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February 4, 2010
Ardy Johnson, Vice President of Marketing, Rudolph Technologies, Inc.
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| Ardy Johnson, Vice President of Marketing, Rudolph Technologies, Inc.
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Increased order rates and customer activity in general points to a continuing industry turnaround that we have all been hoping for. The back-end book to bill ratio is now above one, and we are increasingly confident that the industry is entering a sustainable recovery.
There are many new developments on a variety of fronts such as the technology advances driven primarily by demand for more connections in less volume for broadband handheld communications.
One emerging technology, eWLB (embedded wafer-level ball grid array) is driven primarily by the wireless market. These IC packages are thinner and smaller with higher I/O, which tend to be lower in cost, higher performance and more power efficient than many of the existing packaging solutions.
Our award of multiple inspection system orders in the fourth quarter of 2009 to support eWLB processes is just one example of how we intend to help our customer to ensure eWLB is competitive with other packaging solutions available on the market.
Our continued investment in R&D during the slowdown is definitely playing forward. Equipment manufacturers that have the solutions ready now for the unique requirements of many new processes can expect to see increasing interest as manufacturers bring them into high-volume production.
Ardy Johnson
, Vice President of Marketing
Rudolph Technologies, Inc.
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February 1, 2012
Frank P. Averdung, President & CEO, SUSS MicroTec AG
2011 was one of the best years ever for SUSS MicroTec. Thriving electronics markets needed additional production capacity for new semiconductor products. SUSS MicroTec, one of the key equipment suppliers for the semiconductor backend, benefited accordingly. SUSS MicroTec could expand its strong market position. We achieved market leader status in three out of our ...
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January 31, 2012
Bruce W. Hueners, President and CEO, Palomar Technologies, Inc.
Looking forward to 2012, the strong foundation from Palomar Technologies’ 2011 performance allows us to stay focused on our customers' increased demand for improved functionality and performance in advanced application and process development. Palomar Technologies has remained on the leading edge of packaging trends, ensuring enhanced device performance with increasing miniaturization ...
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January 26, 2012
Brian Schmaltz, Western Area Sales Manager, NAMICS Technologies Inc.
I would expect to see 2012 continue to provide slow growth, as an industry I would predict 2012 to be a year of change. Continued trend to smaller, lighter, longer life portable electronics such as smart phones and tablets with communication to a network system at faster speeds (Cloud, 4G+). Packaging and manufacturing engineers pushing the boundaries with sub 28nm node, low-k ...
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January 25, 2012
James Quinn, Vice President Global Sales & Marketing, Multitest
The semiconductor industry is moving into another year of uncertainty and challenge. In times of uncertainty, companies cope by driving innovation to achieve increased functionality, smaller dimensions, higher integration and less power consumption. "Cost of test", "more than Moore' is nothing new, but will stay in the focus for next year. Today, being a total solution supplier is more ...
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January 24, 2012
Bryan Ekus, Managing Director, IPVEA
In the photovoltaic equipment market, we very are optimistic about 2011.This is in part due to conversations with my industry colleagues that they have orders, as well as the industry’s expansion into new technological territories with improved efficiencies along with innovative ways to lower costs. The industry as a whole is recapturing momentum from a difficult period and our ...
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