We search for industry news, so you don't need to.
  Photo Resist Coating System
Featuring Ultrasonic Technology
Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
Ultrasonic Systems, Inc.
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map

White paper on die attach
Going Beyond Bulk Properties:
Full Wafer Die Attach White PaperEver wondered what's really going on with Die Attach thermal performance? Henkel unlocks the mystery…
Henkel Corporation




F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec
Viewpoint Index
March 2, 2010

Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC

image
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive.

In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities.

cyberTECHNOLOGIES continued to invest during the downturn and is emerging out of it as the strongest supplier of scanning optical 3D Surface Metrology Systems, with a strong revamped product portfolio and a further expanded team of highly qualified software and hardware engineers.

Through close cooperation with our customers and continued focus on our customers' needs we learnt that they require higher resolution and faster scanning systems with more flexibility and automation capabilities to allow them to inspect more samples and product at higher resolution.

Based on this input we developed a new line of fast, high resolution 3D Surface Metrology Systems, the cyberSCAN CT SERIES.

With their high speed magnetic linear x/y stages and the high performance chromatic confocal sensors that can measure on most any surface, we are able to address measurement and inspection needs in a much wider range of applications in many different industries.

Our customers measure samples as varied as solar cells, high performance graphite bearings, medical devices and sensors, hybrid devices, glass lenses, MEMS devices, fuel cells and fuel cell materials, any type of printed or dispensed device, epoxy and flux applications, ceramic, glass and many other types of substrates.

Advances in technologies require better materials and processes. Process improvements require capable metrology solutions with ever increasing requirements for precision, accuracy and speed.

cyberTECHNOLOGIES is positioned to provide its customers with the best cost/performance metrology systems in the industry across a wide range of applications.

Karl-Heinz Strass , Managing Director
cyberTECHNOLOGIES USA, LLC

This page has been viewed 412 times.
Click here to see all Viewpoints from
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC


More Viewpoint Comments Index
March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
More Viewpoint Comments Index


cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES




Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.