May 13, 2010

Henkel Electrically Conductive Adhesive Cures Fast at Low Temp

Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

While solder is arguably the most common electrical interconnect material, its high temperature requirements make it impractical for certain applications. Fragile, thin, temperature-sensitive substrates are often subject to damage not only from the requisite soldering temperatures, but also from screen and stencil printing processes themselves. Hysol ECCOBOND CA3556HF resolves these issues with fast, low temperature curing.

"This material is not just a superior replacement for solder in certain applications,” notes Vito Buffa, Henkel Global Product Manager for Pastes and Inks. “Hysol ECCOBOND CA3556HF also has advantages over other electrically conductive adhesives that burden users with long cure times and limited flexibility. This material's cure speed and versatility are unmatched."

Initially designed to address the unique requirements of the photovoltaic module assembly market, Hysol ECCOBOND CA3556HF has been proven for other processes, too. It’s flexibility for the photovoltaic sector is well-documented, as it is suitable for both crystalline-silicon (c-Si) and thin film manufacturing. For c-Si cell production, Hysol ECCOBOND CA3556HF delivers an excellent bond between the Ag and SnPbAg coated tabs and the c-Si cells. Thin film module manufacturers seeking a low-stress, fast cure electrical interconnection of cells with ribbons have also incorporated the material into their processes with great success.

In explaining Hysol ECCOBOND CA3556HF’s versatility, Buffa continues: “Not only are PV specialists benefiting from the materials’ performance; any manufacturer that requires a fast, low temperature cure for high throughput operations will realize the competitive advantage this product delivers. Some of these applications include, but are not limited to, membrane switches, displays on temperature-sensitive substrates, automotive sensor and RFID tag assembly.”

Other benefits of Hysol ECCOBOND CA3556HF include high peel and shear strength, stress minimization properties to compensate for CTE mismatches, fast cure for high throughput and a no-mix, one-part formula which reduces operator error and speeds processing time.

For more information on Hysol ECCOBOND CA3556HF or any of Henkel’s next-generation adhesive products, call 1-888-9HENKEL or log onto www.henkel.com/electronics.



