We search for industry news, so you don't need to.   Home  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers February 10, 2010 Bringing the Best Together Ablestik and Emerson & Cuming join Henkel Henkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more … Henkel Corporation cyberTECHNOLOGIES extends lead in surface metrology for PV applications Expanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more… cyberTECHNOLOGIES Letters Submit Viscom's new wafer inspection system High accuracy inspection of bare wafers & MEMS Viscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects… Viscom Inc. Top Story   Micron to Acquire Chipmaker Numonyx Micron Technology Inc. agreed to buy Numonyx Holdings BV bolstering its flash-chip business. Micron will issue 140 million shares to Numonyx's ... BusinessWeek PacTech's PacLine 300 Electroless Ni Plating System Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more… PacTech Viewpoint 2010   Tim McNulty, CEO and President, Harbor Electronics, the board division of Multitest We prepared for 2010 by not slowing down in 2009. As the leader in the prototype PCB business for the semiconductor test market, we cannot afford to fall behind the technology curve or lose pace with our customers' requirements. We continued to engage with customers as part of their R&D pipeline, and continued to invest in new equipment, our people and our processes. Tighter capital expenditure budgets meant we had to scrutinize our ...   Industry News   Major IC backend houses report stronger-than-expected revenues IC packaging specialist Advanced Semiconductor Engineering (ASE) saw consolidated revenues remain almost flat on month in January, whereas ... Digitimes Electrons On The Brink Just as the heartbeats of today's electronic devices depend on the ability to switch the flow of electricity in semiconductors on and off ... Product Design & Development 12-inch wafers to be replaced by 18-inch in 2015 Eighteen-inch wafers will replace 12-inch as the mainstream in 2015, according to Joo-Tai Moon, senior vice president of Samsung Electronics ... Digitimes Samsung hogging litho supply chain South Korea's Samsung Electronics Co. Ltd. could boost its capital spending amid the IC recovery. In the process, Samsung is also procuring ... EE Times SMI Confirms Media Reports Of Capital Injection Plans Semiconductor Manufacturing International Corp. confirmed media reports of a possible capital injection plan and revealed that it is currently ... RTT News Hurt by TSMC settlement, SMIC spills more red ink Dragged down by charges associated with settling litigation with rival Taiwan Semiconductor Manufacturing Co., Chinese foundry SMIC announced ... EE Times Semiconductor industry set to boom The global market for semiconductors is set for two years of growth at more than 20% per annum, according to bullish forecasts from Malcolm Penn, ... New Electronics Intel Atom Netbooks Get Whole-disk Encryption Netbook users worried about storing sensitive data on their portables are being offered the world's first whole-disk encryption that will run ... PC World Moisture Sensitive Devices (MSD's) White paper on advanced solutions The influence of humidity on the reliability of components is underestimated. Moisture sensitive devices (MSDs) are encapsulated with plastic and organic materials causing atmospheric humidity to penetrate permeable packaging materials. Learn about dry cabinet solutions with this free white paper… Super Dry® Technology News   Chip links hit 20 Gbits/s, power lows at ISSCC Researchers showed advances driving wider, faster and lower power chip-to-chip interconnects in a session at the International Solid State ... EE Times Smallest Fingerprint Matching Module Features OKI Single Chip Solution Postage stamp-sized biometric module utilizes OKI's single-chip fully integrated fingerprint authentication system; factory programming ... IT News Online Massively parallel computing systems are coming, but what issues need to be solved? Embedded designers will only be able to exploit the potential of multicore processor architectures if the applications software takes advantage of ... New Electronics Compact Inclinometers leverage MEMS technology Available in single- and dual-axis versions, ASM's POSITILT® PTAM20 series uses MEMS technology and is suited for OEM applications. Measurement ... ThomasNet Industrial News Room Silicon good to 2024, graphene to succeed The ISSCC has started in San Francisco with keynote speaker James Meindl, professor microelectronics, making precise predictions about the future ... ZDNet UK Inductive coupling packs flash drive in a chip A researcher from Keio University in Japan showed a way to put an entire solid-state disk in the footprint of a single chip in an evening talk at ... EE Times Down to 2 µm Automated Optical Inspection The REVEAL IMAGER Series Provide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more… Vi TECHNOLOGY Corporate News Submit Imec and Holst Centre report ultra-low power heart activity signal processor Leuven – At the International Solid State Circuit Conference, imec and Holst Centre report an analog-signal processor ASIC – in short ASP ... Imec and Holst Centre Aries' BGA Switch-A-Pitch Adapters Enable Cost-Effective Use Aries Electronics recently added new BGA Switch-A-Pitch adapters that allow for smaller pitch devices to be used with larger pitch boards ... Aries Electronics Today's Sponsor Improve Your Uptime High Precision Dispense Tips The DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more... DL Technology Metallization Lines by ASYS Over 7 GW installed Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Learn more about ASYS Solar +1 866 GO 4 ASYS … ASYS Group Americas Inc. 5 Micron Placement Capable! Small Footprint, Low Cost The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. 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