February 6, 2012
Ardy Johnson, Vice President, Rudolph Technologies, Inc.
We are optimistic about the prospects of the industry in 2012. Among other developments, we expect to see substantive progress in the transition to 450 mm wafers. The benefits of larger wafers have been demonstrated over and over again, so the question is not if, but when, and more importantly, who; that is, who will pay the substantial development costs? The cost of moving to 200 mm ...
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February 1, 2012
Frank P. Averdung, President & CEO, SUSS MicroTec AG
2011 was one of the best years ever for SUSS MicroTec. Thriving electronics markets needed additional production capacity for new semiconductor products. SUSS MicroTec, one of the key equipment suppliers for the semiconductor backend, benefited accordingly. SUSS MicroTec could expand its strong market position. We achieved market leader status in three out of our ...
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January 31, 2012
Bruce W. Hueners, President and CEO, Palomar Technologies, Inc.
Looking forward to 2012, the strong foundation from Palomar Technologies’ 2011 performance allows us to stay focused on our customers' increased demand for improved functionality and performance in advanced application and process development. Palomar Technologies has remained on the leading edge of packaging trends, ensuring enhanced device performance with increasing miniaturization ...
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January 26, 2012
Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.
I would expect to see 2012 continue to provide slow growth, as an industry I would predict 2012 to be a year of change. Continued trend to smaller, lighter, longer life portable electronics such as smart phones and tablets with communication to a network system at faster speeds (Cloud, 4G+). Packaging and manufacturing engineers pushing the boundaries with sub 28nm node, low-k ...
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January 25, 2012
James Quinn, Vice President Global Sales & Marketing, Multitest
The semiconductor industry is moving into another year of uncertainty and challenge. In times of uncertainty, companies cope by driving innovation to achieve increased functionality, smaller dimensions, higher integration and less power consumption. "Cost of test", "more than Moore' is nothing new, but will stay in the focus for next year. Today, being a total solution supplier is more ...
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