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  New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.
  Industry and Technology News Index
February 16, 2010  -  Click the title to read the full article.

Efficient solar cells from silicon wires
US researchers have designed a new silicon-based solar cell which uses 100 times less silicon than conventional photovoltaic devices. The system ...
Chemistry World
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More from Chemistry World
February 16, 2010 - Technology News
Efficient solar cells from silicon wires
US researchers have designed a new silicon-based solar cell which uses 100 times less silicon than conventional photovoltaic devices. The system ...
Chemistry World
July 31, 2009 - Technology News
Smoothing out plasmonic surfaces
US scientists have found a simple way to make smooth metal films with nano-scale patterns in a variety of shapes that could one day be used ...
Chemistry World
October 2, 2007 - Technology News
Semiconductor splits water with sunlight
Scientists in Germany have developed a promising new catalyst that splits water using sunlight -and stores the hydrogen and oxygen ...
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Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.




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