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  cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES
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New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.




Die attach, flip chip placement, & SMT in one machine
CX-1The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. Learn more…
Juki Automation Systems
  Industry and Technology News Index
February 16, 2010  -  Click the title to read the full article.

First germanium laser could pave way for optical computers
One of the issues of current chip design is the excessive power needed to transport and store ever increasing amounts of data. A possible solution ...
Gizmag
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cyberTECHNOLOGIES extends lead in surface metrology for PV applications
Track JobExpanding capabilities of Vantage & CT SERIES products introducing new high-resolution sensor with unmatched small spot size, optimized for the measurement of textured silicon surfaces and devices coated with anti-reflective films. Learn more…
cyberTECHNOLOGIES




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