We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers February 16, 2010 cyberTECHNOLOGIES extends lead in surface metrology for PV applications Expanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more… cyberTECHNOLOGIES Viscom's new wafer inspection system High accuracy inspection of bare wafers & MEMS Viscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects… Viscom Inc. Letters Submit PacTech's SB2-Jet Laser Solder Jetting System Sequential high speed soldering using laser-reflow with high substrate design and solder ball size flexibility. Fluxless, contactless at low thermal stress—ideal for flip-chip, MEMS, 3D-packaging and CSP/BGA's re-balling. Learn more… PacTech Top Story   Silicon Wafer Shipments Bounce Back in the Second Half of 2009 Worldwide silicon wafer area shipments decreased by 18% in 2009 when compared to 2008 area shipments, according to SMG in its year-end analysis ... Semi Moisture Sensitive Devices (MSD's) White paper on advanced solutions The influence of humidity on the reliability of components is underestimated. Moisture sensitive devices (MSDs) are encapsulated with plastic and organic materials causing atmospheric humidity to penetrate permeable packaging materials. Learn about dry cabinet solutions with this free white paper… Super Dry® Exclusive   Gold vs. Copper, Let the Debate Begin Semi recently announced the results of a study conducted by the World Gold Council. The study was conducted in order to to determine the extent of copper bonding wire programs in the industry and to identify the key issues and considerations related to decisions in selecting bonding wire material. Companies surveyed included both integrated device manufacturers (IDMs) and fabless ... Steve DeCollibus, Managing Editor Semiconductor Packaging News Industry News   Six things that surprised us at ISSCC The pervasive focus on power management, the lack of papers on nanotechnology and software and the slow recovery of attendance were ... EE Times Phase Transition Research Points to New Devices Using carbon nanotubes, University of Washington scientists have devised a way to explore how phase transitions function in fewer than three ... Semiconductor International Three reasons for projected memory shortages There is expected to be a tight supply of memory parts in 2010 and perhaps beyond. Why? Three factors: 1) A rebound in memory demand; 2) A ... EE Times Samsung to take on Apple with own iPad style tablet Samsung Electronics has plans for a Apple iPad style tablet PC, the company has revealed. "We will respond," said J.K. Shin, president of Samsung's ... Macworld UK Still trying to get the hang of it Hit hard by the recession, the semiconductor industry lost $40billion in 2008 and 2009, according to research company Gartner. But, in a recent ... New Electronics Globalfoundries & ARM Define Standard for Mobile Technology Platform Innovation Industry Leaders Set the Stage for 40% Increase in Computing Performance and 30% Improvement in Power Efficiency for Next-Generation Mobile Computing ... Market Watch New Smartphone Chips Pack a PC’s Punch A few years ago, who would have thought that phones would one day be running chips with PC-quality oomph? Today one such platform was ... GigaOm Inside Contactless claims first commercial NFC deployment Resulting from a partnership with Sagem Wireless, Inside Contactless SA announced it has deployed its portfolio of NFC technologies in a commercially ... EE Times Freescale says low-power MEMS smarter, too The user experience for mobile devices will soon get richer according to Freescale Semiconductor Inc., which announced its new generation of ... EE Times Rambus to Demonstrate Fastest Mobile Memory Architecture and Innovative Lighting Technologies Rambus will be showcasing live demos of its Mobile XDR(TM) memory architecture and new lighting technology, including MicroLens(TM) optical ... Market Watch Silicon revenues declined 41% in 2009: Shipments down 18% Worldwide silicon wafer area shipments hit rock bottom in the first quarter of 2009, but a strong recovery was noted in each subsequent ... Fabtech Chip Vendors Hope to Turn Phones Into HD Media Players Both Qualcomm and ST-Ericsson are demonstrating at Mobile World Congress concept smartphones that can connect to and play HD content on TVs. ... PC World Down to 2 µm Automated Optical Inspection The REVEAL IMAGER Series Provide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more… Vi TECHNOLOGY Technology News   HP Invents a 'Central Nervous System for Earth' and Joins the Smarter Planet Sweepstakes Just days after Cisco signaled it will horn into IBM's turf by rewiring an aging city in Massachusetts, Hewlett Packard announced this morning the ... Fast Company Wireless Everywhere and Programmable Designs Robert Cravotta’s article on technology inflection points highlights the idea that electronics industry progress is often driven more by added ... EDN Deep ultraviolet power boost at shorter wavelengths Researchers at Sensor Electronic Technology (SET) of Columbia, SC, USA have achieved a record 2mW of light output power in light-emitting ... Semiconductor Today First germanium laser could pave way for optical computers One of the issues of current chip design is the excessive power needed to transport and store ever increasing amounts of data. A possible solution ... Gizmag Efficient solar cells from silicon wires US researchers have designed a new silicon-based solar cell which uses 100 times less silicon than conventional photovoltaic devices. The system ... Chemistry World Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Corporate News Submit Imec and Holst Centre present ADC with record figure of merit At the International Solid State Circuit Conference, imec and Holst Centre report an ultra-low power 8 bit analog to digital convertor (ADC) ... Imec and Holst Centre DOSA For DC Power Expands Membership to 13 Companies with FDK Corp The Distributed-power Open Standards Alliance (DOSA) added FDK Corp. to its membership roster. FDK is a global electronic component and battery ... FDK Corporation Pfeiffer Vacuum acquires vacuum component manufacturer Pfeiffer Vacuum Technology AG announces the signing of a contract to acquire Trinos Vakuum-Systeme GmbH of Göttingen, Germany. Under the ... Pfeiffer Vacuum Technology AG Today's Sponsor Metallization Lines by ASYS Over 7 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Learn more about ASYS Solar +1 866 GO 4 ASYS … ASYS Group Americas Inc. Ultra Precision Micro Assembly and High Performance Dispensing Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more… Air-Vac Engineering Need a Sub-Micron Bonder? Evaluate before you buy ...not after, it's too late then. Don't rely on unproven claims, seeing is believing. Demand a full demo with your samples – we'll do it! Make the smart choice. Learn more… Finetech Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.