Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are significantly expanding their Suzhou, China factory’s manufacturing capacity for the new X3 package. The X3 is an extremely thin version of the MLP (Micro Leadframe Package) that is a two lead package with nominal dimensions of 0.6 mm long by 0.3 mm wide and 0.3 mm thick, which is very similar in size to a 0201 surface mount component.

Carsem began shipping pilot production volumes of the X3 package in March this year and by Q3 this year they will have the capacity to produce over one million parts per day. It is expected that 100% of the production will be full turn-key manufacturing services that include electrical testing, laser mark and tape-and-reel.

Mr. Rick Flowers, Carsem’s V.P. of World Wide Sales and Marketing stated, "Since we announced the X3 package in October last year, the level of interest by our customers has grown dramatically and we are quickly expanding the capacity to meet the increased demand." Mr. Flowers further stated, "Longer term, we expect to add this capability to our factory in Malaysia as well."

Anyone interested in further details about this new package should contact your local Carsem sales office, which can be found on the Carsem web site at www.carsem.com.