We search for industry news, so you don't need to. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map   Industry and Technology News Index February 18, 2010  -  Click the title to read the full article. Verifying the border line between auto hardware, software I have long been ardent fan of Toyota Motor Corp.'s manufacturing know-how. Toyota was the first car maker to streamlin manufacturing processes ... EE Times We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from EE Times February 3, 2012 - Industry News Lines blurring between digital, analog design worlds Lines are blurring between the once distinct areas of digital and analog design, necessitating new tools and new ways of design collaboration, ... EE Times February 3, 2012 - Industry News U.K. to spend $120 million on graphene institute The U.K. government has said it will spend £70 million (about $120 million) to fund a national institute of graphene research and commercialisation ... EE Times February 3, 2012 - Top Story News TSMC Plans 3-D IC Assembly Launch Early 2013 Leading IC foundry Taiwan Semiconductor Manufacturing Co. Ltd. plans to announce 3-D IC assembly service as a general offering at the beginning of 2013. The technology is called COWOS internally, standing for chip on wafer on substrate and Marced ... EE Times February 3, 2012 - Industry News The R&D credit doesn't work The R&D tax credit expired on Dec. 31, 2011, and its passing produced hardly a noticeable ripple throughout the high-tech industry. That's not because ... EE Times February 2, 2012 - Industry News Broadcom beats estimates Chip vendor Broadcom Corp. reported fourth quarter results and gave first quarter guidance that beat analysts' expectations. Broadcom reported fourth ... EE Times February 2, 2012 - Industry News Wanted: 3-D IC standards within six months Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving ... EE Times February 1, 2012 - Industry News CEA-Leti opens 3-D IC packaging service French research institute CEA-Leti has announced the launch of a 3-D packaging platform and service that provides industrial and academic partners ... EE Times February 1, 2012 - Top Story News Wanted: 3-D IC Standards Within 6 Months Standards for 3-D chip stacks need to be in place within six months to stay ahead of chips rolling out in 2013, said a Qualcomm executive driving some of the efforts. The good news is Jedec released in early January an initial standard for Wide I/O ... EE Times January 31, 2012 - Industry News Automating the MEMS design processes With the market for micro-electro-mechanical system (MEMS) chips growing at a 50 percent annual growth rate, according to Goldman Sachs (New York), ... EE Times January 30, 2012 - Top Story News TSMC Returns Fire Over 28-nm Process Issues Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has hit back at analysts who have said it has yield problems with its 28-nm CMOS manufacturing processes. Maria Marced, president of TSMC Europe, repeated what has been said before by herself and other ... EE Times January 30, 2012 - Industry News Foundry, logic customers drive KLA orders rebound Semiconductor capital equipment vendor KLA-Tencor Corp. posted declines in sales and profit for the quarter ended Dec. 31, but reported a significant ... EE Times January 30, 2012 - Industry News Globalfoundries CEO says company is back on track Globalfoundries CEO Ajit Manocha has praised his firm for what he called a "remarkable quarter" in Q411, and promised that the foundry was on track ... EE Times January 30, 2012 - Industry News Rebuilding America: Proposals emerge to fix 'dysfunctional' R&D tax credit As the debate over how to revive U.S. manufacturing heats up, tax and other proposals are emerging to provide incentives for technology companies to ... EE Times January 27, 2012 - Industry News Micron's president to retire D. Mark Durcan, president and chief operating officer at memory chip vendor Micron Technology Inc., will step down at the end of Micron's current fiscal ... EE Times January 27, 2012 - Industry News LSI beats estimates Storage and networking chip vendor LSI Corp. delivered fourth quarter sales and first quarter guidance that exceeded analysts' expectations. LSI reported ... EE Times January 27, 2012 - Industry News Teradyne reports uptick in orders in Q4 Automatic test equipment vendor Teradyne Inc. reported fourth quarter sales that exceeded analysts' expectations and said order bookings improved by ... EE Times January 27, 2012 - Industry News Fab tool spending outlook improving, says Lam CEO Wafer fab equipment spending is likely to decline in 2012 compared to 2011, but the magnitude of that decline appears a lot smaller than it did a ... EE Times January 27, 2012 - Industry News Teradyne reports uptick in orders in Q4 Automatic test equipment vendor Teradyne Inc. reported fourth quarter sales that exceeded analysts' expectations and said order bookings improved by more ... EE Times January 26, 2012 - Top Story News Fab Tool Spending Outlook Improving Wafer fab equipment spending is likely to decline in 2012 compared to 2011, but the magnitude of that decline appears a lot smaller than it did a few months ago, according to Martin Anstice, president and CEO of semiconductor equipment vendor Lam ... EE Times January 26, 2012 - Industry News Elpida announces ReRAM chip, aims to enter market 2013 Struggling DRAM maker Elpida Memory Inc. has announced the development of a non-volatile resistance memory (ReRAM) prototype. The company said it plans ... EE Times January 26, 2012 - Industry News Fab tool book-to-bill improves again North America-based semiconductor equipment manufacturers posted a book-to-bill ratio of 0.88 in December, up from a final book-to-bill of 0.83 in ... EE Times January 26, 2012 - Industry News Israel gives Intel ultimatum on fab grant The Israeli government is attempting to force Intel Corp.'s hand on a decision to potentially build a new fab in the north of the country in ... EE Times January 25, 2012 - Industry News Apple posts record sales, earnings Apple Inc. reported its highest ever quarterly sales and earnings, thanks to record sales of its iPhones, iPads and Macs. "We're thrilled with our ... EE Times January 25, 2012 - Industry News Engineering salaries on the rise Salaries in the tech sector, especially for engineers, are at their highest level since 2008, according to a recent survey, with average yearly pay for ... EE Times January 25, 2012 - Industry News Elpida in merger talks with Micron, Nanya Elpida Memory Inc., the troubled Japanese DRAM maker, is in the final stage of discussions about a merger with U.S. memory chip maker Micron Technology ... 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