|
|
|
|
February 17, 2010
Visit Amkor at IMAPS Device Packaging Conference
Amkor Technology Invites you to join us at :
IMAPS International Conference and Exhibition on Device Packaging
March 9-11, 2010
Radisson Fort McDowell Resort, Scottsdale / Fountain Hills, Arizona
Booth #20
Amkor is a microelectronics solutions provider with advanced technologies and track record of innovation. Amkor was recently recognized for the 2009 global Frost & Sullivan Technology Innovation of the Year Award for its line-up of innovative new products, including Thru-Mold Via Package on Package (TMV™ PoP), FusionQuad®, and Flip Chip Molded Ball Grid Array (FCMBGA).
Stop by our booth or visit us at www.amkor.com to learn how we can be a solutions provider for you.
Amkor Presentations:
Tuesday, March 9th
7:00 - 8:30 pm
3D Panel Discussion: 3D Integration Technologies, Applications and Roadmaps
Ron Huemoeller
Wednesday, March 10th
11:00 a.m. - 11:30 a.m.. Flip Chip
Flip Chip Bump Electromigration Reliability: A Comparison of Cu Pillar, High Pb, SnAg, and SnPb Bump
Ahmer Syed, CJ Berry, Karthikeyan Dhandapani, Lou Nicholls, Robert Darveaux
12:00 p.m. - 12:30 p.m. Flip Chip
Coreless Substrate Design, Assembly & Reliability for High Speed Applications
Jon G. Aday, Nozad Karim, Mike Devita, Steven Lee
Thursday, March 11th
8:30 a.m. - 9:00 a.m. 3D Packaging
Thru Mold Via (TMV™) Package on Package Development and Surface Mount Validation
Bob Bancod, Robert Lanzone, JS Kim, JH Yoon
8:30 a.m. - 9:00 a.m. Wafer Level Packaging
Advances in WLCSP Technologies to Enable Cost-Reduction
Rex Anderson, Ravi Chilukuri, Boyd Rogers, Ahmer Syed
Contact:
Amkor Technology
Scott Varga
http://www.amkor.com
|
This page has been viewed 819 times. |
More from Amkor Technology
December 22, 2011
Sales of Amkor's Next Gen Through Mold Via PoP Solutions Surpass 100 Million Units
Amkor Technology, Inc. announced that its innovative Through Mold Via (TMV®) Package-on-Package (PoP) solutions have surpassed 100 million units ....
Amkor Technology, Inc.
|
November 17, 2011
Toshiba and Amkor Jointly Agree to Postpone Discussions for Acquisition
Toshiba Corporation and Amkor Technology, Inc. announced that, in light of severe flooding in Thailand affecting the operations of a subsidiary of ...
Amkor Technology
|
November 8, 2011
Amkor Technology Announces Conversion of PBGA Products to Pin-Gate Mold Process
Amkor Technology, Inc. announced that it will convert all of its 19mm through 31mm body size Plastic Ball Grid Array ("PBGA") packages to pin-gate ...
Amkor Technology
|
November 7, 2011
Join Amkor at the upcoming MEPTEC Conference
Amkor Technology invites you to join us at the MEPTEC 2.5D, 3D and Beyond Conference, Wednesday, November 9th at the Biltmore Hotel and Suites in Santa ...
Amkor Technology
|
November 3, 2011
Amkor Honors Seven Companies with 2011 Supplier Award
Amkor Technology, Inc. announced it honored seven companies with its 2011 Supplier Award. The awards were presented at its Amkor Supplier Day held ...
Amkor Technology, Inc.
|
October 31, 2011
Amkor Technology Reports Third Quarter 2011 Financial Results
Amkor Technology, Inc. announced financial results for the third quarter ended September 30, 2011, with net sales of $740 million, net income of ...
Amkor Technology, Inc.
|
September 30, 2011
Toshiba and Amkor Sign Memorandum
Toshiba Corporation and Amkor Technology, Inc. announced that they have signed a non-binding memorandum of understanding for the acquisition by ...
Amkor Technology, Inc.
|
September 1, 2011
Amkor Announces Stock Repurchase Program
Amkor Technology, Inc. announced that its Board of Directors has authorized the repurchase of the Company's common stock. "We believe ...
