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February 18, 2010


Metallization Lines by ASYS
Metallization LinesOver 7 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Learn more about ASYS Solar +1 866 GO 4 ASYS …
ASYS Group Americas Inc.

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Ultra Precision Micro Assembly
and High Performance Dispensing
Air-Vac DRS24Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more…
Air-Vac Engineering
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Need a Sub-Micron Bonder?
Evaluate before you buy
Sub-micron Die Bonder...not after, it's too late then. Don't rely on unproven claims, seeing is believing. Demand a full demo with your samples – we'll do it! Make the smart choice. Learn more…
Finetech
Top Story  
Applied Execs See Cause for Optimism
Applied Materials executives said equipment sales to a leading foundry accounted for a significant share of first-quarter silicon equipment ...
Semiconductor International

Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation
Industry News  
US: Fake parts threaten electronics market
The counterfeiting of electronic components continues to rise despite increased efforts at corporate and governmental levels to fight the ...
EE Times
Gartner: Western Europe PC Market Grew 4 % in 09 Q4
PC shipments in Western Europe totalled 20.2 million units in the fourth quarter of 2009, an increase of 4 per cent from the same period in ...
Gartner
Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and China subsidiary, Toshiba Semiconductor (Wuxi) Co. Ltd (TSW), have signed a definitive agreement with Nantong Fujitsu ...
Eetasia
Nokia remains top dog in handsets, despite smartphone competition
Samsung is credited by iSuppli as being the "star performer" in the global mobile handset market in 2009 as the only company among the top-five ...
EDN
Intel's RISC processor an upgrade over Itanium predecessor
Last week, Intel began shipping a new RISC processor based on its 65 nm manufacturing process. Though it will not start showing up in the market ...
TechRepublic
Near-threshold Computing: 100x Reduction In Power Consumption
Using Moore's law as the metric of progress has become misleading: starting around the 65-nm node, improvements in packing densities no ...
PhysOrg
SIA Hails Guilty Plea in Chip Counterfeiting Case
The Semiconductor Industry Association (SIA) is hailing a guilty plea in an ongoing prosecution of persons involved in the sale of counterfeit ...
Supply & Demand Chain Executive
AMD's big bet on Llano CPU+GPU
Last week I was at ISSCC, an annual chip conference in San Francisco. Intel tends to dominate these conferences, not only because it is the ...
ZDNet
Semiconductor chips power ahead
Lightweight laptops, dinky mobile phones and pocket-sized digital cameras: all commonplace technology today, thanks to the huge advances in the ...
Environmentalresearchweb
Axcelis Integra(TM) Dry Strip System Selected by Major Foundry for Advanced IC Manufacturing
Production Proven Platform Demonstrates Advantages in Productivity and Process Flexibility. Axcelis Technologies, Inc. (Nasdaq:ACLS), a ...
CNNMoney
Tablet commandments for PC makers
The Apple iPad is expected to help rejuvenate the tablet industry, with other PC makers also looking to cash in with their own slate products. ...
ZDNet Asia
Mitsubishi Claims Efficiency Record for Polysilicon Solar Cell
Mitsubishi Electric Corp achieved a cell conversion efficiency of 19.3% with a polysilicon solar cell measuring 15 x 15cm. The conversion ...
Tech-On
One-step graphene doping could enable complementary metal oxide graphene transistors
Researchers at the Georgia Institute of Technology have claimed a one-step process that produces both n-type and p-type doping of large-area ...
EDN
Tight supply imminent in memory market
The memory market is expected to suffer from shortage in 2010 and beyond due to rebound in memory demand; lack or under-investment of capital ...
EE Times India
Patent to dramatically improve cell phone performance
WiSpry Inc. in Irvine, a specialist in tunable radio frequency computer chips, has just been awarded a patent for technology that will ...
OCRegister
Microelectronics project to enhance lithography based yield
Eight leading institutions have launched a joint microelectronics research project in which they aim to develop innovative design methods and ...
New Electronics
Analyst boosts forecast for PC processor sales
Growth in unit sales of PC processors and PC servers will be stronger than expected this year, according to a report issued Wednesday (Feb. 17) by ...
EE Times
Verifying the border line between auto hardware, software
I have long been ardent fan of Toyota Motor Corp.'s manufacturing know-how. Toyota was the first car maker to streamlin manufacturing processes ...
EE Times
Multiple design contests in semiconductor and embedded systems design for Indian EEs
Now it's time for the electronics engineering students studying in the 8th semester of the final year B.E. in the colleges falling under VTU to ...
EE Herald

cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
Technology News  
Top technologies for the warfighter
Our third-annual look at commercial technologies coming to a battlefield near you. What started out as "This year's top trends affecting the ...
Military Embedded Systems
The future role of printing in plastic electronics
Dr Sean Smyth, a leading consultant for the digital and analogue printing industry, examines opportunities and challenges for printing ...
+Plastic Electronics

Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.

Corporate News Submit
Nordson DAGE Adds X-ray System Production Capabilities
Nordson DAGE is pleased to announce the completion of its new, entire X-ray system manufacturing line at its ISO 9001:2008 registered manufacturing ...
Nordson DAGE
Disruptive technologies pave the way to the future of digital imaging industry
Yole Developpement released a new report dedicated to CMOS Image Sensors Technologies & Markets. The aim of this study is to provide: Key ...
Yole Developpement
Record number of papers at SPIE reports imec's progress in advanced lithography
At next week's SPIE Advanced Lithography Conference being held February 22 - 26 in San Jose, California, imec technologists will contribute a ...
imec
Today's Sponsor

PacTech's Ultra-SB2 WLR
Volume Solder Ball Placement
PacTech's Ultra-SB2 WLRWafer level solder ball rework system for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip WLSCP applications. Integrated 2D-Inspection and reflow. Learn more …
PacTech

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Moisture Sensitive Devices (MSD's)
White paper on advanced solutions
Super DryThe influence of humidity on the reliability of components is underestimated. Moisture sensitive devices (MSDs) are encapsulated with plastic and organic materials causing atmospheric humidity to penetrate permeable packaging materials. Learn about dry cabinet solutions with this free white paper…
Super Dry®

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Down to 2 µm Automated Optical Inspection
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