We search for industry news, so you don't need to.   Die Bonding Made Easy Precision X-Form Needles The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design. DL Technology Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map PacTech's Low-Cost Wafer Bumping Services Quick-turn prototyping and mass-production Low-cost electroless Ni/Au UBM, solder stencil or ball attach wafer bumping up to 300mm — Lead-free soldering for flip-chip, WLCSP, Ni/Pd/Au top metal for Au and Cu wire bonding. Learn more… PacTech Ultra Precision Micro Assembly and High Performance Dispensing Unique Benchtop or Cell Systems with flexible design, can be configured to your specific application requirements, learn more… Air-Vac Engineering   Industry and Technology News Index February 8, 2010  -  Click the title to read the full article. Where The Money Is System-Level Design sat down to discuss where the value has shifted in the supply chain with Tom Quan, director at TSMC; Kalar Rajendiran, senior ... Chip Design Magazine We search for industry news, so you don't need to. You would be much better informed if you could read every important article impacting the semiconductor packaging market. But you can't spend all day searching for them. Let us do the searching for you. Get a Free Subscription to Semiconductor Packaging News More from Chip Design Magazine July 19, 2010 - Industry News Semiconductor Equipment Vendor Sees Growth in 32nm and Below Consumer markets are driving the need to high-k metal gate technology, through-silicon vias (TSVs) and advance packaging systems. ... Chip Design Magazine May 6, 2010 - Industry News MEMS Is Poised to Cross the Chasm Microelectromechanical systems (MEMS) are micro-scale or nano-scale devices. Typically, they’re fabricated in a manner similar to integrated ... Chip Design Magazine April 5, 2010 - Industry News EDA Consortium Reports Sequential Fourth Quarter Gains The EDA Consortium Market Statistics Service announced that the Electronic Design Automation industry revenue for Q4 was up 8.1% sequential ... Chip Design Magazine March 26, 2010 - Technology News Field Solvers To The Rescue Field solvers have always been part of the Parasitic Extraction (PEX) world, but due to their long run times and complexity in configuration ... Chip Design Magazine March 26, 2010 - Industry News Experts At The Table: The Promise And Reality Of 3D Design System-Level Design sat down with Glen Daves, director for packaging solutions development at Freescale Semiconductor; Carey Robertson, ... Chip Design Magazine March 11, 2010 - Industry News Power To The People The health of the semiconductor may be heavily influenced by power in the future - the power utility grid, that is, which ultimately connects ... Chip Design Magazine March 10, 2010 - Industry News Bullish Views on Semiconductor Sector in 2010 "The recovery of semiconductor sector is gaining momentum after being able to manage and recover from periods of weak demands. Positive long ... Chip Design Magazine March 1, 2010 - Industry News Expert Shootout: Parasitic Extraction Low-Power Engineering sat down to discuss parasitic extraction with Robert Hoogenstryd, director of marketing for design analysis and ... Chip Design Magazine February 22, 2010 - Technology News The Monolith Syndrome Designing and building semiconductors represents the very best of science and mathematics: physics, geometry, thermal mechanics, Boolean logic, ... Chip Design Magazine February 15, 2010 - Industry News Experts At The Table: Where The Money Is System-Level Design sat down to discuss where the value has shifted in the supply chain with Tom Quan, director at TSMC; Kalar Rajendiran, senior ... Chip Design Magazine February 12, 2010 - Technology News The Growing Problem With Parasitic Extraction Like everything else in semiconductor engineering at advanced process geometries, parasitic extraction is getting much more difficult at ... Chip Design Magazine February 12, 2010 - Technology News Cutting The Power A flurry of activity in the last quarter of 2009 suggests power—and particularly low power—is the major focus of this year’s design starts. ... Chip Design Magazine February 8, 2010 - Industry News Where The Money Is System-Level Design sat down to discuss where the value has shifted in the supply chain with Tom Quan, director at TSMC; Kalar Rajendiran, senior ... Chip Design Magazine February 1, 2010 - Industry News The Trouble With 3D 3D is great when it comes to movies. It's quite another when it involves semiconductor design. For the past several years, large companies have ... Chip Design Magazine January 29, 2010 - Technology News Low-Power And RF Design Heighten Signal-Integrity Concerns As active devices and interconnect wires shrink and are placed closer together with the march of Moore’s Law, signal integrity is becoming a ... Chip Design Magazine January 29, 2010 - Technology News Remaking The Design Landscape Every now and then a new trend comes along in the semiconductor design world, often because an old tool doesn’t work well anymore or because a ... Chip Design Magazine January 25, 2010 - Technology News The Paradigm Shift in Parasitic Extraction In IC design, parasitic extraction is the process by which layout geometries are analyzed and converted to equivalent circuit values for ... Chip Design Magazine January 15, 2010 - Technology News Verifying Low-Power Designs Power islands and multiple voltages used to be reserved for cell phone and process companies, but as more companies move to 65nm and 45nm ... Chip Design Magazine January 15, 2010 - Technology News But For How Long? For anyone versed in the fine art of actually getting a low-power semiconductor to tapeout and into real products, there is a firm ... Chip Design Magazine December 21, 2009 - Technology News Chips on String How would you insert 5 square millimeter chip through a needle? By stretching it into a thin string of 5 square millimeter chips. Well ... Chip Design Magazine December 18, 2009 - Technology News Stacked Dies Gain Attention, But So Far Little Traction For the better part of two decades there has been a steady stream of predictions about the abrupt end of Moore’s Law, but it now appears ... Chip Design Magazine December 18, 2009 - Technology News Moore's Law Will Never End Moore’s Law has been many things to many people. It has been a statement of physical limits and an economic formula. It has been the cause of ... Chip Design Magazine December 14, 2009 - Industry News Chip Revenues Grow, but Software is the Future The headlines look promising for the semiconductor industry. In the latest news, Texas Instruments (TI) and Xilinx are prospering amid a ... Chip Design Magazine December 11, 2009 - Technology News Differentiating Embedded Processors The embedded processor world addresses a vast range of applications – from the datacenter to the biomedical device – all of which have critical ... Chip Design Magazine December 3, 2009 - Technology News Applied Materials Solves Transistor Scaling Challenge Applied Materials Solves Critical Transistor Scaling Challenge with New Millisecond Anneal System. Applied announced its new Applied Vantage® ... Chip Design Magazine To find more articles from Chip Design Magazine, use the search form below. Die attach, flip chip placement, & SMT in one machine The CX-1 placement machine is capable of handling a wide range of components, including SiP and MCM doing the work of two machines, saving capital investment and simplifying operations & maintenance. 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