February 23, 2011 - Industry News
NA Semi Equipment Industry Posts Jan Book-to-Bill Ratio of 0.85
North America manufacturers of semiconductor equipment posted $1.54 billion in orders in January and a book-to-bill ratio of 0.85 ...
Semiconductor Equipment and Materials International
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June 17, 2010 - Top Story News
SIA Unveils Plan to Double Chip Exports
The Semiconductor Industry Association (SIA) has submitted a report to the U.S. Department of Commerce outlining actions required to meet the ...
Semiconductor International Association
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June 2, 2010 - Industry News
SIA Reports April Chip Sales Grew By 2.2% Month-On-Month
The Semiconductor Industry Association (SIA) reported that worldwide semiconductor sales in April were $23.6 billion, an increase of 2.2% ...
Semiconductor International Association
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May 5, 2010 - Industry News
SIA Reports March Chip Sales Grew By 4.6% Month-on-Month
The Semiconductor Industry Association (SIA) reported that worldwide semiconductor sales in March were $23.1 billion, an increase of 4.6% ...
Semiconductor International Association
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April 21, 2010 - Industry News
Semiconductor International has closed
Our parent company, Reed Elsevier, announced in July of 2009 its intentions to substantially exit its Reed Business Information-US ...
Semiconductor International
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April 19, 2010 - Industry News
STATS ChipPAC Expands eWLB to Reconstituted 300 mm Wafers
Embedded wafer-level ball grid array (eWLB) technology is evolving and can further optimize manufacturing costs beyond the current level ...
Semiconductor International
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April 19, 2010 - Industry News
ASML Announces 2010 First Quarter Results
ASML Holding NV announces 2010 first quarter results according to US GAAP as follows: Q1 2010 net sales of EUR 742 million versus Q4 2009 net ...
Semiconductor International
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April 16, 2010 - Technology News
STATS ChipPAC Expands eWLB to Reconstituted 300 mm Wafers
Embedded wafer-level ball grid array (eWLB) technology is evolving and can further optimize manufacturing costs beyond the current level through ...
Semiconductor International
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April 16, 2010 - Technology News
Researchers Discover Controllable State in Ferroelectric Nanowires
Research into ferroelectric nanostructures, conducted on 2-D and zero-dimensional ferroelectrics, have revealed original properties stemming ...
Semiconductor International
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April 14, 2010 - Technology News
Experts Detail 3-D IC Stress Management
At a Sematech-organized workshop on stress management for 3-D ICs, technology managers addressed the need to simulate and measure the ...
Semiconductor International
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April 13, 2010 - Industry News
Leti Steps Toward Terabit Optical Links
French R&D consortium Leti has integrated a laser source with a silicon waveguide in a CMOS flow, an advance toward the goal of fabricating an ...
Semiconductor International
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April 7, 2010 - Top Story News
Experts Detail 3-D IC Stress Management
Technology managers at a Sematech workshop discussed 3-D stress management issues. The creation of TSVs, die thinning, bonding and ...
Semiconductor International
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April 6, 2010 - Industry News
Sales of Optoelectronics, Sensors, and Discretes to Hit Record
IC Insights Inc. reported that the market for optoelectronics, sensors and discretes (OSD) is likely to outpace the IC market over the next ...
Semiconductor International
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April 1, 2010 - Industry News
AMAT Sees Share Gain, Shift to Asia
Applied Materials CEO Mike Splinter said his company will continue to gain market share in inspection, etch and other core fab equipment ...
Semiconductor International
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March 31, 2010 - Top Story News
Elpida Preparing 3-D Commercialization
Elpida Memory Inc. CTO Takao Adachi describes Elpida's push to introduce 3-D TSV products. "Our motivation to have TSV/3-D technologies is not ...
Semiconductor International
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March 30, 2010 - Industry News
Applied Launches TSV Dielectric Tool
Applied Materials continues to develop its repertoire in the 3-D IC space, introducing the InVia tool for oxide liner deposition. Applied ...
Semiconductor International
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March 26, 2010 - Industry News
Chip Companies Must Dig Deep for 450 mm
The largest semiconductor companies must help pay for the cost of 450 mm equipment development, said Dan Armbrust, the CEO of Sematech. Speaking ...
Semiconductor International
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March 25, 2010 - Industry News
Jordan Valley Semiconductors Acquires Metrosol Assets
X-ray metrology vendor Jordan Valley Semiconductors has acquired the assets of Metrosol, a vacuum ultraviolet (VUV) metrology tool supplier ...
Semiconductor International
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March 25, 2010 - Top Story News
Chip Companies Must Dig Deep for 450 mm
The largest semiconductor companies must help pay for the cost of 450 mm equipment development, said Dan Armbrust, the CEO of Sematech. Speaking ...
Semiconductor International
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March 23, 2010 - Top Story News
IMAPS Experts Debate 3-D Cost Challenges
Packaging experts at the IMAPS Device Packaging Conference discussed industry progress on the major challenges facing 3-D TSV adoption. While ...
Semiconductor International
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March 22, 2010 - Industry News
Dresden Fab Transformation Underway
GlobalFoundries Fab 1 in Dresden, Germany, is undergoing several major changes, including integration of separate modules into an integrated ...
Semiconductor International
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March 18, 2010 - Industry News
Dresden Fab Transformation Underway
GlobalFoundries Fab 1 in Dresden, Germany, is undergoing several major changes, including integration of separate modules into an integrated ...
Semiconductor International
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March 17, 2010 - Industry News
GlobalFoundries, TSMC Square Off at DATE
At a panel discussion at the DATE conference last week in Dresden, Germany, representatives from GlobalFoundries and TSMC said they are ...
Semiconductor International
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March 16, 2010 - Industry News
McClean: Semi Content Heading Up to 27%
Speaking at an IMAPS meeting, IC Insights President Bill McClean said the industry is at nearly full capacity utilization. The system ...
Semiconductor International
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March 15, 2010 - Industry News
IMEC, Synopsys to Co-Develop 3-D Stacked ICs
Synopsys Inc. said that it will collaborate with research center IMEC on development of 3-D stacked IC technologies, using Synopsys TCAD finite ...
Semiconductor International
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