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  New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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Advances in Micro-electronics Inspection
Provides High Resolution and High UPH,
Machine Vision ProductsMVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more…
Machine Vision Products, Inc.




Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
  Industry and Technology News Index
February 17, 2010  -  Click the title to read the full article.

Asia-Pacific chip sales leading indicator up
Economic research firm e-forecasting.com announced that the Asia-Pacific semiconductor chip sales leading indicator went up in December by 3.4 ...
Electronics News
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More from Electronics News
March 22, 2010 - Industry News
US Chip Industry Works to Level Global Playing Field
The chairman of the Semiconductor Industry Association, John Daane, addressed Washington in a "State of the Industry" presentation to ...
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February 17, 2010 - Industry News
Asia-Pacific chip sales leading indicator up
Economic research firm e-forecasting.com announced that the Asia-Pacific semiconductor chip sales leading indicator went up in December by 3.4 ...
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November 18, 2009 - Industry News
Worldwide semiconductor revenue to end the year on a high
Worldwide semiconductor revenue is on pace to total $226 billion in 2009, an 11.4 percent decline from 2008 revenue of $255 billion, according to ...
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November 16, 2009 - Technology News
3-axis MEMS gyroscope
STMicroelectronics announced a single-package analogue gyroscope that measures angular rates along three orthogonal axes. The company's three-axis ...
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November 12, 2009 - Technology News
Samsung pushes foundry logic process development
Samsung Electronics announced that its new Semiconductor Research & Development Centre has started advanced logic process development, ...
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November 5, 2009 - Technology News
PLX Technology completes design on 40nm process
PLX Technology announced it completed a design on 40nm process technology at Taiwan Semiconductor Corp. The company is taking advantage of the 40nm ...
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July 14, 2009 - Technology News
Firms partner to develop ultra-fine pitch 3D interconnects
Optomec and Vertical Circuits Incorporated (VCI) say they are collaborating in the development of a high density 3-dimensional ...
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July 2, 2009 - Industry News
Rambus claims 'world's fastest memory'
Rambus, a technology licensing companies specialising in high-speed memory architectures, has demonstrated its XDR memory system running at data ...
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May 26, 2009 - Technology News
Chips 'reduce electricity consumption'
Adoption of new technologies for the production, distribution and use of electricity could lower total US energy consumption by 2030, according ...
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May 11, 2009 - Technology News
Cypress claims first SRAM at 65 nm
Cypress Semiconductor (distributed in Australia by Future Electronics) says it is sampling the industry’s first Quad Data Rate (QDR) and Double ...
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May 5, 2009 - Industry News
Technology collaboration aims for 28 nm node
An alliance of IBM, Chartered Semiconductor, Infineon Technologies, Samsung and STMicroelectronics says it has defined and is jointly developing a ...
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November 25, 2008 - Industry News
Freescale and Samsung collaborate on LED displays
Freescale Semiconductor and Samsung Electronics say they are to collaborate to address the burgeoning market for energy-saving and ...
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STMicroelectronics MEMS accelerometer
The new device is qualified to AEC-Q100 for automotive applications, fully leveraging its proven 200mm-wafer MEMS fabrication facility to ...
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March 2, 2007 - Technology News
Two lasers boost euv power
martin_richardson.gif

Laser developer Powerlase and research partner University of Central Florida have made what they believe to be a major development in extreme ultraviolet lithography (euv). For the first ...

News Electronics
June 22, 2006 - Industry News
China Gets Semi IP Trading Center
Collaborative plans for the construction of a new semiconductor intellectual property (SIP) trading center in greater China have been announced ...
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Metallization Lines by ASYS
Metallization LinesOver 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
ASYS Group Americas Inc.




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