We search for industry news, so you don't need to. Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map   Industry and Technology News Index February 17, 2010  -  Click the title to read the full article. Fluid dynamics analysis tunes up IC package design Most people imagine integrated circuit designers spending their days laying out unimaginably small, complex features on silicon. But the IC ... Electro IQ We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Electro IQ February 7, 2012 - Industry News Record semiconductor sales in 2011 The Semiconductor Industry Association (SIA) shows 2011 worldwide semiconductor sales increased 0.4% year-on-year. This comes despite natural ... ElectroIQ February 7, 2012 - Industry News SUSS wafer bonder/debonder features up to 6 modules in new generation Semiconductor process equipment maker SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, ... ElectroIQ February 2, 2012 - Industry News Tessera expects MEMS optics design win in smartphones early in 2012 Tessera Technologies Inc. expects a mobile phone design win for its micro electro mechanical system (MEMS) optical imaging technology in H1 2012. The ... ElectroIQ February 1, 2012 - Industry News CEA-Leti launches 3D semiconductor packaging platform CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for ... ElectroIQ January 27, 2012 - Industry News Thai flood update: HDD production returning at expected pace The late-2011 flooding in Thailand caused major disruptions in the semiconductor and electronics manufacturing communities, most acutely ... ElectroIQ January 24, 2012 - Industry News ISS: Top Ten Economic Trends in 2012 The economic outlook for the world is dismal, the semiconductor industry has consolidated and matured to the point where it’s looking for tips from the ... ElectroIQ January 23, 2012 - Industry News Fabs in high-risk zones, 450mm, 3D IC themes of Semico's Semiconductor Fab Database 36% of semiconductor fabs are in high-risk zones, finds Semico in its Semiconductor Updated Fab Database. Semico notes the industry disruptions ... ElectroIQ January 18, 2012 - Industry News 2.5/3D Headlines at the 2011 RTI ASIP Research Triangle Institutes 3-D Architectures for Semiconductor Integration and Packaging Conference, or 3D ASIP normally finishes off the '3D conference ... ElectroIQ January 18, 2012 - Industry News ISS kicks off with IC industry reality talks With an official registration of 261 attendees, more than double 2011, the 2012 Industry Strategy Symposium (ISS 2012) kicked off today for ... ElectroIQ January 18, 2012 - Industry News Semiconductor inventory correction balancing out early in 2012 Semiconductor buyers have reduced orders under combined forces of moderately high inventory in the electronics supply chain and ... ElectroIQ January 17, 2012 - Industry News ISS kicks off with IC industry reality talks With an official registration of 261 attendees, more than double 2011, the 2012 Industry Strategy Symposium (ISS 2012) kicked off today for semiconductor ... ElectroIQ January 16, 2012 - Industry News Apple shares list of suppliers For the first time, Apple Inc. has publicly published a list of over 150 companies that the electronics giant says represent 97% of its procurement ... ElectroIQ January 16, 2012 - Industry News DRAM oversupply could worsen in 2012 The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, showing a counter-trend to the overall ... ElectroIQ January 16, 2012 - Industry News DRAM oversupply could worsen in 2012 The dynamic random access memory (DRAM) market is encountering an "alarming" rise in inventory, showing a counter-trend to the overall ... ElectroIQ January 13, 2012 - Industry News Zymet PoP underfill offers lower viscosity, CTE for finer pitches Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies. The underfill boasts low viscosity and ... ElectroIQ January 13, 2012 - Industry News Semiconductor inventory correction balancing out early in 2012 Semiconductor buyers have reduced orders under combined forces of moderately high inventory in the electronics supply chain and deteriorating macroeconomic ... ElectroIQ January 12, 2012 - Top Story News Packaging Houses Gain from More Device Complexity Increased I/O density on chips, power/performance requirements, yield/cost requirements and form factor constraints (mobile) are coming to push increased use of flip chip, 2.5D and 3D technologies. This trend benefits the packaging subcontractors ... ElectroIQ January 6, 2012 - Industry News MEMS sensors in integrated smart systems Recent advances in micro electro mechanical system (MEMS) sensor technology and manufacturing have enabled high-performance, small, low-cost sensors ... ElectroIQ January 5, 2012 - Top Story News Foundry-to-Packaging Cooperation for 22nm As the semiconductor industry moves into the 22nm silicon technology node, device fabrication is not the only challenge that the industry will face. According to the International Technology Roadmap for Semiconductors (ITRS), a porous ... ElectroIQ January 4, 2012 - Top Story News Will 22nm Need a Mid-Node? In 2011, the hot topic was whether semiconductor manufacturing would move to metal gate first or gate last. Today, this is still a hot topic, although I posit that everyone will use gate-last manufacturing at 20nm. Currently, 22nm ... ElectroIQ January 4, 2012 - Industry News 3D integration key to 22nm semiconductor devices 3D IC integration techniques offer many benefits, the most notable being smaller footprint, lower power and higher bandwidth. From a cost standpoint ... ElectroIQ January 3, 2012 - Industry News 3D integration key to 22nm semiconductor devices 3D IC integration techniques offer many benefits, the most notable being smaller footprint, lower power and higher bandwidth. From a cost standpoint ... ElectroIQ January 3, 2012 - Industry News Will 22nm need a mid-node? In 2011, the hot topic was whether semiconductor manufacturing would move to metal gate first or gate last. Today, this is still a hot topic, although ... ElectroIQ January 3, 2012 - Industry News TSMC repeats call for foundry-centric 2.5/3D industry At the recent 7th annual RTI 3-D Architectures for Semiconductor Integration and Packaging (3D ASIP) Conference in Burlingame CA, the "buzz" centered ... ElectroIQ December 29, 2011 - Industry News At 22nm, leave chip layout to the experts The transition from 32nm to 22nm silicon will have a major impact on the semiconductor design community. The most obvious is the increase in ... ElectroIQ To find more articles from Electro IQ, use the search form below. Home  |  About Us  |  Advertising  |  Advertising Rates  |  Calendar  |  Corporate News Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. 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