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February 4, 2010
Ardy Johnson, Vice President of Marketing, Rudolph Technologies, Inc.
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| Ardy Johnson, Vice President of Marketing, Rudolph Technologies, Inc.
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Increased order rates and customer activity in general points to a continuing industry turnaround that we have all been hoping for. The back-end book to bill ratio is now above one, and we are increasingly confident that the industry is entering a sustainable recovery.
There are many new developments on a variety of fronts such as the technology advances driven primarily by demand for more connections in less volume for broadband handheld communications.
One emerging technology, eWLB (embedded wafer-level ball grid array) is driven primarily by the wireless market. These IC packages are thinner and smaller with higher I/O, which tend to be lower in cost, higher performance and more power efficient than many of the existing packaging solutions.
Our award of multiple inspection system orders in the fourth quarter of 2009 to support eWLB processes is just one example of how we intend to help our customer to ensure eWLB is competitive with other packaging solutions available on the market.
Our continued investment in R&D during the slowdown is definitely playing forward. Equipment manufacturers that have the solutions ready now for the unique requirements of many new processes can expect to see increasing interest as manufacturers bring them into high-volume production.
Ardy Johnson
, Vice President of Marketing
Rudolph Technologies, Inc.
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March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
 Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
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February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
 In all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
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February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
 Driven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
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February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
 2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
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February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
 The ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
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