March 11, 2010 - Technology News
Gate First, or Gate Last: Technologists Debate High-k
Technology managers have strong opinions on the merits of the gate-first and gate-last methods of depositing high-k dielectrics and metal gate ...
Semiconductor International
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March 10, 2010 - Industry News
Process Control, Yield Management in HB-LED Manufacturing
With the explosive growth in high-brightness LED (HB-LED) applications including backlighting and general illumination, device manufacturers ...
Semiconductor International
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March 9, 2010 - Industry News
Gartner Sees 'Spurt' in Capex Spending
Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making ...
Semiconductor International
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March 9, 2010 - Industry News
Baolab Claims CMOS MEMS Breakthrough
Baolab Microsystems claims that is has developed manufacturing techniques that allow MEMS devices to be built within a standard CMOS process flow ...
Semiconductor International
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March 8, 2010 - Industry News
IBM Nanophotonic Switch Promises Faster Energy-Efficient Computing
IBM researchers have created an ultrafast avalanche photodetector that uses light for communication between computer chips, which could be ...
Semiconductor International
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March 4, 2010 - Top Story News
Embedded Die Technology Gains Support
Embedded die technology is heading for volume production and may give fan-in wafer-level packaging a run for its money, predicts Yole Développement ...
Semiconductor International
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March 2, 2010 - Industry News
TSMC Facing EUV, Wafer Cost Challenges
TSMC is ramping capacity for 40 nm production and preparing early production for 28 nm wafers, Shang-yi Chiang, senior vice president of ...
Semiconductor International
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February 24, 2010 - Industry News
SPIE Plenary Session Looks to EUV's Future, Changes During Economic Recovery
Keynote speakers at the SPIE Advanced Lithography conference said they expect 193i litho to be extended to the 16 nm generation and beyond ...
Semiconductor International
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February 23, 2010 - Industry News
Intel Sees Immersion Extending to 11 nm
Speakers at the Nikon LithoVision event said EUV litho's slow development makes it unlikely that it will be in full, high-volume manufacturing ...
Semiconductor International
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February 19, 2010 - Technology News
Thin-Film PV Looks to Close Performance Gap
Comparing commercial module performance with champion cell performance, this article considers some of the reasons for the performance gap in thin- ...
Semiconductor International
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February 18, 2010 - Top Story News
Applied Execs See Cause for Optimism
Applied Materials executives said equipment sales to a leading foundry accounted for a significant share of first-quarter silicon equipment ...
Semiconductor International
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February 17, 2010 - Industry News
3-D Interconnects Shape Future Solutions
An IEEE meeting in Santa Clara, Calif., attracted several leaders of 3-D IC technology development, who presented a list of challenges to the TSV ...
Semiconductor International
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February 16, 2010 - Industry News
Phase Transition Research Points to New Devices
Using carbon nanotubes, University of Washington scientists have devised a way to explore how phase transitions function in fewer than three ...
Semiconductor International
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February 11, 2010 - Technology News
TSMC's Chiang Sees History on Side of Gate-Last High-k Approach
TSMC's decision to adopt a gate-last approach to high-k deposition was informed by history, said S.Y. Chiang, in charge of R&D at the foundry. ...
Semiconductor International
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February 9, 2010 - Industry News
Group Opposing 450 mm N.Y. Subsidy
A "Concerned Citizen Group" is opposing any New York State funding for a 450 mm wafer development center at CNSE/Sematech in Albany, N.Y. The ...
Semiconductor International
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February 8, 2010 - Industry News
Applied Korea at Center of IP Theft Case
South Korean prosecutors said Applied Materials Korea staff "extensively" gathered secret Samsung memory chip production technology and passed ...
Semiconductor International
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February 4, 2010 - Industry News
Fan-Out Packaging Dispute Resolves in IP Licensing Deal
What began as a patent dispute over fan-out packaging technologies has resulted in an IP agreement that will ultimately make it easier for ...
Semiconductor International
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February 3, 2010 - Technology News
Crystal Growth Points to Defect-Free Thin Films
Cornell University researchers said colloidal research may lead to the discovery of principles that will enable the growth of defect-free ...
Semiconductor International
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February 1, 2010 - Industry News
TSMC Maintains Top Spot Among Foundries
The overall foundry business declined by 10% last year, matching the overall semiconductor industry's 2009 downsizing, but will storm back ...
Semiconductor International
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January 28, 2010 - Industry News
TI Boosts Spending on Assembly and RFAB
With demand strong for computer power ICs, LED TV backlight controllers and other analog products, Texas Instruments is expanding test and ...
Semiconductor International
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January 26, 2010 - Top Story News
Allvia Offers New TSV Reliability Data
Allvia is stepping forward with details about its full reliability tests, and the data may help customers decide which products are feasible, said ...
Semiconductor International
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January 25, 2010 - Industry News
AMD Constrained on 40 nm GPUs From TSMC
AMD executives said the company is "heavily constrained" now on shipments of its 40 nm graphics processors, made at TSMC. "We are seeing progress ...
Semiconductor International
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January 22, 2010 - Industry News
AMD Constrained on 40 nm GPUs From TSMC
AMD executives said the company is "heavily constrained" now on shipments of its 40 nm graphics processors, made at TSMC. "We are seeing progress ...
Semiconductor International
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January 22, 2010 - Industry News
Nanotech Moves on Toward Better Times
Nanotech is feeling the economic downturn, and much of the venture capital for most nano enterprises has dried up. Nevertheless, there is optimism ...
Semiconductor International
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January 20, 2010 - Industry News
Qualcomm and AMD Lead List of Top 25 Fabless IC Suppliers
Fabless IC companies had a tough year in 2009, IC Insights reported, with only seven of the Top 25 showing revenue growth. Qualcomm, the largest ...
Semiconductor International
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