers, we are moving quickly to increase our floor space and capacity for bumping at UAT", continued Ang.