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  cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
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Advances in Micro-electronics Inspection
Provides High Resolution and High UPH,
Machine Vision ProductsMVP's Ultra 850G platform provides high resolution inspection for backend semiconductor and microelectronics processes. Using 2D/3D inspection techniques, the Ultra 850G provides metrology capabilities for wire bond, die, surface damage, underfill, BGA/Bump and other processes. Learn more…
Machine Vision Products, Inc.




PacTech's PacLine 300
Electroless Ni Plating System
PacTech's PacLine 300Mass-production solutions for 4- to 12-inch wafers at 150 wafers/hour. Ni/Au, Ni/Pd and Ni/Pd/Au plating for Flip-Chip UBM or top metal finish for wirebond or power device clip attach. Learn more…
PacTech
  Industry and Technology News Index
February 17, 2010  -  Click the title to read the full article.

Technology Takeovers to Pick Up in 2010
The pace and size of acquisitions in the technology industry will return to "robust" levels this year after the value of deals dropped by more ...
Business Week
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Moisture Sensitive Devices (MSD's)
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