We search for industry news, so you don't need to.
  mBGA Flux deposition
with ultrasonic coating technology
mBGAUSI's Prism system delivers high speed flux coating with ultrasonic technology providing more precise uniform coatings than stamping, dipping, jetting or dispensing technology. Learn more...
Ultrasonic Systems, Inc.
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map

Down to 2 µm Automated Optical Inspection
The REVEAL IMAGER Series
5K/7K SeriesProvide solutions for CMOS Image Sensors inspection in Back-End of the Line environments allow to decrease Camera Modules assembly costs with flexible and automated equipment, in- or off-line before lens module attachment. Learn more…
Vi TECHNOLOGY




Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.
  Corporate News Index
September 25, 2009

USB powered multi-port serial modules ease connectivity between legacy ‘RS’ interfaces and USB 2.0 Hi-Speed ports

These modules will be on show at

ESC Boston – September 21 – 23 Booth 621, and

ESC UK – 6 – 8th October – Stand 330

Glasgow, Scotland – Future Technology Devices International Limited (FTDI) today announced the availability of multi-port variants of its USB powered USB-COM-PLUS family of communication modules. Complementing the previously released single port USB-COM232-PLUS1 module, these new modules are available in RS232 (EIA-232), RS422 (EIA-422) or RS485 (EIA-485) versions. The USB-COM232 modules provide either dual or quad port options*1. The USB-COM422 and USB-COM485 modules*2 provide dual port capability for the RS422 differential and RS485 multipoint differential interfaces. Single port versions of these interface modules are also available*3.

All multi-port modules feature a USB 2.0 Hi-Speed (480 Mb/s) interface and are powered from the USB port, saving the need for an additional external power adapter and associated costs. PCB mounted LEDs provide indication of USB enumeration, RxD and TxD signals. The complete USB protocol and all level shifting is handled by the modules without the need for any application software modifications. In addition, royalty-free WHQL approved drivers are available for all popular operating system platforms, further aiding installation and deployment.

The USB-COM485 family also feature a + 5V output that can provide up to 250mA. This can be used to supply interface logic of customer-attached equipment.

The dual and quad port modules utilise FTDI’s FT2232H and FT4232H ICs*4. These 480 Mb/s USB2.0 Hi-Speed devices are configured as asynchronous serial interfaces together with an appropriate level shifter circuit.

The whole range of modules can operate from -40 degrees C to +85 degrees C and are CE/FCC approved.

The modules range in price from $19 to $60 for single unit orders.
+++ends

Editor notes

1 Product codes USB-COM232-PLUS2 and USB-COM232-PLUS4

2 Product codes USB-COM422-PLUS2 and USB-COM485-PLUS2

3 These modules feature a USB 2.0 Full Speed 12Mb/s interface. Productcodes USB-COM422-PLUS1 and USB-COM4285-PLUS1.

4 Further information on the FT2232H and FT4232H devices can be found at http://www.ftdichip.com/FTProducts.htm

Contact:
Future Technology Devices International Limited

Russ Paine
http://www.ftdichip.com/

This page has been viewed 165 times.
We search for industry news, so you don't need to.
You would be much better informed if you could read every
important article impacting the semiconductor packaging
market. But you can't spend all day searching for them.


Let us do the searching for you.

Get a Free Subscription to Semiconductor Packaging News

More from Future Technology Devices International Limited
September 25, 2009
USB powered multi-port serial modules ease connectivity between legacy ‘RS’ interfaces and USB 2.0 Hi-Speed ports
Future Technology Devices International Limited (FTDI) announced the availability of multi-port variants of its USB powered USB-COM-PLUS ...
Future Technology Devices International Limited
To find more corporate news releases from Future Technology Devices International Limited, use the search form below.


Online Auction of Qimonda Portugal Back-End Equipment
PCD TechnologyA large selection of Wafer Testers, Dicers, Die & Wire Bonders, Burn-in Ovens and more will be sold by Online Auction closing 04 August 2010 from Europe's largest Memory Chips Assembly & Test facility. Bid now…
GoIndustry DoveBid




Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.