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  Exceeding Productivity Demands
for Heavy Wire Bonding
PiQCNew white paper focuses on the cycle time for wedge bonding. To achieve an increase in productivity, each element of the wire bonding equipment in relation to optimizing the wire bonding process must be questioned. Learn more…
Hesse & Knipps, Inc.
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5 Micron Placement Capable!
Small Footprint, Low Cost
Air-Vac Onyx500The new ONYX500 Benchtop is the ultimate precision, multifunctional system with a wide range of applications including MEMS with automatic pick, place, dispense and assembly. Learn more…
Air-Vac Engineering




Moisture Sensitive Devices (MSD's)
White paper on advanced solutions
Super DryThe influence of humidity on the reliability of components is underestimated. Moisture sensitive devices (MSDs) are encapsulated with plastic and organic materials causing atmospheric humidity to penetrate permeable packaging materials. Learn about dry cabinet solutions with this free white paper…
Super Dry®
  Industry and Technology News Index
February 16, 2010  -  Click the title to read the full article.

Silicon revenues declined 41% in 2009: Shipments down 18%
Worldwide silicon wafer area shipments hit rock bottom in the first quarter of 2009, but a strong recovery was noted in each subsequent ...
Fabtech
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August 30, 2010 - Industry News
Samsung eyes top spot in IC fabrication as revenues rival Intel's
After over 20 years of stasis in the pecking order of IC manufacturing revenues, it looks like Samsung’s remarkable rise in performance of ...
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August 24, 2010 - Industry News
Semiconductor equipment bookings blossom
New semiconductor equipment bookings are now at their highest levels since the dot com boom, according to the latest book-to-bill figures ...
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July 13, 2010 - Industry News
Teradyne highest growth in Q1
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July 12, 2010 - Industry News
Consumer demand pushes iSuppli to raise semi foundry revenue forecast
Revenue at the major semiconductor foundries is set to boom for the next four-years as consumer demand for electronics has returned with a vengeance ...
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June 21, 2010 - Industry News
May semiconductor equipment bookings top US$1.48 billion
The fifth straight month of equipment bookings above US$1 billion has been reported by SEMI. North America-based semiconductor equipment ...
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June 14, 2010 - Industry News
Fab equipment sales set to rise 113%, according to Gartner
Struggling to keep pace with pent-up IC demand dynamics has forced Gartner to once again revise upwards its capital spending projections ...
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June 11, 2010 - Industry News
Sematech eyes TSV volume production as positive results reported
Sematech's CNSE-based 3D Interconnect program has yielded some encouraging results that will likely improve on current 3D interconnect ...
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June 11, 2010 - Industry News
Samsung ploughs $3.6 billion into Austin fab expansion
Samsung Austin Semiconductor has announced its plans to further expand the capacity of its 300mm fab in Austin, Texas with a $3.6 billion ...
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June 7, 2010 - Industry News
Final sale of Qimonda’s back-end test , assembly equipment planned
The final online auction of Qimonda's back-end test and assembly equipment at its final manufacturing facility in Portugal is set to finish ...
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June 4, 2010 - Industry News
Gartner revises semiconductor forecast: 27% growth, DRAM 78%
As the typically weakest quarter proved to be uncharacteristically strong, Gartner has revised upwards its global semiconductor forecast ...
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June 2, 2010 - Industry News
Globalfoundries starts construction of third 300mm fab in Dresden
Anticipated demand for leading-edge foundry processing has pushed Globalfoundries to immediately start construction of a new 300mm fab at ...
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May 26, 2010 - Industry News
IMEC establishes China base for advanced semi process R&D
IMEC has formed a joint development project on advanced chip process technology with the semiconductor company Huali, kick-starting R&D ...
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May 25, 2010 - Industry News
Litho Forum Survey Sees Shift to EUV
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May 5, 2010 - Industry News
iSuppli: DRAM ASP's to decline in 2010
The 55% increase seen in DRAM ASP's in 2009, are not sustainable, according to iSuppli Corp. ASP's are set to decline throughout 2010 ...
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May 4, 2010 - Industry News
Semiconductor sales second highest on record in March
According to the latest figures released by the Semiconductor Industry Association (SIA), semiconductor sales for March, 2010 were the second ...
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April 15, 2010 - Industry News
TSMC goes directly to 20nm, bypasses 22nm node
Due to increased competition at next-generation process nodes, especially with the emergence of Globalfoundries as a serious competitor, TSMC said ...
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April 15, 2010 - Industry News
ASML books €1 billion in orders in Q1: expects same in Q2 and record sales in 2010
With technology buys rather than capacity expansions dominating semiconductor capital spending in 2010, ASML has posted first quarter ...
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April 14, 2010 - Industry News
Applied Materials new Singapore manufacturing hub to handle 50% of business flow
Having 70% of its semiconductor business coming from Asia, Applied Materials said that it expects its new Singapore Operations Center ...
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April 12, 2010 - Industry News
Gartner reveals top 10 equipment suppliers in 2009
With semiconductor capital spending taking another major decline in 2009, only three equipment companies had sales greater than US$1 billion ...
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March 31, 2010 - Industry News
Gartner claims semi decline greater than SIA and WSTS figures
Contrary to SIA and WSTS figures for 2009, Gartner believes that total worldwide semiconductor revenue reached US$228.4 billion, down US$26.8 ...
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March 29, 2010 - Industry News
IEEE IITC Conference takes on 3D interconnects
In what the IEEE is praising as the 'one of the conference's strongest technical programs in years,' the 13th annual IEEE International Interconnect ...
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March 24, 2010 - Industry News
Toshiba to start building Fab 5 NAND flash facility
The next wave of 300mm fab expansions is now underway with the official announcement from Toshiba that it will start building Fab 5 in July ...
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March 17, 2010 - Top Story News
Gartner Expects 29.5% Growth in Semiconductor Silicon Wafer Demand
A return to normal seasonal IC demand dynamics coupled to a rebuild in inventory levels from ICs though to silicon wafers will push wafer ...
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March 3, 2010 - Industry News
Expect 20% plus growth rates in 2010 as SIA reports 0.3% rise
The small 0.3% rise in worldwide semiconductor sales in January, compared to December, 2009 may not seem significant at first glance. Seasonally ...
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February 19, 2010 - Industry News
Peak DRAM revenue in 2010, says iSuppli
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PacTech's Low-Cost Wafer Bumping Services
Quick-turn prototyping and mass-production
PacTech's Low-Cost Wafer Bumping ServicesLow-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more…
PacTech




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