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  Micro Dispensing Technology
Technical white paper
imageThe trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper…
DL Technology
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Microelectronics & Semiconductor Package
AOI with Flexible Material Handling
Machine Vision ProductsMVP's Ultra 850G platform provides 2D & 3D metrology capabilities for backend semiconductor & microelectronics devices to 1µm resolution. Tray, Strip, In-Line, Magazine and custom handling solutions are available for any module or package style. Learn more…
Machine Vision Products, Inc.




F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec
  Corporate News Index
January 26, 2010  -  Click the title to read the full article.

R&D Circuits Adds 2nd Shift to their Assembly Operation
R&D Circuits has announced that it is adding a 2nd shift to its assembly operation, which is expected to be fully staffed and operational in ...
R&D Circuits

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More from R&D Circuits
September 2, 2010
Nordson ASYMTEK Introduces New Spectrum S-920N-C Stainless Steel Cleanroom Dispenser
Nordson ASYMTEK introduces its S-920N-C stainless steel dispensing system that is third-party certified for Class 100 cleanroom use. It is ...
Nordson ASYMTEK
September 2, 2010
Samsung Unveils 16GB 'Very Low Profile' Module in IBM's Blade Server
Samsung Electronics Co., Ltd. announced it will demonstrate for the first time a 16-Gigabyte (GB), very low profile (VLP) memory module at the ...
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September 2, 2010
SUSS MicroTec Appoints New VP R&D
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as Vice President R&D and CTO. In this function Reiner Knippelmeyer will oversee research ...
SUSS MicroTec
September 1, 2010
Moog Acquires isel Robotik USA, LLC
Moog Industrial Group has acquired Fremont, Calif.-based isel Robotik USA, LLC in order to add vacuum and atmospheric robots to Moog's wafer ...
Moog Industrial Group
September 1, 2010
AVX Expands MLCC Family to Include Gold Plated Terminations
AVX Corporation has expanded its extensive family of multilayer ceramic chips (MLCCs) to include gold plated terminations. Designated the Au ...
AVX Corporation
September 1, 2010
Microscreen Adds Second Exposure Room for Thick Film Screens
To accommodate the continued growth of our thick film screen business and to provide quick response to critical customer requirements, MicroScreen ...
Microscreen
August 31, 2010
Bentek Solar Launches Its CTO Solar Re-Combiner Configurator
Bentek Solar recently launched the new Bentek Solar Re-Combiner Configure-To-Order (CTO) Configurator. “The Bentek Solar CTO Re-Combiner ...
Bentek Solar
August 30, 2010
Join Amkor Technology, Inc. at Global Technology Conference
GLOBALFOUNDRIES will be hosting the first annual Global Technology Conference at the Santa Clara Convention Center. In addition to ...
Amkor Technology, Inc.
August 30, 2010
Applied Materials Enables Advanced Microchip Designs
Applied Materials, Inc. announced its breakthrough Applied Producer® Eterna™ FCVD™ (Flowable CVD1) system, the first and only film deposition ...
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August 27, 2010
ECT's CPG To Showcase The Zip® Family At Semicon Taiwan
Everett Charles Technologies (ECT) Contact Products Group (CPG) will showcase the latest new additions to its ZIP® family of "flat" ...
Everett Charles Technologies
August 27, 2010
Carsem Continues to Aggressively Expand MLP (QFN) Capacity
Carsem announced that they are continuing to aggressively expand their MLP (QFN) manufacturing capacity in both their Ipoh, Malaysia and Suzhou ...
Carsem
August 26, 2010
The State of the Industry
The Great Recession which began in the fourth quarter of 2008, at the height of the holiday spending season, had an enormous effect on ...
New Venture Research
August 26, 2010
Semi Industry Veterans Launch Boston Semi Equipment Group
Designed to deliver a unique combination of equipment expertise and innovative financial solutions to the semiconductor industry, senior ...
Boston Semi Equipment Group, LLC
August 26, 2010
Torrey Hills Tech. Receives CE Marking Approval For Its Furnaces
Torrey Hills Technologies, LLC announced today that it has received CE marking certification for its HSK, HSA, HSH, HSG, and HSF series ...
Torrey Hills Technologies, LLC
August 25, 2010
New Report on IC Packaging
The semiconductor industry has been cyclical since its inception, but the general trend for the industry is upwards. The newly released report ...
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August 25, 2010
IPVEA to Premier Tool to Connect Solar Supply Chain at EU PVSEC
International PV Equipment Association (IPVEA) announces that it will demonstrate the PV Matrix, an innovative new solar supply chain tool ...
International PV Equipment Association
August 24, 2010
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August 23, 2010
Solar Cell Production Capacity Reaching 51% at Year End
A massive increase in solar production with anticipated sales increasing more than 100% in 2010 is depleting inventory at a rapid rate ...
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August 20, 2010
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Xradia
August 20, 2010
JPSA Succeeds in Invalidating QMC’s Korean Scribing, LLO Patents
JP Sercel Associates, Inc. (JPSA) announced that the Korean Intellectual Property Tribunal ruled in favor of claimant JPSA, invalidating two ...
JP Sercel Associates, Inc.
August 20, 2010
Applied to Announce Breakthrough Technology for Chip Mfg
Applied Materials, Inc. will announce a significant innovation in chip manufacturing technology to enable its customers to overcome one of the ...
Applied Materials
August 19, 2010
IPVEA to Premier New Tool to Connect the Solar Supply Chain at EU PVSEC
The International PV Equipment Association (IPVEA) announces that it will demonstrate the PV Matrix, an innovative new solar supply chain tool, in ...
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August 19, 2010
Intel, Micron First to Sample 3-Bit-Per-Cell NAND Flash Memory
Intel Corporation and Micron Technology Inc. announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process ...
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August 18, 2010
Orthodyne Announces Shipment of First 7600HD Automatic Wedge Bonder System
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August 18, 2010
Bentek Solar Announces 1st Orders for Integrated Disconnect Combiners
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To find more corporate news releases from R&D Circuits, use the search form below.


Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK




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