Kuala Lumpur, Malaysia – Unisem Advanced Technologies (UAT), a leading provider of wafer bumping technologies, today announced that it has developed a methodology for creating a stress buffer to protect delicate features of semiconductor devices.

This customizable stress buffer structure includes a polymer layer formed by one or multiple coatings, and a metal stack overlaying the polymer. The structure serves as a bunker to protect sensitive devices within its coverage from external stress. Its use may extend beyond stress mitigation, including shielding of sensitive devices from lights, moisture and electromagnetic interferences.

UAT’s manufacturing capabilities for patterning fine dimension features are perfectly suited for creating unique patterns of stress buffer structures for each device. UAT has a patent pending on this unique process.

“Conventional semiconductor packages offer little or no additional protection to sensitive device features” said S.C. Lau, general manager of UAT. “We are excited about the unique solution we have created to help our customers protect these features in a way that is highly effective and cost efficient”, continued Lau.