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Photo Resist Coating SystemUSI manufactures precision coating systems designed for semiconductor applications and the precise deposition of photo resist. Ideal for coating wafers with micro-vias and non-traditional wafer designs, learn more…
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Preventing Solar Cell Micro Cracks
Solar Soldering Application Note
Preventing Solar Cell Micro CracksStringing and bussing soldering can cause thermal stress and micro cracking of solar cells. A process to prevent damage and produce 1-2µm inter-metallic bonds between ribbon and cells must be identified & maintained. Learn more…
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wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
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Viewpoint Index
February 23, 2010

Daniel F. Baldwin, Ph.D., Founder, Engent

image
Daniel F. Baldwin, Ph.D., Founder, Engent
2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again.

Military and Homeland Defense budgets are defined and beginning to solidify, and while we are a long way from pre-2006 levels, we will see increasing programs in this market.

Additionally, our Industrial and Medical market place has continued to drive innovation as their new product launches cut through economic pressures. As a result, we see increased spending in the Medical, Military, and Industrial markets with a strong push for 3D integration and tighter geometries to accomplish smaller, faster, and lighter solutions.

The stagnant economy caused more dollars to be spent in the development cycles in 2009, which we are now seeing launch into production. The applications that require performance enhancements will lead the way out of the downturn by offering product features that will compel customers to ramp up their spending.

We have also seen a resurgence of mission critical products being built in the US again. The drive to meet new product requirements has allowed a US manufacturing solution to be a viable option and provide a better overall value as a total solution.

New designs are pushing the envelope on size and performance and are requiring burst development to production cycles which can be sometimes more efficiently executed in a stateside one-stop shop solution. This requirement forces a tight collaboration of supply chain partners working in consort to develop and deploy solutions that push the leading edge.

These technologies will quickly benefit the mainstream applications in the years to come as the packaging technologies get pushed across a larger landscape of applications.

The economy is not completely out of the woods yet as tight lending capital, high unemployment and Worldwide instability in foreign countries GNPs and currency are still daunting measures of a slow recovery.

Regardless, Engent is positive on the economic recovery, as such, Engent plans another year of growth and expansion as we have experienced every year since our inception.

Daniel F. Baldwin, Ph.D. , Founder
Engent

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March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
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Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK




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