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February 18, 2010 - Click the title to read the full article.
Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and China subsidiary, Toshiba Semiconductor (Wuxi) Co. Ltd (TSW), have signed a definitive agreement with Nantong Fujitsu ...
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February 18, 2010 - Industry News
Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and China subsidiary, Toshiba Semiconductor (Wuxi) Co. Ltd (TSW), have signed a definitive agreement with Nantong Fujitsu ...
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Consumer products, such as cellphones, portable media players, digital cameras, DTVs and digital STBs, are driving the growth of electronics ...
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STMicroelectronics and wireless sensor provider Ball-IT Oy have announced a MEMS-based wireless motion-control device. The announcement said this golf ball-sized device can operate as a ...
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November 22, 2006 - Technology News
Rambus India achieves first silicon success
Rambus Inc. announced it has released the first PHY high-speed interface design from its Bangalore India Design Center. According to the press ...
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November 20, 2006 - Technology News
Freescale, Celestica, Wavesat partner in WiMAX ref design
Celestica has entered a pre-existing collaboration between Freescale Semiconductor and Wavesat to enhance a platform that enables customer ...
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October 26, 2006 - Industry News
China's LCD makers to catch up with Taiwan, South Korea
LCD makers in mainland China will catch up with its counterparts in Taiwan and South Korea five years from now, aid Ching-Siang Liao, chairman of ...
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September 26, 2006 - Technology News
Wireless infrastructure "wrong playing field" for GaN, says ABI analyst
RF power semiconductors for the wireless infrastructure sector may not be the best opportunity for companies developing and making devices using ...
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September 21, 2006 - Industry News
LED makers wait for stabler market before capacity expansion
LED manufacturers recently disclosed they will not immediately expand their capacities until the market situation shows high demand potential within ...
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August 4, 2006 - Technology News
Freescale cuts die area, thickness with new chip packaging tech
In an industry obsessed with miniaturization, Freescale Semiconductor Inc. has high hopes for a packaging technology that could radically alter the ...
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July 18, 2006 - Technology News
OLEDs see action in mobile future
Researchers looking into reflective and emissive display technologies hope to turn their fascination with organic light-emitting diodes into real ...
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July 18, 2006 - Technology News
Re-engineering the obsolete semiconductor
In high-reliability applications, new parts can fail in equipment that's exposed to high heat, vacuum or other environmental ...
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July 14, 2006 - Technology News
Rambus, Matsushita sign patent license agreement
Rambus Inc., a provider of high-speed interface technology, announced it has signed a new patent license agreement with Matsushita Electric Industrial ...
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June 30, 2006 - Technology News
IME, SiOptical to develop fab tech with Chartered
The Singapore Agency for Science, Technology and Research's Institute of Microelectronics (IME) and U.S.-based technology company SiOptical Inc. ...
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