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  New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec




Microliter dispensing made easy with PCD Volumetric dispense valve
PCD TechnologyUnmatched volumetric repeatability at 1microliter volumes. Viscosity from water to thick pastes, the value does not require day to day calibration. PCD controller for worktable or integration to system. Learn more…
GPD Global
  Corporate News Index
February 17, 2010  -  Click the title to read the full article.

Imec, Renesas and M4S report a single-chip reconfigurable multi-standard wireless transceiver in 40nm CMOS
At the International Solid State Circuit Conference, imec and its research partners Renesas Technology Corp. and M4S present a complete ...
Imec

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More from Imec
September 7, 2010
Imec to develop lab-on-chip system for fast cancer diagnosis
imec and its project partners have announced the launch of the European Seventh Framework Project MIRACLE. The MIRACLE project aims to develop ...
Imec
August 25, 2010
Imec makes significant contribution to the 2010 IEDM meeting
A record number of 16 papers with imec authors has been accepted for this year’s IEEE International Electron Devices Meeting (IEDM), being held ...
IMEC
August 23, 2010
Imec makes significant contribution to the 2010 IEDM meeting
A record number of 16 papers with imec authors has been accepted for this year's IEEE International Electron Devices Meeting (IEDM), being held ...
Imec
July 21, 2010
Imec's SiGe MEMS technology platform improves performance
Imec demonstrates the value of its SiGe above-IC MEMS technology platform for improving performance of state-of-the-art MEMS with the development ...
Imec
July 20, 2010
Imec welcomes research partners to its GaN research program
Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This ...
Imec
July 19, 2010
Imec reports record efficiencies for large-area epitaxial thin-film silicon solar cells
Imec has realized large-area (70cm2) epitaxial solar cells with efficiencies of up to 16.3% on high-quality substrates. And efficiencies ...
Imec
July 16, 2010
Imec, ASML demonstrate potential of 193nm immersion lithography
Imec and ASML collaborated to qualify ASML's Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its ...
Imec
July 15, 2010
Imec reports breakthrough in narrow pitch interconnects
Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into ...
Imec
July 14, 2010
Imec EUV mask cleaning program on track towards EUV mass manufacturing
Imec reports promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial ...
Imec
June 30, 2010
Imec reports asymmetric nanostructures for early cancer prediction
Researchers at the nanotechnology research centre imec have demonstrated biosensors based on novel nanostructure geometries that increase the ...
Imec
June 15, 2010
Imec reduces cost of germanium-based thermophotovoltaic cells
Imec presents an improved processing technique for germanium-based thermophotovoltaic (TPV) cells resulting in significant reduction of ...
Imec
June 14, 2010
Intel, imec, Five Flemish Universities Open Flanders ExaScience Lab
Intel Corporation, imec and 5 Flemish universities officially opened the Flanders ExaScience Lab at the imec research facilities in Leuven ...
Imec
June 11, 2010
Imec inaugurates first phase in its high-tech pole expansion
Imec officially opens the extension of its state-of-the-art cleanroom at its campus in Leuven, Belgium. Moreover, imec also kicks off the ...
Imec
June 10, 2010
Imec’s cognitive baseband radio to support 4G, broadband access
Imec introduces a cognitive baseband radio (COBRA) architecture targeting 4G requirements at up to 1Gbit/s throughput and multiple asynchronous ...
Imec
June 8, 2010
Imec and Holst Centre report gas sensor chip
Imec and Holst Centre have developed very sensitive integrated sensing elements for gas detection. The polymer-coated microbridges in ...
Imec and Holst Centre
June 7, 2010
Imec's Europractice IC service provides TSMC 40nm technologies
Imec announced the extension of imec’s Europractice IC service with the offering of TSMC’s 40 nanometer technologies. Subsequent to the close ...
Imec
May 26, 2010
Collaboration with semi company Huali gives imec China a jump start
Imec officially established imec China in the Zhangjiang High-tech Park in Shanghai. Imec China kicked off with the signing of a joint ...
imec
May 20, 2010
imec and DELTA partner to provide ASIC solutions
Imec and DELTA Microelectronics have concluded a cooperation agreement to provide customers in Europe, the Middle East and Africa (EMEA) with ...
IMEC
May 4, 2010
Imec successfully concludes 2009
The imec Board announced the results of 2009. Despite the severe economical downturn, 2009 was a satisfying year for imec. Imec's total ...
IMEC
April 13, 2010
imec Virtual Camera (iVC), the ultimate angle on reality
At the NAB Show in Las Vegas, the nanotechnology research center imec presents imec Virtual Camera (iVC), a revolutionary new video technology ...
imec
April 8, 2010
Dow Corning and imec collaborate on high-efficiency, low-cost silicon solar cells
Dow Corning signed a three-year contract with imec to perform joint research on next generations of crystalline silicon solar cells. In the ...
IMEC
April 1, 2010
Imec and partners start work on EU project PRIMA
Imec announces that it has started work, together with its project partners, on PRIMA, a project under the EU's 7th framework program for ...
Imec
March 25, 2010
Portable, easy-to-wear mind speller: Typing words with your brain
Imec, Holst Centre and the lab of neuro- and psychophysiology at the Katholieke Universiteit Leuven today present the Mind Speller, a ...
Imec
March 24, 2010
Imec and Synopsys Collaborate on 3D Stacked IC Development
Synopsys, Inc. and imec announced they have entered into a collaboration to use Synopsys TCAD finite-element method tools for characterizing and ...
Imec
March 9, 2010
Imec and Altos collaborate on chip design and prototyping service
Imec and Altos Design Automation, Inc. announce that they have entered into an agreement to set up a library re-characterization service based ...
Imec
To find more corporate news releases from Imec, use the search form below.


Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation




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