The evolution of chipmaking toward devices with smaller form factors, improved power consumption and lower costs has accelerated development of 3D integration technology.

Recognition that through-silicon vias are an enabling technology for 3D integration has synchronized Alchimer's offering with industry requirements. Leading customers are asking for higher aspect ratio TSVs to preserve wafer real estate and maintain realistic wafer thicknesses.

They cannot wait for very-thin wafer processing and handling technologies to become mainstream. Deep TSVs with aspect ratios greater than 10:1 meet the requirements for 3D devices, but they cannot meet yield and cost requirements using traditional dry processes for liner, barrier and seed deposition.

Chemical and physical vapor deposition techniques exhibit basic shortcomings and impose high capital requirements, holding back adoption of 3D IC solutions.

With the capability of enabling metallization of aspect ratios greater than 20:1, Alchimer is empowering designers to move beyond the limitations of traditional process equipment.

Moreover, Alchimer's wet deposition technology can reduce overall cost of ownership for high aspect ratio TSV metallization by up to two-thirds compared to conventional dry processes. The result: 3D devices with shorter development time, lower overall costs and improved performance.