We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers February 11, 2010 cyberTECHNOLOGIES extends lead in surface metrology for PV applications Expanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more… cyberTECHNOLOGIES Viscom's new wafer inspection system High accuracy inspection of bare wafers & MEMS Viscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects… Viscom Inc. Letters Submit Why the Future of Reliability in Electronic Products Matters An expert and enlightening summary of a growing problem! In the college courses I teach ... George Riley FlipChips Dot Com PacTech's Low-Cost Wafer Bumping Services Quick-turn prototyping and mass-production Low-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more… PacTech Top Story   Amkor Joins Upswing Amkor Technology Inc. posted an improved bottom line and higher revenue in the fourth quarter and better year-over-year net income on nearly ... Phoenix Business Journal Moisture Sensitive Devices (MSD's) White paper on advanced solutions The influence of humidity on the reliability of components is underestimated. Moisture sensitive devices (MSDs) are encapsulated with plastic and organic materials causing atmospheric humidity to penetrate permeable packaging materials. Learn about dry cabinet solutions with this free white paper… Super Dry® Exclusive   Why the Future of Reliability in Electronic Products Matters One of the hallmarks of electronics manufacturing over the course of its history has been its relentless pursuit of making each new generation of products ever smaller while simultaneously increasing their performance. The reliability of those products was for many years, unquestioned and was the cornerstone of the industry's success. However, over the last decade or so, the electronics ... Joe Fjelstad, President Verdant Electronics Industry News   Mid-Range iPad to Generate Maximum Profits for Apple The mid-range, 3G-wireless version of Apple Inc.'s upcoming iPad is expected to carry a combined Bill of Materials (BOM) and manufacturing ... iSuppli Corporation Amkor says market rebounding, sees 1Q profit Amkor Technology Inc. predicted a first-quarter profit that is in line with analyst expectations. "We began the year with an unprecedented drop ... AP SMIC to raise 2010 capex, eyes return to profitability Semiconductor Manufacturing International Company has set a capex budget of US$330 million for 2010 compared to US$189.6 million last year ... Digitimes Agilent to sell network business to JDS Uniphase U.S. electronics testing equipment maker Agilent Technologies Inc (A.N) said it would sell its network solutions business to telecom equipment ... Reuters Google to build ultra-fast broadband networks Google Inc. plans to build a handful of experimental, ultra-fast broadband networks around the country to connect consumers to the ... AP Taiwan eases LCD, chip foundry China investments Some Taiwan LCD industry executives criticised government measures announced on Wednesday to ease restrictions on investments in China ... Reuters 12-inch wafers to be replaced by 18-inch in 2015, says Samsung VP Eighteen-inch wafers will replace 12-inch as the mainstream in 2015, according to Joo-Tai Moon, senior vice president of Samsung Electronics ... Digitimes Toshiba to resume $8.9 bln chip expansion Toshiba Corp will spend 800 billion yen ($8.9 billion) to build a new microchip plant, reviving plans that it had put on hold amid sluggish ... ForexYard Chips Ahoy: Vendors Show Off Their Latest Silicon Chipmakers converged on San Francisco to talk up their newest semiconductor products at the International Solid State Circuits Conference. Of ... HPC Wire EDA: Aging or Dying? As the Baby Boomer generation gets older and medical science becomes more advanced, the possibility of longer lives for all of us becomes more ... EE Times Intel, Renesas, Toshiba show mobile media chips Toshiba described a novel mobile media processor it is now sampling using stacked custom DRAM, one of a handful of such devices discussed at ISSCC ... EE Times Micron-Numonyx deal: What analysts are saying As expected, Micron Technology Inc. has agreed to acquire Numonyx Holdings B.V. in a stock transaction valued at $1.27 billion. There have been ... EE Times More buyers see higher chip prices More semiconductor buyers say chip prices are increasing and will continue to rise over the next three months, according to the Purchasing.com ... Purchasing Down to 2 µm Automated Optical Inspection The REVEAL IMAGER Series Provide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more… Vi TECHNOLOGY Technology News   Robust Design : Good, Fast, Cheap – pick two Reading Battar’s response to the introduction post for this series has suggested to me that it is worth exploring the relationship of the ... EDN TSMC's Chiang Sees History on Side of Gate-Last High-k Approach TSMC's decision to adopt a gate-last approach to high-k deposition was informed by history, said S.Y. Chiang, in charge of R&D at the foundry. ... Semiconductor International IBM increases low-cost solar cell efficiency Thin-film solar cells hold the promise of a cheap, renewable energy source that could make fossil fuels obsolete, but thus far the cells' reliance ... EE Times Imaging Materials from Biology to Electronics using PFM and NTEGRA Instruments NT-MDT Co. was established in 1991 with the purpose to apply all accumulated experience and knowledge in the field of nanotechnology to ... A to Z of Nanotechnology Micro Dispensing Technology Technical white paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper… DL Technology Corporate News Submit Imec and Holst Centre achieve breakthrough in battery-less radios Atthe International Solid State Circuit Conference, imec and Holst Centre report a 2.4GHz/915MHz wake-up receiver which consumes only 51µW power ... Imec and Holst Centre National Hybrid Terminal+ Compact Multi-protocol Data Bus Interface API Technologies Corp. announced the release of Terminal+, the newest National Hybrid 1553 data bus product. The compact National Hybrid ... API Technologies Corp. The second half of 2010 faces shortage conditions that should be resolved in 2011 Yole Développement updated its new markets & technological study dedicated to sapphire industry. Yole's report details major market ... Yole Développement Today's Sponsor Metallization Lines by ASYS Over 7 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Learn more about ASYS Solar +1 866 GO 4 ASYS … ASYS Group Americas Inc. 5 Micron Placement Capable! Small Footprint, Low Cost The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more… Air-Vac Engineering Need a Sub-Micron Bonder? Evaluate before you buy ...not after, it's too late then. Don't rely on unproven claims, seeing is believing. Demand a full demo with your samples – we'll do it! Make the smart choice. Learn more… Finetech Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA Copyright © 2009 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.