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  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




Online Auction of Qimonda Portugal Back-End Equipment
PCD TechnologyA large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now…
GoIndustry DoveBid
  Corporate News Index
March 11, 2010

XYZTEC introduces Condor EZ: the next generation in bond testing

Gilroy, California XYZTEC, a leading global supplier of bond test equipment,is pleased to introduce the new Condor EZ, the next generation in bond testing solutions. The Condor EZ offers a single platform with multiple test capabilities allowing end-users the added flexibility of performing many types of tests all on one system. In addition to standard bond testing applications such as wire pull, ball shear, die shear, the Condor EZ has the capability to perform peel testing, push testing, and roller testing. All of these tests can be done on one test head that features four different measurement sensors. The system can perform mechanical shock testing by changing the test head for impact testing or ribbon peel testing of photovoltaic cells by using a USB tweezers.

The new Condor EZ joysticks are ergonomically friendly, easily move the XY stage to the desired position, and feature 12 logically arranged buttons for increased operator efficiency. All important software functions can be controlled by a single touch of a button to ensure simplicity. The Condor EZ software features onboard graphics and intelligent wizards, providing intuitive operator control as well as sophisticated SPC software thus ensuring complete documentation of the test protocol.

Contact:
XYZTEC


http://www.xyztec.com/

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March 11, 2010
XYZTEC introduces Condor EZ: the next generation in bond testing
XYZTEC is pleased to introduce the new Condor EZ, the next generation in bond testing solutions. The Condor EZ offers a single platform with ...
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March 5, 2010
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Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
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