August 30, 2010 - Industry News
July Semiconductor Sales Up 37% Year-on-Year
Global sales of semiconductors grew to $25.2 billion in July, an increase of 1.2% from June when sales were $24.9 billion and an increase of ...
Semiconductor Industry Association
|
August 27, 2010 - Corporate News
SEMICON Europa to Focus on Latest Nano-Mfg Innovations
SEMI announced the lineup of keynote speakers and program highlights for SEMICON Europa 2010, which takes places in Dresden, Germany from ...
SEMI
|
August 27, 2010 - Industry News
What next for the Compound Semiconductor Industry?
CS Europe conference -Act now. Last few days left to book at discounted Early Bird Rate. Pioneering companies from around the globe will give ...
Compound Semiconductor
|
August 26, 2010 - Industry News
Taiwan Remains the Largest Semiconductor Equipment Market
According to the mid-year edition of the SEMI Capital Equipment Forecast, sales of global semiconductor equipment are growing in all regions in ...
SEMI
|
August 26, 2010 - Corporate News
Semi Industry Veterans Launch Boston Semi Equipment Group
Designed to deliver a unique combination of equipment expertise and innovative financial solutions to the semiconductor industry, senior ...
Boston Semi Equipment Group, LLC
|
August 16, 2010 - Industry News
SEMI Announces Management Changes, Reorganization
SEMI announced a reorganization into three dedicated business units for IC manufacturing, photovoltaic (PV), and Emerging and Adjacent Markets ...
Semi
|
August 16, 2010 - Corporate News
SemiProbe announces Modular Probe System Patent No. 7,764,079
SemiProbe has developed proprietary technologies that are so unique they have been awarded a patent by the United States Patent and Trademark ...
SemiProbe
|
August 12, 2010 - Industry News
Taiwan Still the Largest Semiconductor Equipment Market
According to SEMI, Taiwan is projected to be to be the largest market with $ 9.18 billion. Total semiconductor equipment sales worldwide are ...
Compound Semiconductor
|
August 10, 2010 - Industry News
Silicon Wafer Shipments Increase in 2Q10
Worldwide silicon wafer area shipments increased during the second quarter 2010 when compared to first quarter 2010 area shipments ...
Semi
|
August 10, 2010 - Industry News
AMAT pushes 3D interconnect
Applied Materials is developing technology for through-silicon via (TSV) technology for high-volume manufacturing. Seen as a critical technology ...
EuroAsia Semiconductor
|
August 9, 2010 - Industry News
Standards Update on 3D ICs and TSVs
Three-dimensional integrated circuits (3D ICs) – composed of a stack of two-dimensional die – are increasingly cited as being part of the solution ...
Semi
|
August 9, 2010 - Corporate News
Fairchild Semi's Linear LED Drivers Conserve Space
Space-constrained applications, such as handsets, glucometers and other portable devices that require illumination of LCD displays and keypads ...
Fairchild Semiconductor
|
August 9, 2010 - Industry News
AMAT pushes 3D interconnect
Applied Materials is developing technology for through-silicon via (TSV) technology for high-volume manufacturing. Seen as a critical technology ...
EuroAsia Semiconductor
|
August 6, 2010 - Corporate News
Seoul Semiconductor takes third place in market share of white LEDs
Seoul Semiconductor rose to third place in market share of white LEDs last month, a report by The Nikkei Group in Japan revealed. According to the ...
Seoul Semiconductor
|
August 4, 2010 - Industry News
Global Semiconductor Sales Rise 7.1% Quarter-on-Quarter
Global sales of semiconductors in the second quarter of 2010 grew an increase of 7.1% from the first quarter. June 2010 sales were 0.5% higher than May when ...
Semiconductor Industry Association
|
August 3, 2010 - Corporate News
New OSRAM chip platform sets new record, increasing LED efficiency by 30%
Developers at OSRAM Opto Semiconductors have succeeded in increasing the efficiency of red thin-film LEDs by 30% – a new record. The latest ...
OSRAM Opto Semiconductors
|
August 2, 2010 - Industry News
EVG moves to LED
Increasing MEMS market and diversification for company EV Group (EVG) has announced it has received an order for its EVG520IS semi-automated wafer ...
EuroAsia Semiconductor
|
July 30, 2010 - Corporate News
Seoul Semiconductor Ranked Worldwide No. 4 in LED Market
Seoul Semiconductor is announcing that market survey agency Strategies Unlimited recently reported in "High-Brightness LED Market Review and ...
Seoul Semiconductor
|
July 30, 2010 - Industry News
Teledyne completes acquisition of Intelek
Teledyne Technologies Inc of Thousand Oaks, CA, USA has completed its acquisition of Intelek plc of Swindon, UK. Intelek's ordinary shareholders ...
Semiconductor Today
|
July 30, 2010 - Industry News
Deposition order for nanofacrication
Stanford University has recently placed an order for two Plasma-Therm deposition systems: a VERSALINE® HDPCVD system and a Shuttlelock ...
EuroAsia Semiconductor
|
July 29, 2010 - Industry News
Taiwan's LED production to surge 43% in 2010
With the growing popularity of LED-backlit LCD TVs fueling sales growth, the production value of Taiwan's LED industry is forecast to soar ...
Semiconductor Today
|
July 28, 2010 - Industry News
Stanford buys Plasma-Therm deposition systems for Nanofab Facility
Plasma process equipment maker Plasma-Therm LLC says that Stanford University has recently placed an order for two deposition tools to be ...
Semiconductor Today
|
July 26, 2010 - Corporate News
UConn, Duke Develop Method to Improve Small Delay DefectTesting
Semiconductor Research Corporation, the National Science Foundation (NSF) and researchers from the University of Connecticut (UConn) and Duke ...
Semiconductor Research Corporation
|
July 23, 2010 - Corporate News
Fairchild's IntelliMAX™ Load Switches Simplify Design Challenges
Designers of higher-complexity consumer applications like set-top boxes, ultra-mobile PCs, mobile internet devices and eBooks need a power ...
Fairchild Semiconductor
|
July 23, 2010 - Industry News
First direct bonding of SiC–Si and GaN–Si at room temperature
Tokyo-based machinery manufacturer Mitsubishi Heavy Industries Ltd (MHI) claims that it has achieved the world’s first direct bonding of silicon ...
Semiconductor Today
|
