|
|
|
|
February 8, 2010
Bob Sykes, CTO, XYZTEC
 |
| Bob Sykes, CTO, XYZTEC
|
Although the market was slow in 2009, XYZTEC took the initiative to invest in long term projects, one of them being new products to address green technology, like solar, and semiconductor trends such as 3D and ever reducing geometry!
In addition, we experienced a 30% increase in personnel; not common during a recession. These efforts provide the source of our expectations for 2010.
In November last year and ready for 2010, we launched the EZ bond tester which sets new standards for ease of use. The EZ featuring improved efficiency and accuracy will provide more profitability for our customers.
Our expansion in global distribution and service will enable us to deliver these benefits and an all-round better service.
Throughout 2010 we will continue to invest in our product range responding to new technical challenges that our industry embraces daily.
With many of these developments well underway we are ready for the recovery and anticipate growth in 2010.
Bob Sykes
, CTO
XYZTEC
This page has been viewed 137 times.
|
Click here to see all Viewpoints from
Bob Sykes, CTO, XYZTEC
|
| More Viewpoint Comments |
Index |
|
March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
 Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
|
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
 In all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
|
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
 Driven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
|
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
 2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
|
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
 The ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
|
|
| More Viewpoint Comments |
Index |
|
|
|
