|
|
|
|
March 11, 2010
XYZTEC introduces Condor EZ: the next generation in bond testing
Gilroy, California – XYZTEC, a leading global supplier of bond test equipment,is pleased to introduce the new Condor EZ, the next generation in bond testing solutions. The Condor EZ offers a single platform with multiple test capabilities allowing end-users the added flexibility of performing many types of tests all on one system. In addition to standard bond testing applications such as wire pull, ball shear, die shear, the Condor EZ has the capability to perform peel testing, push testing, and roller testing. All of these tests can be done on one test head that features four different measurement sensors. The system can perform mechanical shock testing by changing the test head for impact testing or ribbon peel testing of photovoltaic cells by using a USB tweezers.
The new Condor EZ joysticks are ergonomically friendly, easily move the XY stage to the desired position, and feature 12 logically arranged buttons for increased operator efficiency. All important software functions can be controlled by a single touch of a button to ensure simplicity. The Condor EZ software features onboard graphics and intelligent wizards, providing intuitive operator control as well as sophisticated SPC software thus ensuring complete documentation of the test protocol.
Contact:
XYZTEC
http://www.xyztec.com/
|
This page has been viewed 126 times. |
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.
Let us do the searching for you.
Get a Free Subscription to Semiconductor Packaging News
|
|
More from XYZTEC
|
|
To find more corporate news releases from XYZTEC, use the search form below.
|
|
|