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  Lead-Free package level alloys
New White Paper
Full Wafer Die Attach White PaperNot all SAC alloys are created equal: Especially when attempting to use board-level recommended SAC alloys for package-level applications. A new breakthrough package level lead-free alloy addresses board-level alloy challenges. Click to download paper…
Henkel Corporation
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Semicon West:
Infinite Possibilities
Semicon EuropaImportant decisions on the future of microelectronics will be made at SEMICON West this July. Don't watch from the sidelines—get in the action. Plan now to be at SEMICON West 2009! Learn more…
SEMI




Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
  Corporate News Index
January 26, 2010  -  Click the title to read the full article.

Major step towards low-power all-optical switching for optical communications
The January issue of the premier scientific magazine Nature Photonics publishes an ultra-small and fast, electrically pumped all-optical ...
IMEC

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More from IMEC
March 11, 2010
Imec and Synopsys Collaborate on 3D Stacked IC Development
Synopsys, Inc. and imec announced they have entered into a collaboration to use Synopsys TCAD finite-element method tools for characterizing and ...
Imec
March 9, 2010
Imec and Altos collaborate on chip design and prototyping service
Imec and Altos Design Automation, Inc. announce that they have entered into an agreement to set up a library re-characterization service based ...
Imec
February 18, 2010
Record number of papers at SPIE reports imec's progress in advanced lithography
At next week's SPIE Advanced Lithography Conference being held February 22 - 26 in San Jose, California, imec technologists will contribute a ...
imec
February 17, 2010
Imec, Renesas and M4S report a single-chip reconfigurable multi-standard wireless transceiver in 40nm CMOS
At the International Solid State Circuit Conference, imec and its research partners Renesas Technology Corp. and M4S present a complete ...
Imec
February 16, 2010
Imec and Holst Centre present ADC with record figure of merit
At the International Solid State Circuit Conference, imec and Holst Centre report an ultra-low power 8 bit analog to digital convertor (ADC) ...
Imec and Holst Centre
February 12, 2010
Holst Centre, imec, TNO record performance of dual-gate organic TFT-based RFID circuit
At the International Solid State Circuit Conference (ISSCC), Holst Centre, imec and TNO present a dual-gate-based organic RFID chip with ...
Holst Centre, imec and TNO
February 11, 2010
Imec and Holst Centre achieve breakthrough in battery-less radios
Atthe International Solid State Circuit Conference, imec and Holst Centre report a 2.4GHz/915MHz wake-up receiver which consumes only 51µW power ...
Imec and Holst Centre
February 10, 2010
Imec and Holst Centre report ultra-low power heart activity signal processor
Leuven – At the International Solid State Circuit Conference, imec and Holst Centre report an analog-signal processor ASIC – in short ASP ...
Imec and Holst Centre
February 8, 2010
Imec and Holst Centre present at Int'l Solid State Circuit Conference
At the International Solid State Circuit Conference, imec and Holst Centre present their newest breakthroughs in ultra-low power design for ...
Imec and Holst Centre
January 26, 2010
Major step towards low-power all-optical switching for optical communications
The January issue of the premier scientific magazine Nature Photonics publishes an ultra-small and fast, electrically pumped all-optical ...
IMEC
January 11, 2010
IMEC joins consortium to radically reduce energy consumption of communication networks
IMEC announces that it will take part in the Green Touch Initiative, a new consortium initiated by Bell Labs, the research arm of Alcatel-Lucent ...
IMEC
December 14, 2009
Holst Centre, IMEC, TNO report a plastic transponder circuit
At the International Electronics Devices Meeting, Holst Centre, imec and TNO presented the world-first organic transponder circuit with a bit ...
IMEC
December 11, 2009
Piezoelectric Harvester Drives Wireless Sensor
For the first time, a piezoelectric harvesting device fabricated by MEMS technology generates a record of 85ìW electrical power from vibrations ...
IMEC
December 9, 2009
Imec presents new GaN-on-Si architecture
imec presents an innovative, simple and robust GaN-on-Si double heterostructure FET (field effect transistor) architecture for GaN-on-Si ...
IMEC
November 20, 2009
K.U.Leuven and IMEC honour Willem P. Roelandts
On 24 November, Rector Mark Waer will confer the degree of doctor honoris causa on Willem P. Roelandts. Willem P. Roelandts is the former chair ...
IMEC
November 19, 2009
IMEC, Hasselt Univ, Artist Screen launch new spin-off
The nanoelectronics research center IMEC, Hasselt University and the Belgian screen printing company Artist Screen announce the start of ...
IMEC
November 10, 2009
IMEC's Micronail Makes Electronics and Bio Cells Communicate
IMEC presents a unique microchip with microscopic nail structures that enable close communication between the electronics and biological ...
IMEC
October 21, 2009
Terepac, IMEC join forces in low-cost flexible electronics packaging
Terepac Corporation and IMEC announce their collaboration on novel packaging technologies for flexible electronics. The initial driver for ...
IMEC
October 15, 2009
IMEC’s multi-threaded ADRES processor architecture ready for licensing
IMEC unveils the second generation of its ADRES processor architecture. ADRES now supports multithreading, and has doubled its performance and ...
IMEC
October 14, 2009
TSMC and IMEC join forces to bring novel technology solutions to emerging markets
IMEC and TSMC announce that they have forged an Innovation Incubation Alliance to create a platform enabling the development of innovative ...
IMEC
October 13, 2009
IMEC Breakthrough in lab-on-chip for fast cancer detection, therapy
IMEC, the Institüt für Mikrotechnik Mainz (IMM), and their partners within the European Sixth Framework Project MASCOT achieve a major milestone ...
IMEC
October 12, 2009
IMEC and ANSEM launch design service to bring innovative radio chips to the market
IMEC and ANSEM announce a collaboration to offer services for the customized design of radio ICs for wireless communication applications ...
IMEC
October 9, 2009
IMEC launches industrial affiliation program on designing with emerging technologies
IMEC launches the industrial affiliation program (IIAP) INSITE or Integrated Solutions for Technology Exploration. INSITE is a framework ...
IMEC
October 8, 2009
IMEC and BP Solar demonstrate high-efficiency low-cost silicon solar cell
IMEC and BP Solar demonstrated a 18% conversion efficiency for silicon solar cells made of BP Solar’s newly developed Mono2 TM silicon. By ...
IMEC
October 7, 2009
IMEC's spray-coating technique holds promise for cheap fully solution-processed organic solar cells
IMEC has demonstrated a fully solution-processed organic solar cell with a spray-coated active layer and a metal top contact spray-coated on ...
IMEC
To find more corporate news releases from IMEC, use the search form below.


Webcast: Silicon Interposers with
TSVs and Thin-Film Capacitors
First Through-Silicon Via FoundryThe evolution of silicon interposers without Through Silicon Vias (TSVs) to interposers with TSVs. Webcast on March 17, will discuss mechanical benefits of attaching ICs to silicon and electrical benefits of passive and active elements including Implementation & reliability data. Learn more…
ALLVIA, Inc.




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