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July 13, 2010


PacTech's LAPLACE
Laser Flip-Chip Bonder
PacTech's LAPLACEStress-free laser reflow and high speed assembly with an accuracy down to ±2µm - ideal for RFID, capacitor attach, high-accuracy flip-chip bonding, 3D probe card bonding. Learn more…
PacTech

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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.
Letters Submit

cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
Top Story  
Semi Equipment Sales Expect 96% Growth in 2010
The recovery is well under way and secure in the semiconductor equipment market, according to the latest data from VLSI Research Inc. The research ...
EDN

Advances in Micro-electronics Inspection
Provides High Resolution and High UPH,
Machine Vision ProductsMVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more…
Machine Vision Products, Inc.
Industry News  
Semicon West: What a difference a year makes
Last year, the annual Semicon West fab tool tradeshow may have been one of the depressing gatherings in human history. The semiconductor market ...
EE Times
TSMC Reports Shining Monthly and Quarterly Sales
Taiwan Semiconductor Manufacturing Co, (TSMC) saw its consolidated net sales for June hit a new high and its consolidated net sales for the ...
Taiwan Economic News
UAT tripling wafer bumping capacity
Wafer-bumping service provider Unisem Advanced Technologies (UAT) has doubled the floor space of its plant in Ipoh, Malaysia, with a capacity ...
Digitimes
Teradyne highest growth in Q1
No surprises that Applied Materials continued to lead the semiconductor equipment sales in 1Q10. The company's IC manufacturing equipment and ...
Fabtech
SEMI Announces Five Finalists for 2010 Sustainable Tech Award
SEMI has announced the five finalists for the SEMICON West 2010 Sustainable Technologies Award. The annual award recognizes the efforts ...
SEMI
Why Nvidia's Chips are defective
NVIDIA has recently been saying a lot about how its chips are not bad and giving people reasons why the problem is contained. Unfortunately, ...
Semi Accurate
TSMC could see EPS growth of over 60% in 2010
Taiwan Semiconductor Manufacturing Co. (TSMC) is expected to maintain its revenue growth momentum in the second half of the year, with full-year ...
Focus Taiwan News Channel
Nvidia chips show underfill problems
When we told you about the 'bad bumps' in the Apple Macbook Pro 15" models the other day, we expected it to end there. As luck would have it ...
Semi Accurate
Applied Leads the Way to TSV Interconnects for 3D Chip Stacking
Applied Materials, Inc. is leading the next technology inflection to advance through-silicon via (TSV) technology for high-volume manufacturing ...
Nanowerk
Intel Keeps Chugging
Recessions tend to be good to Intel. During the last one, the chip giant's Atom processors helped ignite demand for low-cost netbook computers. ...
Forbes
4G Wireless Evolution - Sprint Short on Components for Smartphone
Consumers psyched to upgrade to Sprint's HTC EVO 4G phone better start shopping around for an alternative - and maybe not the Droid Incredible ...
4G Wireless Evolution
Sales of chips set record pace
Rising demand for electronic goods in emerging markets lifted global sales of semiconductors by 4.5% in May. The growth represents an opportunity ...
The National

Die Bonding Made Easy
Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Technology News  

F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec

Corporate News Submit
Palomar Tech Announces 3800 Ultra Flexible Die Bonder at Semicon West
Palomar Technologies will introduce its new fully automated 3800 Ultra Flexible Die Bonder at SEMICON West 2010 in San Francisco, CA. To see ...
Palomar Technologies
Christopher Assoc. to Introduce PV Backsheet Material at Semicon
Christopher Associates announced that it will exhibit the Zoomlight high performance FFC/PET/FFC backsheet material for photovoltaic module ...
Christopher Associates
Applied Materials Sees Record Adoption of New AdvantEdge Silicon Etch Technology
Applied Materials, Inc. unveiled its new Applied Centura® AdvantEdge™ Mesa™ system for creating nano-scale circuit features with angstrom-level ...
Applied Materials
Nordson ASYMTEK Introduces Flux Jetting System at SEMICON West
Nordson ASYMTEK introduces its Spectrum® S-930NSeries selective flux jetting systems at SEMICON West, booth #5947. These inline dispensing ...
Nordson ASYMTEK
SEMA to Hold First General Meeting in San Francisco
A new engineering and management association for engineers, managers and other professionals in the solar and green energy industries will hold ...
Solar Engineering & Manufacturing Association
Today's Sponsor

Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.

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"Which valve do I use" answered by PCD Dispense Technology
PCD TechnologyNo matter the material the PCD dispense technology will deliver volumetric, repeatable results without calibration. Ease of setup and compatibility over a wide range of viscosities ensures repeatable day-to-day operations. Learn more…
GPD Global

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5 Micron Placement Capable!
Small Footprint, Low Cost
Air-Vac Onyx500The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more…
Air-Vac Engineering


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