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High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.




Microliter dispensing made easy with PCD Volumetric dispense valve
PCD TechnologyUnmatched volumetric repeatability at 1microliter volumes. Viscosity from water to thick pastes, the value does not require day to day calibration. PCD controller for worktable or integration to system. Learn more…
GPD Global
  Industry and Technology News Index
February 8, 2010  -  Click the title to read the full article.

ASE sees profit growth in 2009; beats 4Q09 guidance
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported a 9.5% profit growth but a 9.2% revenue drop compared to ...
Digitimes
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More from Digitimes
September 3, 2010 - Industry News
IC backend houses likely to post weaker-than-expected 3Q10 revenues
With Intel and several major IC designers having outlined a conservative outlook, industry watchers now expect most Taiwan-based packaging and ...
Digitimes
September 2, 2010 - Industry News
HP may not see 2010 notebook shipments surpass 40 million units
Due to a strong nosedive in global consumer notebook demand, all the first-tier notebook vendors except Apple, reduced their notebook orders ...
Digitimes
August 31, 2010 - Industry News
Chip sales remain strong despite slowdown worries
Global sales of semiconductors grew in July, up 1.2% from June and 37% from July 2009, according to the Semiconductor Industry Association ...
Digitimes
August 26, 2010 - Industry News
Prices for analog-TV handset chips to continue to fall
Prices of analog TV handset chips are expected to fall below US$1.50 per unit in the near future due to increasing availability of the chip ...
Digitimes
August 25, 2010 - Industry News
Applied Materials claims breakthrough in CVD for advanced chip designs
Applied Materials has unveiled a new chemical vapor deposition (CVD) technology capable of electrically isolating the densely-packed ...
Digitimes
August 25, 2010 - Industry News
Lead time at 8-inch fabs drops to less than two weeks
Lead times at foundries are shrinking, with 8-inch manufacturing falling to less than two weeks compared to over 10 weeks earlier in 2010, according ...
Digitimes
August 24, 2010 - Industry News
Lead time at 8-inch fabs drops to less than two weeks
Lead times at foundries are shrinking, with 8-inch manufacturing falling to less than two weeks compared to over 10 weeks earlier in 2010 ...
Digitimes
August 24, 2010 - Industry News
ASE expects demand to follow seasonal patterns in 4Q10
The fourth quarter of 2010 should not be regarded as a slow quarter without taking into account seasonal factors, the Chinese-language ...
Digitimes
August 24, 2010 - Industry News
Acer chairman expects iPad market share to drop to 20%
In a Chinese-language interview with the Economic Daily News (EDN), JT Wang, chairman of Acer, said that he expects Apple's iPad market share ...
Digitimes
August 24, 2010 - Industry News
More module makers clear NAND flash inventory to channels
A stronger price drop took place at the NAND flash spot market amid inventory clearance among memory module houses. The spot price of 32Gb ...
Digitimes
August 20, 2010 - Industry News
Nearly 139 million digital cameras to be shipped globally in 2010
The 2010 global shipments of digital cameras will increase 7.71% from 2009 to 138.78 million units, according to projection by Digitimes Research ...
Digitimes
August 20, 2010 - Industry News
Orders from China and Japan trigger growth for TSMC, UMC
With more IDMs in Japan going fabless, and development of China's IC design industry rising toward maturity, industry watchers expect both Taiwan ...
Digitimes
August 19, 2010 - Industry News
Orders from China and Japan trigger growth for TSMC, UMC
With more IDMs in Japan going fabless, and development of China's IC design industry rising toward maturity, industry watchers expect both Taiwan ...
Digitimes
August 19, 2010 - Industry News
Japan chip gear book-to-bill climbs to 1.53 in July 2010
Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.53 in July 2010, compared to 1.40 in the prior month ...
Digitimes
August 18, 2010 - Industry News
Chip backend firms to see revenues rebound in August
Chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and testing specialists King Yuan ...
Digitimes
August 17, 2010 - Industry News
Distribution in the age of globalization: Q&A with Avnet's Roy Vallee
Despite the high-tech sounding name of electronics components distributor Avnet, the company was, in fact, originally a family run business ...
Digitimes
August 13, 2010 - Industry News
Intel peak season strategy dampens channel notebook sales
Intel's strategy for the peak season in the third quarter of 2010 is dampening overall notebook sales in the channel, since Intel has ...
Digitimes
August 13, 2010 - Industry News
SMIC denies report it will receive tens of millions from China govt
Semiconductor Manufacturing International Corporation (SMIC) CEO David Wang has denied that the company is close to receiving tens of millions of ...
Digitimes
August 12, 2010 - Industry News
Semiconductor equipment pushouts imminent
The business climate for the semiconductor industry is deteriorating, and pushouts of front-end equipment are forthcoming, according to a recent ...
Digitimes
August 11, 2010 - Industry News
Semiconductor equipment pushouts imminent
The business climate for the semiconductor industry is deteriorating, and pushouts of front-end equipment are forthcoming, according to a recent ...
Digitimes
August 11, 2010 - Industry News
Power management ICs in portable devices represent nearly 40% of total analog IC revenues
The annual unit growth rate for portable devices is estimated at more than 12%, from about two billion in 2008 to over 3.4 billion devices in 2013. ...
Digitimes
August 10, 2010 - Industry News
Notebook makers see shipment drops in July
Taiwan-based notebook makers Quanta Computer and Compal Electronics both saw their shipments drop over 20% on month in July mainly due to lower ...
Digitimes
August 10, 2010 - Industry News
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010, ...
Digitimes
August 9, 2010 - Industry News
Chipbond posts strong 2Q10 results; gives cautious outlook
Packaging and testing house Chipbond Technology has reported better-than-expected revenue and profit results for the second quarter of 2010 ...
Digitimes
August 9, 2010 - Industry News
Chip inventories cast shadow on TSMC and UMC 4Q10 sales
Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) may see their revenues decline 12% ...
Digitimes
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PacTech's Low-Cost Wafer Bumping Services
Quick-turn prototyping and mass-production
PacTech's Low-Cost Wafer Bumping ServicesLow-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more…
PacTech




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