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  White paper on die attach
Going Beyond Bulk Properties:
Full Wafer Die Attach White PaperEver wondered what's really going on with Die Attach thermal performance? Henkel unlocks the mystery…
Henkel Corporation
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Graphite Conductive Epoxy
Provides Non-metallic EMI/RFI Shielding
Graphite Conductive EpoxyEP75-1 is a two part, graphite filled epoxy for use in specialty EMI/RFI shielding applications. Non-metallic filler is useful in applications where the magnetic properties are undesirable. Learn more…
Master Bond




All-surface Inspection for
3D interconnects & TSV Manufacturing
Inspection Technology White PaperWhite paper demonstrates in-line, automated inspection during 3D interconnect manufacturing showing that defects are captured. Paper draws important parallels between the challenges shared by 3D interconnects manufacturing and wafer level chip scale packaging…
Rudolph Technologies, Inc.
Viewpoint Index
February 3, 2010

Dr. Farhad Farassat, President and CEO, F&K Delvotec Bondtechnik

image
Dr. Farhad Farassat, President and CEO, F&K Delvotec Bondtechnik
Having emerged from a year which made even the abysmal period after 2000 look good by comparison, everybody in the industry is understandably cautious for the coming year.

One of the trends we see firming up is the continued rise of power electronics. Regulating power instead of just switching it on or off is still attractive in a huge number of industrial, consumer and automotive applications.

With the added appeal that energy savings will translate into cost savings ever larger the more the economy recovers, simply because with the recovery energy will become more expensive again.

An extra push in this area comes from solar and wind energy which need sophisticated controllers to deliver constant output voltage.

At F&K Delvotec, our response to this market need has been to intensify development of wire bonders suitable for all kinds of power devices.

Using the field-proven fifth-generation bond heads, we have introduced a double-headed machine on a single base which reduces both cost and footprint further, while increasing bonding speed without any loss of bonding quality. 

The benefit to the user is increased productivity at lower cost which is precisely what markets especially in the Far East are demanding for their high-volume products. So far, our order book proves us right - and we are robustly optimistic for 2010.

Dr. Farhad Farassat , President and CEO,
F&K Delvotec Bondtechnik

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Dr. Farhad Farassat, President and CEO, F&K Delvotec Bondtechnik


More Viewpoint Comments Index
March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
More Viewpoint Comments Index


Better Reflectivity Control
with ShinEtsu GBARC
GBARCShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more…
ShinEtsu




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