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Precision X-Form Needles
Die Bonding Made EasyThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
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White paper on die attach
Going Beyond Bulk Properties:
Full Wafer Die Attach White PaperEver wondered what's really going on with Die Attach thermal performance? Henkel unlocks the mystery…
Henkel Corporation




All-surface Inspection for
3D interconnects & TSV Manufacturing
Inspection Technology White PaperWhite paper demonstrates in-line, automated inspection during 3D interconnect manufacturing showing that defects are captured. Paper draws important parallels between the challenges shared by 3D interconnects manufacturing and wafer level chip scale packaging…
Rudolph Technologies, Inc.
Viewpoint Index
January 28, 2010

Craig C. Ramsey, Ph.D., General Manager, CyberOptics Semiconductor, Inc.

image
Craig C. Ramsey, Ph.D., General Manager, CyberOptics Semiconductor, Inc.
In 2010, both the economy and chip demand will be driven by various forces: growth of the smartphone and netbook markets; adoption of Windows 7; growth in the display market and the emerging markets for alternative energy and hybrid vehicles.

At a time when manufacturers face margin pressure, shrinking tolerances and reduced infrastructure, we'll see our industry leverage the recovering demand and employ technologies that directly raise production and yield.

The widespread closure of fabs and staff reductions that occurred last year will heighten demand for suppliers that enable more reliable and faster automation and more robust and reproducible process control.

For our part in 2009, as in previous down cycles, we maintained our technology development initiatives. We expanded our WaferSense product line by developing a sensor for airborne particles and software that reduces the end-user skills needed to solve vibration-related yield loss and downtime.

We also sampled 450 mm wafer-like sensors to support the industry's push for enhanced productivity in the next-generation fab through ISMI's 450 mm program.

As the majority of consumers, who never lost their jobs, start to spend again and optimism supplants fear, let's -- as an industry -- move forward in 2010!

Craig C. Ramsey, Ph.D. , General Manager
CyberOptics Semiconductor, Inc.

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Craig C. Ramsey, Ph.D., General Manager, CyberOptics Semiconductor, Inc.


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March 2, 2010
Karl-Heinz Strass, Managing Director, cyberTECHNOLOGIES USA, LLC
imageThroughout the end of 2009 we saw a strong increase in business activities, and this trend has been continuing into 2010. Different sectors of the industry are recovering at a different pace, but the overall trend is quite positive. In order to remain competitive and at the leading edge, companies continue to focus on developing new technologies and improving capabilities. cyberTECHNOLOGIES continued to invest ...
February 25, 2010
Mark Brawley, National Sales Manager Americas, DEK
imageIn all DEK's market sectors, the actions needed to prepare for 2010, and the much anticipated upturn, were taken in 2009. Principally these included improving lines of communication with customers and channel responsiveness. We know from experience that agility is essential in an upturn. Manufacturers tend to ramp up much faster than they scaled down. Sure, we pursue key product developments in the meantime to address current and emerging semiconductor ...
February 24, 2010
Michel Villemain, Ph.D., Founder and CEO, Presto Engineering
imageDriven by the rebounding world economies and ongoing improvements in semiconductor technology, our industry will see both great opportunities and significant challenges in the year ahead. Suppliers participating in the value chain will face key decisions. For example, how will they increase domain-specific expertise — especially in the areas of CSP, system-in-package (SiP) and 3D through-silicon via (TSV) technology — to meet the ...
February 23, 2010
Daniel F. Baldwin, Ph.D., Founder, Engent
image2010 promises to be a strong year with respect to next generation packaging solutions for small form factor electronics systems as a result of prior years development efforts. With the improving economy, semiconductor companies are showing positive returns and are beginning to turn on the capital funding faucet once again. Military and Homeland Defense ...
February 22, 2010
Markus Wilkens, President, ASYS Group Americas, Inc.
imageThe ASYS Group Americas moves into 2010 in a position of strength. Throughout the global recession our Drive to Innovate continued and our market diversification allowed us to ride out the downturn. We continued to develop technologies across the SMT, Semi-Packaging, Hybrid, and Solar markets that increase our customer’s production capabilities. The last ...
More Viewpoint Comments Index


F&K Delvotec introduces
Automated Pull and Shear Tester
Bonding & TestingF&K Delvotec's Desk Top Micro-Factory has been enhanced. Using a New Camera system on the Pull/Shear test head we introduce Model 5600C. A fully automatic pull & shear test machine w/ pattern recognition. You can convert to an auto wire-bonder in 3 minutes? Learn more…
F&K Delvotec




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