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  New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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Die attach, flip chip placement, & SMT in one machine
CX-1The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more…
Juki Automation Systems




Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK
  Industry and Technology News Index
February 18, 2010  -  Click the title to read the full article.

Nokia remains top dog in handsets, despite smartphone competition
Samsung is credited by iSuppli as being the "star performer" in the global mobile handset market in 2009 as the only company among the top-five ...
EDN
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September 2, 2010 - Industry News
Gartner ups 2010 semiconductor revenue growth estimate to 31.5%
Gartner brings its 2010 semiconductor revenue forecast up to $300 billion and reports that while 2011 will also see growth, it is expected to see ...
EDN
August 27, 2010 - Industry News
Samsung could overtake Intel in IC sales by mid-decade
Expansions in Samsung's IC business and capital expenditures could move the company up from No. 2, making it the world's largest semiconductor ...
EDN
August 26, 2010 - Industry News
Designing for EOL with an ASIC
In industries where product life cycles last a decade or more, the challenges and costs associated with component obsolescence and EOL (end ...
EDN
August 25, 2010 - Industry News
Inventory bubble not a concern, iSuppli says
As demand is expected to continue to increase in the near term, the market research company is not alarmed by rising electronics supply chain ...
EDN
August 25, 2010 - Top Story News
Wafer-level Packaging Opportunities
wafer.jpg
Packaging technologies are facing a whole host of requirements, including a call for increased functionality, tighter interconnect densities, smaller chip sizes, and higher ...

EDN
August 23, 2010 - Industry News
IMEC touts silicon-germanium MEMS, gallium-nitride-on-silicon tech
IMEC highlighted the capabilities of its silicon-germanium-on MEMS-technology platform at Semicon West last month in San Francisco. It also ...
EDN
August 20, 2010 - Industry News
MIT spin-out claims probability processing circuits can offer 1000x efficiencies in cost, power, size
Lyric Semiconductor Inc has emerged from stealth mode to launch what it is calling probability processing technology, which it believes will in ...
EDN
August 20, 2010 - Industry News
PC MPU sequential Q2 growth more than double average for the qtr
In Q2, Intel earned 80.7% unit market share, a loss of 0.3%; while AMD earned 19%, a gain of 0.2%; and VIA Technologies earned 0.3%. Worldwide PC ...
EDN
August 18, 2010 - Industry News
Outsourced chip design starts grew as percentage of total design starts in 2009
Chip design outsourcing suffered heavily due to the economic recession, but benefited relatively as chip vendors faced with staffing shortages ...
EDN
August 13, 2010 - Industry News
ROHS recast: Electronics industry braces for further regulation
An expected recast of the ROHS (restriction of hazardous substances) environmental directive will likely carve away exclusions and possibly ...
EDN
August 11, 2010 - Industry News
Plastic 'spintronics' alternative to traditional semiconductors
Researchers at Ohio State University demonstrate what they claim to be the first plastic computer memory device that utilizes the spin of ...
EDN
August 10, 2010 - Industry News
Semiconductor capacity expected to increase through 2012
Gartner continues to estimate more than 83% growth in semiconductor capacity this year after analysis shows continuing growth in Q2. The ...
EDN
August 9, 2010 - Industry News
NXP IPO to raise $476M, CEO discusses challenges, opportunities
While ranking as one of the largest IPOs in the United States so far this year, the offering comes in below expectations. NXP's CEO talks to EDN ...
EDN
August 3, 2010 - Industry News
First half 2010 sales up more than 50%
A report from the SIA is the second in a week making very positive statements on the first half of the year. Global semiconductor sales ...
EDN
August 2, 2010 - Industry News
2010 sales strength shows in memory, foundry industries
IC Insights reports most large memory and foundry companies showed growth in a ranking of the top semiconductor industry companies. IC Insights ...
EDN
July 29, 2010 - Industry News
Intel says light beams can replace electronic signals for future computers
The company said it has developed a research prototype employing extremely thin and light optical fibers and representing the world's ...
EDN
July 23, 2010 - Industry News
Apple semiconductor spending expected to increase 54% in 2010
Apple is expected to become the world's second largest OEM semiconductor buyer in 2011 and could become the top semiconductor spender in 2012, ...
EDN
July 23, 2010 - Industry News
Equipment orders at the highest level since August 2006
The past 12 consecutive months of book-to-bill ratios over 1.0 indicate the consistent customer demand for North America-based manufacturers of ...
EDN
July 22, 2010 - Industry News
CEO on Mentor's role in IC and system design plus test
In a wide-ranging interview at Semicon West, Walden C Rhines, chairman and CEO of Mentor Graphics, addressed the challenges the EDA and ...
EDN
July 16, 2010 - Top Story News
The Time Is Now for 3-D Stacked Die
As the semiconductor industry moves from "more Moore" to "more than Moore," 3-D-stacked-die implementations will become critical for implementing ...
EDN
July 13, 2010 - Top Story News
Semi Equipment Sales Expect 96% Growth in 2010
The recovery is well under way and secure in the semiconductor equipment market, according to the latest data from VLSI Research Inc. The research ...
EDN
July 7, 2010 - Industry News
Hon Hai plans on becoming LCD powerhouse
The soaring shipments of flat-panel TVs have LCD panel suppliers, EMS companies, and OEMs moving to tighten electronics supply chains in ...
EDN
June 28, 2010 - Industry News
Electronics supply chain inventory leaner than current levels indicate
Supplier capacity is straining to keep up with downstream demand, resulting not only in long lead times but also in shortages for many commodity ...
EDN
June 28, 2010 - Industry News
Path-specific derating to reduce timing pessimism: a proposal
Reducing your pessimism about timing uncertainty as the design progresses can speed timing closure. This article proposes few methods to speed the ...
EDN
June 25, 2010 - Industry News
Samsung on pace for at least $30B semiconductor sales in 2010
IC Insights Inc has high expectations for Samsung in 2010. The market research company reported Thursday that Samsung is on pace for at least ...
EDN
To find more articles from EDN, use the search form below.


Preventing Solar Cell Micro Cracks
Solar Soldering Application Note
Preventing Solar Cell Micro CracksStringing and bussing soldering can cause thermal stress and micro cracking of solar cells. A process to prevent damage and produce 1-2µm inter-metallic bonds between ribbon and cells must be identified & maintained. Learn more…
OK International




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