Ipoh, Malaysia – Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received a 2009 Supplier Excellence Award from Supertex, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Supertex's exacting standards in the areas of yield, quality and delivery performance.
The award was presented to Carsem by Mr. David Har, Supertex’s QA Engineer. Mr. Har stated, "Supertex's "2009 Excellent Award" recognizes suppliers who, in 2009, had significantly contributed to Supertex’s success through outstanding achievement and continuous improvement in term of quality, delivery and yield performance. We wish Carsem will maintain the high standard and can receive this award again in the years to come.”
Mr. Peter Yates, Carsem’s Group Managing Director added, "We are honored to receive this award for excellence from Supertex and are proud of our Suzhou factory team’s performance. We look forward to continuing our relationship with Supertex well into the future."
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.
July 29, 2010 Carsem Wins ITC Patent Litigation Case Carsem announced it was determined by the ITC that Carsem has not violated section 337 of the Tariff Act of 1930, 19 U.S.C. & 1377, in ... Carsem
June 25, 2010 Carsem Receives Supertex 2009 Excellence Award Carsem announced it has received a 2009 Supplier Excellence Award from Supertex, Inc. for assembly and test services that were provided by ... Carsem
November 6, 2009 Carsem Remains Optimistic about ITC Patent Litigation Carsem announced that an Administrative Law Judge (ALJ) has issued a supplemental Initial Determination (ID) in Carsem’s on-going patent ... Carsem
October 27, 2009 Carsem Announces Extremely Thin MLP Carsem announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as ... Carsem
To find more corporate news releases from Carsem, use the search form below.