Supports informed decision making when selecting materials

London. World Gold Council (WGC) is sponsoring a seminar entitled ‘Materials Science of Wire Bonding & Wire Bond Reliability' in conjunction with SEMI at SEMICON China 2010. This seminar is part of a new initiative by WGC to support reliable interconnection in semiconductor packaging through the use of gold bonding wire.

Gold wire bonding is the industry standard for high reliability interconnection in the electronics industry. Each year millions of electronic devices trust in gold bonding wire to deliver reliable performance.

Dr Richard Holliday, Director, Industrial at World Gold Council, says:
"This seminar will help to educate and inform engineers about the cost-effective use of gold in semiconductor packaging. A recent SEMI survey showed that semiconductor companies are considering a switch to copper, however there are serious reservations about product reliability and manufacturing productivity if this switch takes place. This seminar will provide useful and factual information about gold in the bonding wire process. It will help the industry understand how gold can still be viewed as a cost effective choice in many applications and how gold's inherent material properties are best suited to the wire bonding process."

The training seminar, on 17th March 2010, is offered at minimal cost to all attendees at the China Semiconductor Technology International Conference 2010 (CSTIC), one of the largest annual semiconductor technology conferences in China. The seminar has been designed by ProMat Consultants, a materials science consulting firm based in Singapore, in conjunction with WGC. For more information about the seminar please visit Semi website or contact SEMI China program@semi.org.cn.4131534. Registered Office: 22 Great James