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  New Fully Automatic Heavy Wire Bonder
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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
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  Corporate News Index
March 22, 2010

ASYMTEK's Dual Simultaneous Jetting Cuts Dispense Time in Half

Nordson ASYMTEK's Dual Simultaneous Jetting

Ensures Precision, Accuracy & Reliability for LED Silicone Encapsulation and CSP Underfill

Carlsbad, Calif. - Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, introduces dual simultaneous jet dispensing. Dual simultaneous jetting uses two DispenseJet® valves to jet fluid, reducing dispense time by 50 percent while significantly reducing process variability with Calibrated Process Jetting Plus (CPJ+) capability. It is ideal for applications like CSP underfill and LED silicone encapsulation on multi-up panelized or patterned parts, or for similar applications where precision, accuracy, reliability, and increased throughput are required.

When jetting simultaneously it is critical that both jets deliver the same mass. Dual simultaneous jetting, in conjunction with Nordson ASYMTEK's CPJ+ technology, ensures that flow rates for both DispenseJets deliver the same mass per part for uniform deposition. The system automatically compensates for fluid viscosity changes over time as well as batch-to-batch variations to keep the process under machine control. Dual simultaneous jetting cuts dispense time in half, while CPJ+ technology increases dispense accuracy for higher yields and ensures consistent Takt times for improved process capability (CpK). In addition, the jets feature flexible spacing options to adapt to different application requirements.

Dual simultaneous jetting is available on Nordson ASYMTEK's Spectrum S-920N Series. The S-920N platform is ideal for high-volume microelectronics manufacturing and printed circuit board assembly. Its flexible architecture and upgradeability make the system capable of handling both current and future dispensing requirements on customer roadmaps. The Spectrum S-920N series key advantages are its scalability, small footprint, and advanced process optimization capabilities.

Visit Nordson ASYMTEK at APEX booth #1925

Contact:
Nordson ASYMTEK

Roberta Foster-Smith
http://www.nordsonasymtek.com

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