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February 17, 2010
Visit Amkor at IMAPS Device Packaging Conference
Amkor Technology Invites you to join us at :
IMAPS International Conference and Exhibition on Device Packaging
March 9-11, 2010
Radisson Fort McDowell Resort, Scottsdale / Fountain Hills, Arizona
Booth #20
Amkor is a microelectronics solutions provider with advanced technologies and track record of innovation. Amkor was recently recognized for the 2009 global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including Thru-Mold Via Package on Package (TMV™ PoP), FusionQuad®, and Flip Chip Molded Ball Grid Array (FCMBGA).
Stop by our booth or visit us at www.amkor.com to learn how we can be a solutions provider for you.
Amkor Presentations:
Tuesday, March 9th
7:00 - 8:30 pm
3D Panel Discussion: 3D Integration Technologies, Applications and Roadmaps
Ron Huemoeller
Wednesday, March 10th
11:00 a.m. - 11:30 a.m.. Flip Chip
Flip Chip Bump Electromigration Reliability: A Comparison of Cu Pillar, High Pb, SnAg, and SnPb Bump
Ahmer Syed, CJ Berry, Karthikeyan Dhandapani, Lou Nicholls, Robert Darveaux
12:00 p.m. - 12:30 p.m. Flip Chip
Coreless Substrate Design, Assembly & Reliability for High Speed Applications
Jon G. Aday, Nozad Karim, Mike Devita, Steven Lee
Thursday, March 11th
8:30 a.m. - 9:00 a.m. 3D Packaging
Thru Mold Via (TMV™) Package on Package Development and Surface Mount Validation
Bob Bancod, Robert Lanzone, JS Kim, JH Yoon
8:30 a.m. - 9:00 a.m. Wafer Level Packaging
Advances in WLCSP Technologies to Enable Cost-Reduction
Rex Anderson, Ravi Chilukuri, Boyd Rogers, Ahmer Syed
Contact:
Amkor Technology
Scott Varga
http://www.amkor.com
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