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February 1, 2010
Dayton Bishop, Stratus Vision
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| Dayton Bishop, Sales for Hong Kong, Japan and Korea, Stratus Vision
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Stratus Vision expects a good year where smaller structures on larger substrates with increasing requirements demand the unique abilities of powerful AOI systems.
Stratus new thin film inspection systems have been delivered inspecting substrates up to 600mm x 600mm with resolutions down to 2.5µm.
The Stratus advantage:
- Image acquisition
The patented AOI uses multiple lighting from UV to IR allowing Stratus to inspect metal and organic print on glass, ceramic, polymer and even metals in any combination.
- Image processing
Unique inspection algorithms established in the sophisticated image processing software delivers repeatable results for finding production errors.
Other inspection solutions by Stratus (inline or offline):
- Screen inspection (Screen defects, coating and aging inspection)
- Wet print inspection ( Shorts, opens, …)
- Plating and Lithography inspection
- Final inspection and measurements for
- Defects (shorts, cuts, etc)
- Shrinkage and print shifts
- Contamination, cracks, etc
The success of the Stratus is based in their deep understanding of production process, patented lighting scenarios and software algorithms that analyze captured images, compare all to CAD Data and deliver all relevant defect information. Any desired degree of automation and integration in any host system, as well as review stations, available.
Dayton Bishop
Stratus Vision
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March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
 Throughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
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February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
 In all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
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February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
 Driven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
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February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
 2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
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February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
 The ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
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