For more information visit http://www.henkel.com/electronics

Preview the IPC Outlook listing for Henkel Electronics

Additional News From Henkel Electronics
September 18, 2014
Henkel Unveils First Hybrid Adhesive
Henkel has introduced Loctite 4090, an innovative hybrid adhesive that combines the key features of structural and instant adhesives ...
Henkel Electronics Materials, LLC
February 19, 2013
New branding architecture for the Henkel adhesive technologies business
Henkel will introduce a new branding approach for its industrial adhesive technologies business. The company's brand portfolio has grown strongly over the ...
Henkel Electronics
February 15, 2013
New type of paste with enhanced thermal conductivity for modules
Power electronics are experiencing a continuous rise in their power densities. As a consequence, thermal management for today’s power semiconductors must ...
Henkel Electronics
November 27, 2012
Henkel's Pre-cut Conductive Die Attach Film Expands Advantage
Since its market introduction four months ago, Henkel Electronic Materials' LOCTITE ABLESTIK CDF 200P pre-cut conductive die attach film has enjoyed broad market ...
Henkel Electronics
August 13, 2012
Henkel Develops Underfill for Next-Generation Flip Chip Devices
Addressing the challenges associated with ever-thinner flip chip die, Henkel Electronic Materials has developed a new underfill system designed to ...
Henkel Electronics
May 15, 2012
Henkel Records Solid Sales Growth and Boosts Profitability
Henkel had a good start to the fiscal year in spite of a challenging and volatile market environment. We achieved solid organic growth and substantially ...
Henkel Electronics
May 1, 2012
Henkel develops materials innovations for high power electronics
Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors ...
Henkel Electronics
March 28, 2012
New material with highest RTI rating in its class
Henkel's low-pressure molding Macromelt technology portfolio has recently been expanded to include a material designed specifically for high thermal ...
Henkel Electronics
March 21, 2012
Electrically Conductive Adhesive from Henkel Compatible with Multiple Metals
Leveraging research regarding contact resistance performance, Henkel Electronic Materials has developed an electrically conductive adhesive (ECA) ...
Henkel Electronics
January 11, 2012
Henkel Develops Electrically Conductive Adhesive Compatible with Lower-Cost Components
In a significant formulation breakthrough, Henkel Electronic Materials announces that it has developed a new electrically conductive adhesive ...
Henkel Electronics
August 23, 2011
Henkel Enables Educational Opportunities for Underprivileged Children
As part of Henkel's Make an Impact on Tomorrow (MIT) program, the company has recently donated funds to support students from the Xinchao Charity ...
Henkel Electronics
August 15, 2011
Conductive Adhesive Innovations Advance Solar Module Assembly Capability
At the 26th European Photovoltaic Solar Energy Conference (EU PVSEC) in Hamburg, Germany, Henkel will display some of the company's innovations ...
Henkel Electronics
August 12, 2011
Innovative adhesives for the solar industry
At the 26th European Photovoltaic Solar Energy Conference in Hamburg, Henkel will be presenting powerful solutions spanning the entire value ...
Henkel Electronics
July 25, 2011
Henkel's Conductive Die Attach Films Enable Leadframe Package Scalability
Henkel announces that it has worked with STMicroelectronics to validate the performance of Henkel's Ablestik C100 conductive die attach film ...
Henkel Electronics
July 14, 2011
Breakthrough Pressureless Silver Sintering Technology from Henkel
Breaking new ground in materials innovation, Henkel Electronic Materials has announced its success with a revolutionary silver (Ag) sintering ...
Henkel Electronics
July 13, 2011
Henkel's Conductive Die-Attach Films Enable Leadframe Package Scalability at STMicroelectronics
Henkel announced that it has worked with STMicroelectronics, one of the world's largest semiconductor companies and advanced chip packaging ...
Henkel Electronics
May 10, 2011
Henkel Electronics Redesigns Website
In order to provide more streamlined accessibility to information regarding the company's wide range of electronic materials, Henkel ...
Henkel Electronics
May 5, 2011
Henkel and Holst Centre announce partnership
Henkel and Holst Centre announce their partnership in the field of flexible electronics. Henkel's knowhow in adhesives brings a new field ...
Henkel Electronics
April 18, 2011
Henkel joins Holst Centre research network on flexible electronics
Henkel and Holst Centre announce their partnership in the field of flexible electronics. Henkel's knowhow in adhesives brings a new field ...
Henkel Electronics
March 29, 2011
Henkel Launches Conductive Die Attach Film
The latest in a series of recent materials innovation successes, Henkel Electronics announced the development and commercial availability of its ...
Henkel Electronics
March 23, 2011
Henkel Recognized Once Again
Henkel has been included in the list of the "World's Most Ethical Companies" for the fourth year in a row. The ranking, prepared by the ...
Henkel Electronics
February 10, 2011
Henkel and Hitachi Chemical Enter into License Agreement
Henkel Corporation announced that it has entered into a license agreement with Hitachi Chemical Co., Ltd. for the worldwide manufacture and sales ...
Henkel Electronics
November 15, 2010
Henkel reports outstanding third quarter results
"In the third quarter, we further extended our recent successes with results even better than the good performance we have shown in recent ...
Henkel Electronics
September 23, 2010
Henkel Partners with JSK Associates for Rep in Western States
Henkel's electronics group has added to its extensive network of representatives and distributors in the Americas by signing on Santa ...
Henkel Electronics
September 10, 2010
Henkel Technology on Display at EU PVSEC
At the European Photovoltaic Solar Energy Conference (EU PVSEC) in Valencia, Spain, Henkel will display some of the company's most recent ...
Henkel Electronics

News By Semiconductor Packaging News
Views: 852