February 1, 2012 - Industry News
Tool Order: Lam Research picks-up equipment orders from TSMC and UMC
After the Chinese New-Year holidays, both leading Taiwan-based foundries, TSMC and UMC have got back to work early, placing orders with Lam ...
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January 10, 2012 - Industry News
Capital spending strongest in first half of year, says Deutsche Bank
The strong spurt in spending at semiconductor foundries so early in the year means that Deutsche Bank has revised its CapEx spending forecast for the ...
Fabtech
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January 9, 2012 - Industry News
KLA-Tencor receives multiple orders from Taiwan's top foundries
Both TSMC and UMC have placed purchase orders with KLA-Tencor this week, enabling the metrology and yield specialist to record bookings of almost ...
Fabtech
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January 5, 2012 - Industry News
Tool Order: TSMC kicks of 2012 with equipment purchase spree
Perhaps semiconductor equipment suppliers are offering January sales like the retail trade as the largest foundry in the world; TSMC has gone on ...
Fabtech
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December 14, 2011 - Industry News
Semi equipment bookings down 29% in third quarter
Worldwide semiconductor equipment bookings continued its strong decline in the third quarter of 2011, according to the latest figures from SEMI. ...
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December 14, 2011 - Industry News
Tool Order: UMC ends conservative year of spending with a flurry
Taiwan-based foundry, UMC has kept a tight reign on capital spending in 2011, advising in the third quarter that CapEx would be restricted to $1.8 billion ...
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December 12, 2011 - Industry News
Wacker's Siltronic division to shut down wafer production site in Hikari, Japan
Wacker Chemie subsidiary Siltronic has announced plans to cease wafer production at its Hikari, Japan facility in an effort to streamline its ...
Fabtech
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December 7, 2011 - Industry News
EV Group ships IQ Aligner system to Asahi Kasei Group
Wafer bonding and lithography equipment supplier EV Group has been tapped for one of its tools by Asahi Kasei E-Materials Corp. EV Group has shipped an IQ ...
Fabtech
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October 24, 2011 - Industry News
Precipitous drop in semiconductor equipment bookings in September
Bookings took a bashing in September, according to the latest monthly book-to-bill figures released by SEMI. North America-based manufacturers ...
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October 4, 2011 - Industry News
Japan helps lacklustre semiconductor sales growth in August
Semiconductor manufacturing recovery in Japan and the subsequent boost to overall semiconductor sales helped slightly in August, according to the ...
Fabtech
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September 2, 2011 - Industry News
Tool Order: TSMC purchases wafer bonding equipment from EV Group
A significant number of orders over a decent period were placed by TSMC for what is believed to be for wafer bonding equipment from EV Group. The ...
Fabtech
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August 3, 2011 - Industry News
Samsung Electronics snaps-up STT-RAM memory developer Grandis
Spin transfer torque random access memory developer, Grandis is being acquired by Samsung Electronics. The Silicon Valley-based firm will be merged ...
Fabtech
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July 18, 2011 - Industry News
CEA-Leti and Entegris start 2-year study into cross-molecular contamination from wafer to carriers
Citing the introduction of a range of new materials for advanced semiconductor fabrication processes, CEA-Leti and Entegris are to study ...
Fabtech
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July 15, 2011 - Industry News
Despite tool ordering 'pause,' ASML still on target to exceed €5 billion
ASML reported record quarterly revenue for the second quarter of 2011. Sales were €1.529 billion, compared to €1,452 billion in the previous quarter. ...
Fabtech
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June 22, 2011 - Industry News
Gartner lowers 2011 semiconductor forecast
Inventory corrections expected in the third-quarter of the year, due to 'friction in the supply chain' as a result of 'residual effects' ...
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May 27, 2011 - Industry News
TSMC readies for double patterning at the 20nm node
At the upcoming Design Automation Conference (DAC) in San Diego California, TSMC is to showcase its 20nm node 'Transparent Double Patterning' ...
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May 26, 2011 - Industry News
Fabless companies extend research programs at imec
Several fabless semiconductor firms such as Qualcomm, Nvidia and Altera are working ever closer with imec on future challenges for semiconductor ...
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May 23, 2011 - Industry News
SEMI book-to-bill ratio continues to climb
The upward trend has continued through to April with the book-to-bill ratio reaching 0.98, up from 0.85 at the beginning of the year. North America-based ...
Fabtech
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May 20, 2011 - Industry News
Advanced probe cards lead sales growth according to VLSI Research
A new report from VLSI Research highlights that there was a marked switch away from cantilever probe cards in favour of advanced probe cards in ...
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May 13, 2011 - Industry News
Major foundry orders US$10 million worth of Bruker metrology tools
Bruker has received over US$10 million in orders for its metrology tools from an unnamed global semiconductor foundry. Bruker will supply a range ...
Fabtech
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May 12, 2011 - Industry News
Renesas to resume Naka factory operations earlier than planned
Following disruption to production after the earthquake, tsunami and nuclear disaster in Japan in March, Renesas Electronics has released a ...
Fabtech
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April 29, 2011 - Industry News
Elpida to ramp 30nm DRAM in May
Elpida Memory is on target to start the ramp of 30nm DRAM at its Hiroshima Plant as well as at Taiwan-based Rexchip Electronics Corporation starting ...
Fabtech
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April 27, 2011 - Industry News
SPTS wins multi-systems order for through silicon via TSV structures
A multi-system and product order has been hailed as marks a new market penetration for SPP Process Technology Systems (SPTS), which includes a ...
Fabtech
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April 27, 2011 - Industry News
Intel's Technical Manufacturing Services practice to ramp MiaSole's CIGS thin film plant
Taking a gold leaf from First Solar's crown, copper indium gallium selenide (CIGS) thin-film photovoltaic module start-up is to employ Intel's ...
Fabtech
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April 13, 2011 - Industry News
Applied Materials to joint set-up 'Center of Excellence' in advanced packaging in Singapore
A member of numerous advanced packaging programs, especially related to 3D IC packaging technology, Applied Materials is also establishing a ...
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