We search for industry news, so you don't need to. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map   Industry and Technology News Index March 12, 2010  -  Click the title to read the full article. IC reverse engineering—a design team perspective It has been quite a bit of fun writing these IC Insider columns over the last year. Concurrently, one of us, Randy Torrance, has been invited ... EDN We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from EDN February 7, 2012 - Top Story News Steve Appleton in Retrospect Steve Appleton, who died Friday Feb 3, 2012, in a plane crash, worked for Micron Technology Inc throughout his professional career. And soon after he took the top job there in 1994 he became boss of the last US DRAM maker. As such it was a highly ... EDN February 7, 2012 - Industry News Global chip sales squeeze 0.4% annual growth Global sales of semiconductors grew in 2011 by 0.4% reaching a record value. The December results came in much as expected but produced a weak fourth ... EDN February 2, 2012 - Industry News CEA-Leti opens 3-D IC packaging service French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners ... EDN January 25, 2012 - Industry News Bullish Penn sees chip market growth of 8% in 2012 Malcolm Penn, founder and chief analyst with semiconductor market analysis firm Future Horizons Ltd, has predicted that the global chip market will ... EDN January 24, 2012 - Industry News Bullish Penn sees chip market growth of 8% in 2012 Malcolm Penn, founder and chief analyst with semiconductor market analysis firm Future Horizons Ltd, has predicted that the global chip market will ... EDN January 12, 2012 - Industry News EDA sales continued double-digit boom in Q311 The EDAC Market Statistics Service has announced that the EDA industry revenue increased 18.1% for 3Q11. Sequentially EDA revenue for 3Q11 increased ... EDN January 9, 2012 - Industry News ST-Ericsson describes three-chip stack ST-Ericsson and a French research institute will describe this week a chip stack made up of three die including a Wide I/O DRAM. The effort, using ... EDN January 6, 2012 - Top Story News Get Off the Sidelines Progress: It's what engineers do. They advance, they grow, and they move forward. To engineers, there is nothing more defeating than standing still or, worse, taking a step back. Yet, for many engineers, 2011 was a year ... EDN January 6, 2012 - Industry News Future of computers - Part 2: The Power Wall The Captain had the lard put on the logs in the boiler, and the old lady watched in excitement as the fire in the boiler grew hotter, the great ... EDN January 4, 2012 - Industry News Global chip sales continue to slip in November The three-month average of worldwide sales of semiconductors was $25.13 billion for the month of November 2011, a decrease of 2.4% from the prior ... EDN December 13, 2011 - Industry News Bill McClean: Don't broad-brush the semiconductor market Bill McClean, president of market-research company IC Insights, spoke to EDN in November on 2011's estimated semiconductor-industry growth, ... EDN December 13, 2011 - Industry News ST-Ericsson describes three-chip stack ST-Ericsson and a French research institute will describe this week a chip stack made up of three die including a Wide I/O DRAM. The effort, ... EDN December 9, 2011 - Industry News IEDM: Sony game exec lays out chip needs Chip makers need to advance image recognition, display, and MEMS technologies to deliver the next-generation of immersive gaming ... EDN December 5, 2011 - Industry News 3-D IC standards are great, but do we care? Next month's DesignCon 2012, which will take place in Santa Clara, CA, will host many interesting panels, including "Why do we need 3-D design standards ... EDN December 5, 2011 - Industry News US chip firms beat rivals in 2011, says IHS Chip companies from the Americas region, which in terms of the semiconductor industry is dominated by the United States, are set to ... EDN December 2, 2011 - Top Story News 3-D IC Standards Are Great, But Do We Care? Next month's DesignCon 2012, which will take place in Santa Clara, CA, will host many interesting panels, including "Why do we need 3-D design standards?" As cutting edge and exciting as that title sounds, it may ... EDN December 2, 2011 - Industry News US chip firms beat rivals in 2011, says IHS Chip companies from the Americas region, which in terms of the semiconductor industry is dominated by the United States, are set to ... EDN November 1, 2011 - Industry News Global chip sales show September growth The Japanese recovery and continued demand for mobile personal electronics helped the three-month average of worldwide sales of semiconductors in ... EDN October 25, 2011 - Industry News Cadence CEO: Chip execs eye China, India Chief executives of companies, including semiconductor companies, are in the process of asking themselves on how best to address the Chinese and ... EDN October 11, 2011 - Industry News IEF: Japan can rise again, says exec The Japanese semiconductor industry, which has been in decline for more than 20 years, needs to select key technology areas and refocus to ... EDN September 21, 2011 - Industry News Forecast Sees Hard Year, Fewer Chip Makers Under clouds of uncertainty about the global economy and mobile systems transitions, semiconductor sales will "muddle along" to growth of no more ... EDN September 9, 2011 - Industry News Chip-and-package co-design relieves pressure on complex designs The vise is closing down on design departments. Manufacturers want more capabilities in their products than ever before. It's imperative for ... EDN September 8, 2011 - Top Story News Q3 Wafer Starts Remaining Stable Third quarter wafer production starts for semiconductor firms remain mostly stable after significant cuts two months ago, according to a Wall Street analyst. Craig Berger, an ... EDN September 1, 2011 - Top Story News 3D ICs Without TSVs? Two assumptions have become accepted truths in SOC planning: first, that the way forward involves 3DICs; and second, that 3DICs require TSVs. One result has been a tremendous ... EDN September 1, 2011 - Industry News 3D ICs without TSVs? Two assumptions have become accepted truths in SOC planning: first, that the way forward involves 3DICs; and second, that 3DICs require TSVs ... EDN To find more articles from EDN, use the search form below. Home  |  About Us  |  Advertising  |  Advertising Rates  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2011 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.