Amkor Technology
|
August 31, 2011
GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions
GLOBALFOUNDRIES and Amkor Technology, Inc. announced that they have entered into a strategic partnership to develop integrated assembly and ...
Amkor Technology, Inc.
|
August 30, 2011
Amkor Technology to Present at Upcoming Conferences
Amkor Technology, Inc. announced that it will participate in the following investor conferences: 2011 Citi Technology Conference on ...
Amkor Technology, Inc.
|
August 25, 2011
Join Amkor at the GLOBALFOUNDRIES Technical Conference
Amkor Technology invites you to join us at the GLOBALFOUNDRIES Technical Conference Partner Pavilion, August 30th, 2011, Santa Clara Convention ...
Amkor Technology
|
August 10, 2011
Amkor Announces Availability of QFN Package Design Kit for Advanced Design System Software
Amkor Technology, Inc. announced the availability of its Quad Flat No-Lead (QFN) package design kit for Agilent Technologies' Advanced Design ...
Amkor Technology
|
July 29, 2011
Amkor Technology Reports Second Quarter 2011 Financial Results
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2011, with net sales of 688 million, net income of 14 ...
Amkor Technology, Inc.
|
May 19, 2011
Join Amkor at 61st Electronic Components and Technology Conference
Amkor Technology invites you to join us at the 61st Electronic Components and Technology Conference (ECTC), May 31 - June 3, 2011, Walt Disney ...
Amkor Technology
|
May 2, 2011
Amkor Technology Reports First Quarter 2011 Financial Results
Amkor Technology, Inc. announced financial results for the first quarter ended March 31, 2011. "First quarter results were consistent with our ...
Amkor Technology
|
April 4, 2011
Amkor Named Supplier of the Year by Atheros
Amkor Technology, Inc.announced that it has received the 2010 Supplier of the Year Award from Atheros Communications, Inc. Atheros delivers ...
Amkor Technology, Inc.
|
March 21, 2011
Update from Amkor on Japan Operations
Amkor Technology, Inc. announced that its manufacturing facility in Kitakami, Japan, located about 260 miles northeast of Tokyo, has ...
Amkor Technology, Inc.
|
March 7, 2011
Amkor Technology invites you to join us at IMAPS DPC 2011
Amkor Technology invites you to join us at IMAPS DPC 2011. Amkor is pleased to have 2 papers at the conference: "Logic Assembly On Interposer" ...
Amkor Technology
|
February 23, 2011
Amkor Receives License Termination Notice from Tessera
Amkor Technology, Inc. announced that it received a notice from Tessera, Inc. purporting to terminate Amkor's Patent License Agreement with them ...
Amkor Technology, Inc.
|
February 10, 2011
Amkor Reports Financial Results for the Q4 and Full Year 2010
Amkor Technology, Inc. announced financial results for the fourth quarter ended December 31, 2010. For the full year 2010, Amkor reported net ...
Amkor Technology
|
January 21, 2011
Amkor Technology Joins Electronics Industry Citizenship Coalition
Amkor Technology, Inc. announced that it has joined the Electronic Industry Citizenship Coalition (EICC) as an Applicant Member. The EICC ...
Amkor Technology, Inc.
|
December 30, 2010
Amkor to Redeem Its 6.25% Convertible Subordinated Notes
Amkor Technology, Inc. announced that it will call for redemption all of the $100,000,000 aggregate principal amount outstanding of its 6.25% ...
Amkor Technology
|
November 5, 2010
Amkor Technology Reports Financial Results for the 3Q10
Amkor Technology, Inc. announced financial results for the third quarter ended September 30, 2010, with net sales of $794 million, net income of ...
Amkor Technology
|
October 22, 2010
Amkor Honors 12 Companies with 2010 Supplier Award
Amkor Technology, Inc. announced it honored 12 companies with its 2010 Supplier Award. The awards were presented at its Amkor Supplier Day ...
Amkor Technology, Inc.
|
August 30, 2010
Join Amkor Technology, Inc. at Global Technology Conference
GLOBALFOUNDRIES will be hosting the first annual Global Technology Conference at the Santa Clara Convention Center. In addition to ...
Amkor Technology, Inc.
|
|
|
To find more corporate news releases from Amkor Technology, use the search form below.
|
|
|
