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February 10, 2010
Tim McNulty, CEO and President, Harbor Electronics, the board division of Multitest
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| Tim McNulty, CEO and President, Harbor Electronics, the board division of Multitest
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We prepared for 2010 by not slowing down in 2009. As the leader in the prototype PCB business for the semiconductor test market, we cannot afford to fall behind the technology curve or lose pace with our customers' requirements.
We continued to engage with customers as part of their R&D pipeline, and continued to invest in new equipment, our people and our processes. Tighter capital expenditure budgets meant we had to scrutinize our investments more carefully, but not investing was never an option.
In early 2009, we experienced a significant business downturn that lead to reductions in head count, but we have since replaced those positions and even added new engineering positions.
When business slowed down, albeit for a short period, it gave us the opportunity to refocus our business and better define our core competencies. We feel our customers are better served by our newly refocused business.
Anticipating customer needs comes from experience and that is why people turn to Harbor Electronics/Multitest for probe card and load board PCB requirements.
2010 is already off to a good start and our customers are benefiting from our continued investments throughout 2009.
Tim McNulty
, CEO and President, Harbor Electronics
Board Division of Multitest
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March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
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February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
In all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
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February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
Driven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
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February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
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February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
The ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
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