March 12, 2010 - Industry News
AMD starts banging the developer relations drum
AMD is finally doing what we have all been waiting for, promoting its developer relations program to the masses. With that in mind, it ...
SemiAccurate
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March 11, 2010 - Corporate News
Daytime running light with only two LEDs
The OSTAR Compact from OSRAM Opto Semiconductors has been developed specifically for use in vehicle headlights. The high-power LED is designed ...
OSRAM Opto Semiconductors
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March 11, 2010 - Technology News
Gate First, or Gate Last: Technologists Debate High-k
Technology managers have strong opinions on the merits of the gate-first and gate-last methods of depositing high-k dielectrics and metal gate ...
Semiconductor International
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March 10, 2010 - Industry News
Process Control, Yield Management in HB-LED Manufacturing
With the explosive growth in high-brightness LED (HB-LED) applications including backlighting and general illumination, device manufacturers ...
Semiconductor International
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March 10, 2010 - Exclusive Articles/Announcements
iMAPS device packaging conference
The iMAPS device packaging conference continued yesterday in Scottsdale, AZ with technical presentations and exhibitor displays. About 500 industry professionals attended the "Device Packaging Conference" and were prepared for dozens of technical sessions on 3D packaging, MEMS and Wafer Level Packaging. One of the presentations was from Rich Rice, senior vice president of sales, North America from ASE Group. Rich spoke about their business of subcontracting ...
Semiconductor Packaging News
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March 9, 2010 - Industry News
Gartner Sees 'Spurt' in Capex Spending
Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making ...
Semiconductor International
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March 9, 2010 - Exclusive Articles/Announcements
iMAPS Global Business Council
We were invited to attend the 2010 Spring Conference of the iMAPS Global Business Council yesterday at the Radisson Fort McDowell in Scottsdale, AZ in conjunction with Device Packaging 2010. We listened to many speakers and the presenters were very upbeat, which is interesting as exactly 12 months ago, the market was hitting all time lows. While the focus of IMAPS ...
Semiconductor Packaging News
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March 9, 2010 - Industry News
China IC Industry Development Targets Renewed, Repurposed Fabs
China policy makers have targeted repurposed and renewed fabs utilizing new and refurbished process equipment as a key element in the national ...
Semi
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March 9, 2010 - Industry News
Baolab Claims CMOS MEMS Breakthrough
Baolab Microsystems claims that is has developed manufacturing techniques that allow MEMS devices to be built within a standard CMOS process flow ...
Semiconductor International
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March 8, 2010 - Industry News
IBM Nanophotonic Switch Promises Faster Energy-Efficient Computing
IBM researchers have created an ultrafast avalanche photodetector that uses light for communication between computer chips, which could be ...
Semiconductor International
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March 5, 2010 - Industry News
Fab Spending Heads for 88% Growth in 2010
According to the World Fab Forecast report released recently by SEMI, 2010 spending on worldwide fab projects, including construction, facilities, ...
Semi
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March 4, 2010 - Top Story News
Embedded Die Technology Gains Support
Embedded die technology is heading for volume production and may give fan-in wafer-level packaging a run for its money, predicts Yole Développement ...
Semiconductor International
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March 3, 2010 - Exclusive Articles/Announcements
Presto Engineering CEO Michel Villemain Interview
A recent press release from Presto Engineering identifying them as, "the pioneers of the 'Labless' business model for bringing semiconductor products into volume production" caught my eye. In order to get a better idea of what the 'Labless' concept entailed we asked their CEO Michel Villemain to share some of his ideas with us. Explain for our ...
Semiconductor Packaging News
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March 3, 2010 - Industry News
LED Shortage Flares up in 2010
Global supply of Light-Emitting Diodes (LEDs) is facing a shortage in 2010 and the year may end with an acute undersupply of the heavily in- ...
Compound Semiconductor
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March 2, 2010 - Industry News
TSMC Facing EUV, Wafer Cost Challenges
TSMC is ramping capacity for 40 nm production and preparing early production for 28 nm wafers, Shang-yi Chiang, senior vice president of ...
Semiconductor International
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March 2, 2010 - Technology News
Tyndall claims first junctionless transistor
Researchers at Tyndall National Institute in Cork, Ireland led by professor Jean-Pierre Colinge have reported in Nature Nanotechnology how ...
Semiconductor Today
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March 1, 2010 - Technology News
Scatterometry – Measuring Ever-Smaller Chip Production
As computer chips rapidly continue to evolve, new technologies must be developed to closely monitor the fabrication process and guard against ...
Semiconductor Online
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February 25, 2010 - Industry News
SIA Chairman to Address the Industry's Future During State of Industry Address
SIA Chairman John Daane, CEO, president, and Chairman of Altera Corporation, will present an up-to-date report on the state of one of ...
Semiconductor Industry Association
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February 24, 2010 - Industry News
SPIE Plenary Session Looks to EUV's Future, Changes During Economic Recovery
Keynote speakers at the SPIE Advanced Lithography conference said they expect 193i litho to be extended to the 16 nm generation and beyond ...
Semiconductor International
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February 23, 2010 - Industry News
Intel Sees Immersion Extending to 11 nm
Speakers at the Nikon LithoVision event said EUV litho's slow development makes it unlikely that it will be in full, high-volume manufacturing ...
Semiconductor International
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February 19, 2010 - Technology News
Thin-Film PV Looks to Close Performance Gap
Comparing commercial module performance with champion cell performance, this article considers some of the reasons for the performance gap in thin- ...
Semiconductor International
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February 18, 2010 - Top Story News
Applied Execs See Cause for Optimism
Applied Materials executives said equipment sales to a leading foundry accounted for a significant share of first-quarter silicon equipment ...
Semiconductor International
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February 17, 2010 - Industry News
3-D Interconnects Shape Future Solutions
An IEEE meeting in Santa Clara, Calif., attracted several leaders of 3-D IC technology development, who presented a list of challenges to the TSV ...
Semiconductor International
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February 16, 2010 - Exclusive Articles/Announcements
Gold vs. Copper, Let the Debate Begin
Semi recently announced the results of a study conducted by the World Gold Council. The study was conducted in order to to determine the extent of copper bonding wire programs in the industry and to identify the key issues and considerations related to decisions in selecting bonding wire material. Companies surveyed included both integrated device manufacturers (IDMs) and fabless ...
Semiconductor Packaging News
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February 16, 2010 - Top Story News
Silicon Wafer Shipments Bounce Back in the Second Half of 2009
Worldwide silicon wafer area shipments decreased by 18% in 2009 when compared to 2008 area shipments, according to SMG in its year-end analysis ...
Semi
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